SBOS980B May   2019  – March 2021 TLV9002-Q1 , TLV9004-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information for Dual Channel
    5. 7.5 Thermal Information for Quad Channel
    6. 7.6 Electrical Characteristics
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Voltage
      2. 8.3.2 Rail-to-Rail Input
      3. 8.3.3 Rail-to-Rail Output
      4. 8.3.4 Overload Recovery
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 TLV900x-Q1 Low-Side, Current Sensing Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Single-Supply Photodiode Amplifier
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Input and ESD Protection
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics

at TA = 25°C, V+ = 2.75 V, V– = –2.75 V, RL = 10 kΩ connected to VS / 2, VCM = VS / 2, and VOUT = VS / 2 (unless otherwise noted)

GUID-F3591FBE-22F8-4B95-B405-799422B4F79D-low.gif
VS = 5 V
Figure 7-1 Offset Voltage Distribution Histogram
GUID-A2A48F03-4983-4C95-93C1-21629067FDA4-low.gifFigure 7-3 Input Offset Voltage vs Temperature
GUID-4C1576D4-026D-4852-8579-F3B69DD5C999-low.gifFigure 7-5 Offset Voltage vs Supply Voltage
GUID-BF0616A7-46B8-4371-B11C-D9BB3BD48B46-low.gifFigure 7-7 IB and IOS vs Common-Mode Voltage
GUID-EB662B22-B9CC-400E-A4F8-066192FD8A13-low.gif
CL = 10 pF
Figure 7-9 Open-Loop Gain and Phase vs Frequency
GUID-55D60FCB-FCA8-45A7-8EC2-371CFCE0D837-low.gif
CL = 10 pF
Figure 7-11 Closed-Loop Gain vs Frequency
GUID-CE926940-A0E5-43B9-AE6C-130C49271224-low.gifFigure 7-13 PSRR vs Frequency
GUID-0BE6C35B-C3F5-4F76-A4CA-FA277A2FE8E5-low.gifFigure 7-15 CMRR vs Frequency
GUID-62B7CF78-D65E-4C34-8599-37C6073E69E0-low.gifFigure 7-17 0.1 Hz to 10 Hz Integrated Voltage Noise
GUID-20CB5BD4-24C6-46A7-ABA3-F993C40F3448-low.gif
VS = 5.5 VVCM = 2.5 VG = 1
BW = 80 kHzVOUT = 0.5 VRMS
Figure 7-19 THD + N vs Frequency
GUID-3EFD46A5-0B42-4EF0-9902-BB294C14DC39-low.gifFigure 7-21 Quiescent Current vs Supply Voltage
GUID-1AC882D3-82D7-429B-9B1E-4A1F134034E9-low.gifFigure 7-23 Open-Loop Output Impedance vs Frequency
GUID-CC932797-F29B-41FE-BA2D-0ECB0FF9372D-low.gif
G = –1 VIN = 100 mVpp
Figure 7-25 Small Signal Overshoot vs Capacitive Load
GUID-18B5FBBB-08DC-40D0-B2C2-FA87AD46AE23-low.gif
G = 1 VIN = 6.5 VPP
Figure 7-27 No Phase Reversal
GUID-2C308386-032B-4372-BEDF-B5B10FC776ED-low.gif
G = 1VIN = 100 mVPPCL = 10 pF
Figure 7-29 Small-Signal Step Response
GUID-383F4DA1-69A2-4227-9BA5-B0BBBE1B6DF7-low.gif
G = 1CL = 100 pF2-V step
Figure 7-31 Large-Signal Settling Time (Negative)
GUID-169DCE0B-5AE3-4B11-A5D3-B2D6E73469A1-low.gifFigure 7-33 Short-Circuit Current vs Temperature
GUID-760FF8F6-D9B2-4FF2-8138-80B1FC284080-low.gifFigure 7-35 Electromagnetic Interference Rejection Ratio Referred to Noninverting Input (EMIRR+) vs Frequency
GUID-2B19038C-4B1B-4131-B4D3-26A6B355B601-low.gif
VS = 5 V, TA = –40°C to +125°C
Figure 7-2 Offset Voltage Drift Distribution Histogram
GUID-BED22AB6-0290-486A-831B-C5B3EC8E5054-low.gifFigure 7-4 Offset Voltage vs Common-Mode
GUID-B12C033C-80ED-490C-9355-9E16BCCAF837-low.gifFigure 7-6 IB and IOS vs Temperature
GUID-734B3066-5007-4DD9-B5F7-0599232DE949-low.gifFigure 7-8 Open-Loop Gain vs Temperature
GUID-932AE820-39EE-4823-96B9-F6BF7D34E07E-low.gifFigure 7-10 Open-Loop Gain vs Output Voltage
GUID-EE0BECF8-8913-4A0C-9C2D-D9B0B31168E6-low.gifFigure 7-12 Output Voltage vs Output Current (Claw)
GUID-DC8CB7D6-7546-4383-998F-35D3A0A97073-low.gif
VS = 1.8 V to 5.5 V
Figure 7-14 DC PSRR vs Temperature
GUID-56EB5AA5-A08E-4883-9DB3-1D377ED2C47D-low.gif
VCM = (V–) – 0.1 V to (V+) – 1.4 V
Figure 7-16 DC CMRR vs Temperature
GUID-26D4BEF8-8E55-4FC1-8B65-D90BF68005DB-low.gifFigure 7-18 Input Voltage Noise Spectral Density
GUID-646E7BDC-AE45-48D9-9DA6-3D1B73D6ACA9-low.gif
VS = 5.5 VVCM = 2.5 Vf = 1 kHz
G = 1BW = 80 kHz
Figure 7-20 THD + N vs Amplitude
GUID-C6118AEF-27C8-4E65-8871-1FBA19FA73E7-low.gifFigure 7-22 Quiescent Current vs Temperature
GUID-E5DE7838-13D8-4509-8004-741F7E053C6E-low.gif
G = 1 VIN = 100 mVpp
Figure 7-24 Small Signal Overshoot vs Capacitive Load
GUID-10109B7F-0737-4C14-A228-855D740E8B81-low.gifFigure 7-26 Phase Margin vs Capacitive Load
GUID-7E9AAAC3-3FCA-4F66-BF5E-730A22B7359F-low.gif
G = –10 VIN = 600 mVPP
Figure 7-28 Overload Recovery
GUID-FD34359F-318E-4437-9E1A-883A825E96E1-low.gif
G = 1VIN = 4 VPPCL = 10 pF
Figure 7-30 Large-Signal Step Response
GUID-702F5A82-315F-4D68-B753-4A9D146BE5EB-low.gif
G = 1CL = 100 pF2-V step
Figure 7-32 Large-Signal Settling Time (Positive)
GUID-ABBDF86A-AD82-45C4-A2AD-85234A3B6A29-low.gifFigure 7-34 Maximum Output Voltage vs Frequency
GUID-FD82FAE6-9381-4C66-A334-BC965D631D2E-low.gifFigure 7-36 Channel Separation