SLOS887E September 2014 – December 2018 TMP112-Q1
Place the TMP7112-Q1 device in close proximity to the heat source that must be monitored, with a proper layout for good thermal coupling. This placement ensures that temperature changes are captured within the shortest possible time interval. To maintain accuracy in applications that require air or surface temperature measurement, care must be taken to isolate the package and leads from ambient air temperature. A thermally-conductive adhesive is helpful in achieving accurate surface temperature measurement.
The TMP112-Q1 device is a very low-power device and generates very low noise on the supply bus. Applying an RC filter to the V+ pin of the TMP112-Q1 device can further reduce any noise that the TMP112-Q1 device might propagate to other components. R(F) in Figure 20 must be less than 5 kΩ and C(F) must be greater than 10 nF.