SBOS941A February   2019  – April 2019 TLV9301 , TLV9302 , TLV9304

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      TLV930x in a Single-Pole, Low-Pass Filter
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions: TLV9301
    2.     Pin Functions: TLV9302
    3.     Pin Functions: TLV9304
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information for Single Channel
    5. 6.5 Thermal Information for Dual Channel
    6. 6.6 Thermal Information for Quad Channel
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
    9. 6.9 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Protection Circuitry
      2. 7.3.2 EMI Rejection
      3. 7.3.3 Phase Reversal Protection
      4. 7.3.4 Thermal Protection
      5. 7.3.5 Capacitive Load and Stability
      6. 7.3.6 Common-Mode Voltage Range
      7. 7.3.7 Electrical Overstress
      8. 7.3.8 Overload Recovery
      9. 7.3.9 Typical Specifications and Distributions
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 High Voltage Precision Comparator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI (Free Software Download)
        2. 11.1.1.2 TI Precision Designs
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Low offset voltage: ±0.5 mV
  • Low offset voltage drift: ±2 µV/°C
  • Low noise: 33 nV/√Hz at 1 kHz
  • High common-mode rejection: 110 dB
  • Low bias current: ±10 pA
  • Rail-to-rail output
  • Wide bandwidth: 1-MHz GBW
  • High slew rate: 3 V/µs
  • Low quiescent current: 150 µA per amplifier
  • Wide supply: ±2.25 V to ±20 V, 4.5 V to 40 V
  • Robust EMI performance: 72 dB at 1 GHz
  • MUX-friendly/comparator inputs:
    • Differential and common-mode input voltage range to supply rail
  • Industry-standard packages:
    • Single in SOT-23-5 and SC70
    • Dual in SOIC-8, TSSOP-8, and VSSOP-8
    • Quad in SOIC-14 and TSSOP-14