SLOS887E September 2014 – December 2018 TMP112-Q1
PRODUCTION DATA.
The TMP112-Q1 device is a digital temperature sensor that is optimal for thermal-management and thermal-protection applications. The TMP112-Q1 device is two-wire, SMBus and I2C interface-compatible. The device is specified over an operating temperature range of –40°C to 125°C. Figure 8 shows a block diagram of the TMP112-Q1 device. Figure 9 illustrates the ESD protection circuitry contained in the TMP112-Q1 device.
The temperature sensor in the TMP112-Q1 device is the chip itself. Thermal paths run through the package leads as well as the plastic package. The package leads provide the primary thermal path because of the lower thermal resistance of the metal.
An alternative version of the TMP112-Q1 device is available. The TMP102-Q1 device has reduced accuracy, the same micro-package, and is pin-to-pin compatible.
Device | Compatible Interfaces | Package | Supply Current | Supply Voltage (Min) | Supply Voltage (Max) | Resolution | Local Sensor Accuracy (Max) | Specified Calibration Drift Slope |
---|---|---|---|---|---|---|---|---|
TMP112-Q1 | I2C
SMBus |
SOT563
1.2 × 1.6 × 0.6 |
10µA | 1.4V | 3.6V | 12 Bit
0.0625°C |
0.5°C: (0°C to 65°C)
1°C: (-40°C to 125°C) |
Yes |
TMP102-Q1 | I2C
SMBus |
SOT563
1.2 × 1.6 × 0.6 |
10µA | 1.4V | 3.6V | 12 Bit
0.0625°C |
2°C: (25°C to 85°C)
3°C: (-40°C to 125°C) |
No |