SBOS473I March 2009 – December 2018 TMP112
Place the device in close proximity to the heat source that must be monitored, with a proper layout for good thermal coupling. This placement ensures that temperature changes are captured within the shortest possible time interval. To maintain accuracy in applications that require air or surface temperature measurement, take care to isolate the package and leads from ambient air temperature. A thermally-conductive adhesive is helpful in achieving accurate surface temperature measurement.
The TMP112 family is a very low-power device and generates very low noise on the supply bus. Applying an RC filter to the V+ pin of the TMP112 family can further reduce any noise that the device might propagate to other components. R(F) in Figure 18 must be less than 5 kΩ and C(F) must be greater than 10 nF.