SBOSA68D November   2021  – March 2024 TLV9161 , TLV9162 , TLV9164

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information for Single Channel
    5. 5.5 Thermal Information for Dual Channel
    6. 5.6 Thermal Information for Quad Channel
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Input Protection Circuitry
      2. 6.3.2  EMI Rejection
      3. 6.3.3  Thermal Protection
      4. 6.3.4  Capacitive Load and Stability
      5. 6.3.5  Common-Mode Voltage Range
      6. 6.3.6  Phase Reversal Protection
      7. 6.3.7  Electrical Overstress
      8. 6.3.8  Overload Recovery
      9. 6.3.9  Typical Specifications and Distributions
      10. 6.3.10 Packages With an Exposed Thermal Pad
      11. 6.3.11 Shutdown
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Low-Side Current Measurement
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Buffered Multiplexer
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 TINA-TI (Free Software Download)
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The TLV916x family (TLV9161, TLV9162, and TLV9164) is a family of 16V, general-purpose operational amplifiers. These devices offer exceptional DC precision and AC performance, including rail-to-rail input/output, low offset (±210µV, typical), low-offset drift (±0.25µV/°C, typ), and low noise (6.8nV/√Hz at 1kHz, 4.2nV/√Hz at 10kHz).

Features such as differential and common-mode input voltage ranges to the supply rails, high short-circuit current (±73mA), and high slew rate (33V/µs) make the TLV916x a flexible, robust, and high-performance op amp for industrial applications.

The TLV916x family of op amps is available in small-size packages (such as X2QFN and WSON), as well as standard packages (such as SOT-23, SOIC, and TSSOP), and is specified from –40°C to 125°C.
Device Information
PART NUMBER(1) CHANNEL COUNT PACKAGE PACKAGE SIZE(2)
TLV9161 Single DCK (SC70, 5) 2.00mm × 2.10mm
DBV (SOT-23, 5) 2.90mm × 2.80mm
TLV9161S Single, Shutdown DBV (SOT-23, 6) 2.90mm × 2.80mm
TLV9162 Dual D (SOIC, 8) 4.90mm × 6.00mm
DDF (SOT-23, 8) 2.90mm × 2.80mm
PW (TSSOP, 8) 3.00mm × 6.40mm
DGK (VSSOP, 8) 3.00mm × 4.90mm
DSG (WSON, 8) 2.00mm × 2.00mm
TLV9162S Dual, Shutdown RUG (X2QFN, 10) 1.50mm × 2.00mm
TLV9164 Quad D (SOIC, 14) 8.65mm × 6.00mm
PW (TSSOP, 14) 5.00mm × 6.40mm
(1) For more information, see Section 10
(2) The package size (length × width) is a nominal value and includes pins, where applicable.
GUID-20211029-SS0I-N9DN-H7C8-D1DCCC7SX80K-low.png TLV916x in Current-Sensing Applications