SBOS980B May   2019  – March 2021 TLV9002-Q1 , TLV9004-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information for Dual Channel
    5. 7.5 Thermal Information for Quad Channel
    6. 7.6 Electrical Characteristics
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Voltage
      2. 8.3.2 Rail-to-Rail Input
      3. 8.3.3 Rail-to-Rail Output
      4. 8.3.4 Overload Recovery
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 TLV900x-Q1 Low-Side, Current Sensing Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Single-Supply Photodiode Amplifier
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Input and ESD Protection
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from Revision A (June 2020) to Revision B (March 2021)

  • Updated the numbering format for tables, figures and cross-references throughout the documentGo
  • Functional Safety-Capable document link added in the Features sectionGo
  • Deleted preview tag for VSSOP (8) from Device information sectionGo
  • Added note 4 to differential input voltage in Absolute Maximum Ratings table Go
  • Added Thermal Information for DGK packageGo
  • Added Thermal Information for DYY packageGo

Changes from Revision * (May 2019) to Revision A (June 2020)

  • Changed the device status from Advance Information to Production Data Go
  • Added end equipment links in Application section Go
  • Deleted preview tag for SOIC (8) from Device information sectionGo
  • Added SOT-23 (14) in Device Information section Go
  • Deleted preview tag for SOIC (14) from Device information sectionGo
  • Added SOT-23 (DYY) package in Device Comparison Table section Go
  • Added DYY (SOT-23) in Pin Functions: TLV9004-Q1 section Go