SBOS980E may   2019  – april 2023 TLV9001-Q1 , TLV9002-Q1 , TLV9004-Q1

PRODMIX  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information for Single Channel
    5. 7.5 Thermal Information for Dual Channel
    6. 7.6 Thermal Information for Quad Channel
    7. 7.7 Electrical Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Voltage
      2. 8.3.2 Rail-to-Rail Input
      3. 8.3.3 Rail-to-Rail Output
      4. 8.3.4 Overload Recovery
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 TLV900x-Q1 Low-Side, Current Sensing Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Single-Supply Photodiode Amplifier
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Input and ESD Protection
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision D (November 2022) to Revision E (April 2023)

  • Changed the status of the DBV package from: preview to: active Go

Changes from Revision C (October 2021) to Revision D (December 2022)

  • Deleted preview tag for SC70 (5) from Device information sectionGo
  • Changed formatting of Pin Configuration and Functions section Go
  • Added Thermal Information for Single Channel DCK packageGo

Changes from Revision B (March 2021) to Revision C (October 2021)

  • Deleted preview tag for SOT-23 (14) and TSSOP (14) from Device information sectionGo
  • Added preview tags for TLV9001-Q1 SOT-23 (5) and SC70 (5) packages to Device information sectionGo
  • Added TLV9001-Q1 GPN to the data sheetGo
  • Added TLV9001-Q1 to Device Comparison Table section Go
  • Added TLV9001-Q1 DBV (SOT-23) and DCK (SC70) in Pin Configuration and Functions section Go

Changes from Revision A (June 2020) to Revision B (March 2021)

  • Changed the numbering format for tables, figures and cross-references throughout the documentGo
  • Added Functional Safety-Capable document link in the Features sectionGo
  • Deleted preview tag for VSSOP (8) from Device information sectionGo
  • Added note 4 to differential input voltage in Absolute Maximum Ratings table Go
  • Added Thermal Information for DGK packageGo
  • Added Thermal Information for DYY packageGo

Changes from Revision * (May 2019) to Revision A (June 2020)

  • Changed the device status from Advance Information to Production Data Go
  • Added end equipment links in Application section Go
  • Deleted preview tag for SOIC (8) from Device information sectionGo
  • Added SOT-23 (14) in Device Information section Go
  • Deleted preview tag for SOIC (14) from Device information sectionGo
  • Added SOT-23 (DYY) package in Device Comparison Table section Go
  • Added DYY (SOT-23) in Pin Functions: TLV9004-Q1 section Go