SLOS887F September   2014  – June 2022 TMP112-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Specifications for User-Calibrated Systems
    7. 7.7 Timing Requirements
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Digital Temperature Output
      2. 8.3.2 Serial Interface
        1. 8.3.2.1 Bus Overview
        2. 8.3.2.2 Serial Bus Address
        3. 8.3.2.3 Writing and Reading Operation
        4. 8.3.2.4 Target Mode Operation
          1. 8.3.2.4.1 Target Receiver Mode
          2. 8.3.2.4.2 Target Transmitter Mode
        5. 8.3.2.5 SMBus Alert Function
        6. 8.3.2.6 General Call
        7. 8.3.2.7 High-Speed (Hs) Mode
        8. 8.3.2.8 Timeout Function
        9. 8.3.2.9 Timing Diagrams
          1. 8.3.2.9.1 Two-Wire Timing Diagrams
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous-Conversion Mode
      2. 8.4.2 Extended Mode (EM)
      3. 8.4.3 Shutdown Mode (SD)
      4. 8.4.4 One-Shot and Conversion Ready Mode (OS)
      5. 8.4.5 Thermostat Mode (TM)
        1. 8.4.5.1 Comparator Mode (TM = 0)
        2. 8.4.5.2 Interrupt Mode (TM = 1)
    5. 8.5 Programming
      1. 8.5.1 Pointer Register
      2. 8.5.2 Temperature Register
      3. 8.5.3 Configuration Register
        1. 8.5.3.1 Shutdown Mode (SD)
        2. 8.5.3.2 Thermostat Mode (TM)
        3. 8.5.3.3 Polarity (POL)
        4. 8.5.3.4 Fault Queue (F1/F0)
        5. 8.5.3.5 Converter Resolution (R1 and R0)
        6. 8.5.3.6 One-Shot (OS)
        7. 8.5.3.7 Extended Mode (EM)
        8. 8.5.3.8 Alert (AL)
        9. 8.5.3.9 Conversion Rate (CR)
      4. 8.5.4 High- and Low-Limit Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Calibrating for Improved Accuracy
        1. 9.1.1.1 Example 1: Finding Worst-Case Accuracy From –15°C to 50°C
        2. 9.1.1.2 Example 2: Finding Worst-Case Accuracy From 25°C to 100°C
      2. 9.1.2 Using The Slope Specifications With a 1-Point Calibration
        1. 9.1.2.1 Power Supply-Level Contribution to Accuracy
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision E (December 2018) to Revision F (June 2022)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed all instances of legacy terminology to controller and target where I2C is mentioned.Go
  • Added the Functional Safety information to the Features sectionGo

Changes from Revision D (December 2015) to Revision E (December 2018)

  • Updated description for ADD0 pin for connection to SDA and SCLGo
  • Changed supply voltage maximum value from: 5 V to: 4 VGo
  • Changed input voltage maximum value for the SCL, ADD0, and SDA pins from: 5 V to: 4 VGo
  • Changed input voltage maximum value for the ALERT pin from: (V+) + 0.5 V to: (V+) + 0.3 and ≤ 4Go
  • Updated junction-to-ambient thermal resistance from 200 °C/W to 210.3 °C/WGo
  • Updated junction-to-case (top) thermal resistance from 73.7 °C/W to 105.0 °C/W Go
  • Updated junction-to-board thermal resistance from 34.4 °C/W to 87.5 °C/WGo
  • Updated junction-to-top characterization parameter from 3.1 °C/W to 6.1 °C/W Go
  • Updated junction-to-board characterization parameter from 34.2 °C/W to 87.0 °C/WGo
  • Added Receiving Notification of Documentation Updates section Go

Changes from Revision C (March 2015) to Revision D (December 2015)

  • Added NIST Features bullet Go
  • Added last paragraph to Description section Go

Changes from Revision B (November 2014) to Revision C (March 2015)

  • Updated pin numbers on the schematic images Go
  • Changed the Handling Ratings table to ESD Ratings and moved the storage temperature parameter to the Absolute Maximum Ratings table Go
  • Changed min, typ, max values for the Temperature Accuracy (temperature error) parameter Go
  • Changed the frequency from 2.85 to 3.4 MHz in the POWER SUPPLY section of the Electrical Characteristics tableGo
  • Changed the Temperature Error at 25°C graph in the Typical Characteristics sectionGo
  • Changed the Temperature Error vs. Temperature graph in the Typical Characteristics section Go

Changes from Revision A (October 2014) to Revision B (November 2014)

  • Changed device status from Product Preview to Production Data Go