SBOS854E March   2018  – August 2021 TMP1075

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Device Comparison
  7. Pin Configuration and Functions
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics:TMP1075
    6. 8.6  Electrical Characteristics: TMP1075N
    7. 8.7  Timing Requirements:TMP1075
    8. 8.8  Timing Requirements: TMP1075N
    9. 8.9  Switching Characteristics
    10. 8.10 Typical Characteristics
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Digital Temperature Output
      2. 9.3.2 I2C and SMBus Serial Interface
        1. 9.3.2.1  Bus Overview
        2. 9.3.2.2  Serial Bus Address
        3. 9.3.2.3  Pointer Register
          1. 9.3.2.3.1 Pointer Register Byte [reset = 00h]
        4. 9.3.2.4  Writing and Reading to the TMP1075
        5. 9.3.2.5  Operation Mode
          1. 9.3.2.5.1 Receiver Mode
          2. 9.3.2.5.2 Transmitter Mode
        6. 9.3.2.6  SMBus Alert Function
        7. 9.3.2.7  General Call- Reset Function
        8. 9.3.2.8  High-Speed Mode (HS)
        9. 9.3.2.9  Coexists in I3C Mixed Fast Mode
        10. 9.3.2.10 Time-Out Function
      3. 9.3.3 Timing Diagrams
      4. 9.3.4 Two-Wire Timing Diagrams
    4. 9.4 Device Functional Modes
      1. 9.4.1 Shutdown Mode (SD)
      2. 9.4.2 One-Shot Mode (OS)
      3. 9.4.3 Continuous Conversion Mode (CC)
      4. 9.4.4 Thermostat Mode (TM)
        1. 9.4.4.1 Comparator Mode (TM = 0)
        2. 9.4.4.2 Interrupt Mode (TM = 1)
        3. 9.4.4.3 Polarity Mode (POL)
    5. 9.5 Register Map
      1. 9.5.1 Register Descriptions
        1. 9.5.1.1 Temperature Register (address = 00h) [default reset = 0000h]
        2. 9.5.1.2 Configuration Register (address = 01h) [default reset = 00FFh (60A0h TMP1075N)]
        3. 9.5.1.3 Low Limit Register (address = 02h) [default reset = 4B00h]
        4. 9.5.1.4 High Limit Register (address = 03h) [default reset = 5000h]
        5. 9.5.1.5 Device ID Register (address = 0Fh) [default reset = 7500]
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Migrating From the xx75 Device Family
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Support Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Overview

The TMP1075 device is a digital temperature sensor that is optimal for thermal management and thermal protection applications. The TMP1075 is a SMBus and is I2C interface-compatible. It is also capable of coexisting in an I3C bus when in Mixed Fast Mode. The TMP1075 non-N orderables are specified over a temperature range of −55°C to +125°C and the TMP1075N orderable is specified over the −40°C to +125°C temperature range. The Figure 9-1 section shows an internal block diagram of TMP1075 device.

The temperature sensor thermal path runs through the package leads as well as the plastic package. The leads provide the primary thermal path due to the lower thermal resistance of the metal.