SBOS833R October   2017  – November 2021 TLV9001 , TLV9002 , TLV9004

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information: TLV9001
    5. 7.5  Thermal Information: TLV9001S
    6. 7.6  Thermal Information: TLV9002
    7. 7.7  Thermal Information: TLV9002S
    8. 7.8  Thermal Information: TLV9004
    9. 7.9  Thermal Information: TLV9004S
    10. 7.10 Electrical Characteristics
    11. 7.11 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Voltage
      2. 8.3.2 Rail-to-Rail Input
      3. 8.3.3 Rail-to-Rail Output
      4. 8.3.4 EMI Rejection
    4. 8.4 Overload Recovery
    5. 8.5 Shutdown
    6. 8.6 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 TLV900x Low-Side, Current Sensing Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Single-Supply Photodiode Amplifier
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
  11. 10Power Supply Recommendations
    1. 10.1 Input and ESD Protection
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

TLV9001 TLV9002 TLV9004 TLV9001 DBV, TLV9001T DCK Package5-Pin SOT-23, SC70Top ViewFigure 6-1 TLV9001 DBV, TLV9001T DCK Package
5-Pin SOT-23, SC70
Top View
TLV9001 TLV9002 TLV9004 TLV9001 DPW Package5-Pin X2SONTop ViewFigure 6-3 TLV9001 DPW Package
5-Pin X2SON
Top View
TLV9001 TLV9002 TLV9004 TLV9001 DCK Package, TLV9001 DRL Package, TLV9001U DBV Package5-Pin SC70, SOT-553, SOT-23Top ViewFigure 6-2 TLV9001 DCK Package, TLV9001 DRL Package, TLV9001U DBV Package
5-Pin SC70, SOT-553, SOT-23
Top View
Table 6-1 Pin Functions: TLV9001
PIN I/O DESCRIPTION
NAME SOT-23,
SC70(T)		 SC70,
SOT-23(U),
SOT-553		 X2SON
IN– 4 3 2 I Inverting input
IN+ 3 1 4 I Noninverting input
OUT 1 4 1 O Output
V– 2 2 3 I or — Negative (low) supply or ground (for single-supply operation)
V+ 5 5 5 I Positive (high) supply
TLV9001 TLV9002 TLV9004 TLV9001S DBV Package6-Pin SOT-23Top ViewFigure 6-4 TLV9001S DBV Package
6-Pin SOT-23
Top View
TLV9001 TLV9002 TLV9004 TLV9001S DCK Package6-Pin SC70Top ViewFigure 6-5 TLV9001S DCK Package
6-Pin SC70
Top View
Table 6-2 Pin Functions: TLV9001S
PIN I/O DESCRIPTION
NAME SOT-23 SC70
IN– 4 3 I Inverting input
IN+ 3 1 I Noninverting input
OUT 1 4 O Output
SHDN 5 5 I Shutdown: low = amp disabled, high = amp enabled. See Section 8.5 for more information.
V– 2 2 I or — Negative (low) supply or ground (for single-supply operation)
V+ 6 6 I Positive (high) supply
TLV9001 TLV9002 TLV9004 TLV9002 D, DGK, PW, DDF Package8-Pin SOIC, VSSOP, TSSOP, SOT-23Top ViewFigure 6-6 TLV9002 D, DGK, PW, DDF Package
8-Pin SOIC, VSSOP, TSSOP, SOT-23
Top View
TLV9001 TLV9002 TLV9004 TLV9002 DSG Package 8-Pin WSON With Exposed Thermal PadTop View
A. Connect thermal pad to V–.
Figure 6-7 TLV9002 DSG Package
8-Pin WSON With Exposed Thermal Pad
Top View
Table 6-3 Pin Functions: TLV9002
PIN I/O DESCRIPTION
NAME NO.
