SLYS042D August   2021  – September 2022 TMAG5231

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Magnetic Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Magnetic Flux Direction
      2. 8.3.2 Magnetic Response
      3. 8.3.3 Output Type
      4. 8.3.4 Sampling Rate
      5. 8.3.5 Hall Element Location
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Defining the Design Implementation
    2. 9.2 Typical Applications
      1. 9.2.1 Hinge
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Head-On
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
      3. 9.2.3 Slide-By
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Examples
  10. 10Device and Documentation Support
    1. 10.1 Support Resources
    2. 10.2 Trademarks
    3. 10.3 Electrostatic Discharge Caution
    4. 10.4 Glossary
  11. 11Mechanical and Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) TMAG5231 TMAG5231 UNIT
SOT-23 (DBZ) X2SON (DMR)
3 PINS 4 PINS
RθJA Junction-to-ambient thermal resistance 227.4 218.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 122.7 174.1
RθJB Junction-to-board thermal resistance 61.2 172.4
ΨJT Junction-to-top characterization parameter 21.3 11.9
ΨJB Junction-to-board characterization parameter 60.8 167.2
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 144.9
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.