SBOSA50A December   2021  – March 2022 TMP127-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 SPI Interface Timing
    7. 7.7 Timing Diagrams
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Low Power Consumption
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous Conversion Mode
      2. 8.4.2 Shutdown Mode
    5. 8.5 Programming
      1. 8.5.1 Temperature Data Format
      2. 8.5.2 Serial Bus Interface
        1. 8.5.2.1 Communication in Shutdown Mode
        2. 8.5.2.2 Communication in Continuous Conversion Mode
        3. 8.5.2.3 Internal Register Structure
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Read-Only Configuration
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
      2. 9.2.2 Read/Write Configuration
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5 Electrical Characteristics

Over free-air temperature range and VDD = 1.62 V to 5.5 V (unless otherwise noted); Typical specifications are at TA = 25 °C and VDD = 3.3 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TEMPERATURE SENSOR
TERR Temperature accuracy -55 ℃ to 150 ℃ -0.8 0.8 °C
Temperature accuracy 150 ℃ to 175 ℃ -1 1 °C
PSR DC power supply rejection  12.7 m°C/V
TRES Temperature resolution Including sign bit 14 Bits
LSB 31.25 m°C
TREPEAT Repeatability(1) VDD = 3.3 V
 ±1 LSB
TLTD Long-term stability and drift(3) 1000 hours at 175 °C 0.07 °C
Temperature cycling and hysteresis(3) ±0.5 LSB
tCONV_PERIOD Conversion Period 200 270 ms
tCONV Active conversion time 4.5 6 7.5 ms
DIGITAL INPUT/OUTPUT
CIN Input capacitance f = 1 MHz 20 pF
VIH Input logic high level SCLK, SIO, CS 0.7 * VDD VDD V
VIL Input logic low level SCLK, SIO, CS 0 0.3 * VDD V
IIN Input leakage current SCLK, SIO, CS -0.5 0.5 μA
VOH SIO output high level IOH = 3 mA VDD - 0.4  VDD V
VOL SIO output low level IOL = -3 mA 0 0.4 V
POWER SUPPLY
IDD_ACTIVE Supply current during active conversion CS = VDD TA = 25 °C 77 87 μA
TA = -55 °C to 150 °C 135
TA = 175 °C 160
IDD Average current consumption CS = VDD TA = 25 °C 2.65 4 μA
TA = -55 °C to 150 °C 19
TA = 175 °C 38
ISB Standby current(4) CS = VDD TA = 25 °C 0.5 0.75 μA
TA = -55 °C to 150 °C 15
TA = -55 °C to 175 °C 34
ISD Shutdown current CS = VDD TA = 25 °C 0.35 0.5 μA
TA = -55 °C to 150 °C 15
TA = -55 °C to 175 °C 34
VPOR Power-on reset threshold voltage Supply rising 1.3 V
Brownout detect Supply falling 1.1 V
tRESET Reset Time Time required by device to reset 0.5 ms
(1) Repeatability is the ability to reproduce a reading when the measured temperature is applied consecutively, under the same conditions.
(2) Long term stability is determined using accelerated operational life testing at a junction temperature of 150 °C.
(3) Hysteresis is defined as the ability to reproduce a temperature reading as the temperature varies from room → hot →room→cold→room. The temperatures used for this test are -40 °C, 25 °C, and 150 °C.
(4) Quiescent current between conversions