SLOS887E September   2014  – December 2018 TMP112-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Simplified Schematic
  3. 3 Description
    1.     Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Specifications for User-Calibrated Systems
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Serial Interface
        1. 7.3.2.1 Bus Overview
        2. 7.3.2.2 Serial Bus Address
        3. 7.3.2.3 Writing and Reading Operation
        4. 7.3.2.4 Slave Mode Operation
          1. 7.3.2.4.1 Slave Receiver Mode
          2. 7.3.2.4.2 Slave Transmitter Mode
        5. 7.3.2.5 SMBus Alert Function
        6. 7.3.2.6 General Call
        7. 7.3.2.7 High-Speed (Hs) Mode
        8. 7.3.2.8 Timeout Function
        9. 7.3.2.9 Timing Diagrams
          1. 7.3.2.9.1 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuos-Conversion Mode
      2. 7.4.2 Extended Mode (EM)
      3. 7.4.3 Shutdown Mode (SD)
      4. 7.4.4 One-Shot and Conversion Ready Mode (OS)
      5. 7.4.5 Thermostat Mode (TM)
        1. 7.4.5.1 Comparator Mode (TM = 0)
        2. 7.4.5.2 Interrupt Mode (TM = 1)
    5. 7.5 Programming
      1. 7.5.1 Pointer Register
      2. 7.5.2 Temperature Register
      3. 7.5.3 Configuration Register
        1. 7.5.3.1 Shutdown Mode (SD)
        2. 7.5.3.2 Thermostat Mode (TM)
        3. 7.5.3.3 Polarity (POL)
        4. 7.5.3.4 Fault Queue (F1/F0)
        5. 7.5.3.5 Converter Resolution (R1 and R0)
        6. 7.5.3.6 One-Shot (OS)
        7. 7.5.3.7 Extended Mode (EM)
        8. 7.5.3.8 Alert (AL)
        9. 7.5.3.9 Conversion Rate (CR)
      4. 7.5.4 High- and Low-Limit Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Calibrating for Improved Accuracy
        1. 8.1.1.1 Example 1: Finding Worst-Case Accuracy From –15°C to 50°C
        2. 8.1.1.2 Example 2: Finding Worst-Case Accuracy From 25°C to 100°C
      2. 8.1.2 Using The Slope Specifications With a 1-Point Calibration
        1. 8.1.2.1 Power Supply-Level Contribution to Accuracy
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.