IN1– 2 I Inverting input, channel 1
IN1+ 3 I Noninverting input, channel 1
IN2– 6 I Inverting input, channel 2
IN2+ 5 I Noninverting input, channel 2
OUT1 1 O Output, channel 1
OUT2 7 O Output, channel 2
V– 4 I or — Negative (low) supply or ground (for single-supply operation)
V+ 8 I Positive (high) supply
TLV9001 TLV9002 TLV9004 TLV9002S DGS Package10-Pin VSSOPTop ViewFigure 6-8 TLV9002S DGS Package
10-Pin VSSOP
Top View
TLV9001 TLV9002 TLV9004 TLV9002S YCK Package9-Pin DSBGA (WCSP)Bottom ViewFigure 6-10 TLV9002S YCK Package
9-Pin DSBGA (WCSP)
Bottom View
TLV9001 TLV9002 TLV9004 TLV9002S RUG Package10-Pin X2QFNTop ViewFigure 6-9 TLV9002S RUG Package
10-Pin X2QFN
Top View
Table 6-4 Pin Functions: TLV9002S
PIN I/O DESCRIPTION
NAME VSSOP X2QFN DSBGA (WCSP)
IN1– 2 9 B1 I Inverting input, channel 1
IN1+ 3 10 A1 I Noninverting input, channel 1
IN2– 8 5 B3 I Inverting input, channel 2
IN2+ 7 4 A3 I Noninverting input, channel 2
OUT1 1 8 C1 O Output, channel 1
OUT2 9 6 C3 O Output, channel 2
SHDN1 5 2 — I Shutdown: low = amp disabled, high = amp enabled, channel 1. See Section 8.5 for more information.
SHDN2 6 3 — I Shutdown: low = amp disabled, high = amp enabled, channel 1. See Section 8.5 for more information.
SHDN — — B2 Shutdown: low = both amplifiers disabled, high = both amplifiers enabled
V– 4 1 A2 I or — Negative (low) supply or ground (for single-supply operation)
V+ 10 7 C2 I Positive (high) supply
TLV9001 TLV9002 TLV9004 TLV9004 D, DYY, PW Package14-Pin SOIC, SOT-23 (14), TSSOPTop ViewFigure 6-11 TLV9004 D, DYY, PW Package
14-Pin SOIC, SOT-23 (14), TSSOP
Top View
TLV9001 TLV9002 TLV9004 TLV9004 RTE Package16-Pin WQFN With Exposed Thermal PadTop View
A. Connect thermal pad to V–.
Figure 6-13 TLV9004 RTE Package
16-Pin WQFN With Exposed Thermal Pad
Top View
TLV9001 TLV9002 TLV9004 TLV9004 RUC Package14-Pin X2QFNTop ViewFigure 6-12 TLV9004 RUC Package
14-Pin X2QFN
Top View
Table 6-5 Pin Functions: TLV9004
PIN I/O DESCRIPTION
NAME SOIC, SOT-23 (14), TSSOP WQFN X2QFN
IN1– 2 16 1 I Inverting input, channel 1
IN1+ 3 1 2 I Noninverting input, channel 1
IN2– 6 4 5 I Inverting input, channel 2
IN2+ 5 3 4 I Noninverting input, channel 2
IN3– 9 9 8 I Inverting input, channel 3
IN3+ 10 10 9 I Noninverting input, channel 3
IN4– 13 13 12 I Inverting input, channel 4
IN4+ 12 12 11 I Noninverting input, channel 4
NC — 6, 7 — — No internal connection
OUT1 1 15 14 O Output, channel 1
OUT2 7 5 6 O Output, channel 2
OUT3 8 8 7 O Output, channel 3
OUT4 14 14 13 O Output, channel 4
V– 11 11 10 I or — Negative (low) supply or ground (for single-supply operation)
V+ 4 2 3 I Positive (high) supply
TLV9001 TLV9002 TLV9004 TLV9004S RTE Package16-Pin WQFN With Exposed Thermal PadTop View
A. Connect thermal pad to V–.
Figure 6-14 TLV9004S RTE Package
16-Pin WQFN With Exposed Thermal Pad
Top View
Table 6-6 Pin Functions: TLV9004S
PIN I/O DESCRIPTION
NAME NO.
IN1+ 1 I Noninverting input
IN1– 16 I Inverting input
IN2+ 3 I Noninverting input
IN2– 4 I Inverting input
IN3+ 10 I Noninverting input
IN3– 9 I Inverting input
IN4+ 12 I Noninverting input
IN4– 13 I Inverting input
SHDN12 6 I Shutdown: low = amp disabled, high = amp enabled, channel 1 and 2. See Section 8.5 for more information.
SHDN34 7 I Shutdown: low = amp disabled, high = amp enabled, channel 3 and 4. See Section 8.5 for more information.
OUT1 15 O Output
OUT2 5 O Output
OUT3 8 O Output
OUT4 14 O Output
V– 11 I or — Negative (low) supply or ground (for single-supply operation)
V+ 2 I Positive (high) supply