SBVS322A October   2017  – December 2017 TLV757P

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout (UVLO)
      2. 7.3.2 Enable (EN)
      3. 7.3.3 Internal Foldback Current Limit
      4. 7.3.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input and Output Capacitor Selection
      2. 8.1.2 Dropout Voltage
      3. 8.1.3 Exiting Dropout
      4. 8.1.4 Reverse Current
      5. 8.1.5 Power Dissipation (PD)
        1. 8.1.5.1 Estimating Junction Temperature
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Current
        2. 8.2.2.2 Thermal Dissipation
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
  • DRV|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Input Voltage Range: 1.45 V to 5.5 V
  • Available in Fixed-Output Voltages:
    • 0.6 V to 5 V (50-mV Steps)
  • Low IQ: 25 µA (Typical)
  • Low Dropout:
    • 425 mV (Maximum) at 1 A (3.3 VOUT)
  • Output Accuracy: 1% (Maximum)
  • Built-In Soft-Start With Monotonic VOUT Rise
  • Foldback Current Limit
  • Active Output Discharge
  • High PSRR: 45 dB at 100 kHz
  • Stable With a 1-µF Ceramic Output Capacitor
  • Packages:
    • SOT-23-5 (Preview)
    • 2 mm × 2 mm (WSON-6)

2 Applications

  • Set Top Boxes, TV, and Gaming Consoles
  • Portable and Battery-Powered Equipment
  • Desktop, Notebooks, and Ultrabooks
  • Tablets and Remote Controls
  • White Goods and Appliances
  • Grid Infrastructure and Protection Relays
  • Camera Modules and Image Sensors

3 Description

The TLV757P low-dropout regulator (LDO) is an ultra-small, low quiescent current LDO that sources 1 A with good line and load transient performance. The TLV757P is optimized for wide variety of applications by supporting an input voltage range from 1.45 V to 5.5 V. To minimize cost and solution size, the device is offered in fixed output voltages ranging from 0.6 V to 5 V to support the lower core voltages of modern MCUs. Additionally, the TLV757P has a low IQ with enable functionality to minimize standby power. This device features an internal soft-start to lower the inrush current which provides a controlled voltage to the load and minimizes the input voltage drop during start up. When shutdown, the device actively pulls down the output to quickly discharge the outputs and ensure a known start-up state.

The TLV757P is stable with small ceramic output capacitors allowing for a small overall solution size. A precision band-gap and error amplifier provides a typical accuracy of 1%. All device versions have integrated thermal shutdown, current limit, and undervoltage lockout (UVLO). The TLV757P has an internal foldback current limit that helps to reduce the thermal dissipation during short circuit events.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TLV757P SON (6) 2.00 mm × 2.00 mm
SOT-23 (5) (Preview) 2.90 mm × 1.60 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Typical Application

TLV757P front_page_SBVS322.gif

Startup Waveform

TLV757P tc_enStartup_100mA.gif