SBOS335F June   2005  – January 2023 TMP300

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Pin Configuration and Functions
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Electrical Characteristics
    4. 6.4 Typical Characteristics
  7. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Calculating RSET
      2. 7.2.2 Using VTEMP to Trip the Digital Output
      3. 7.2.3 Analog Temperature Output
      4. 7.2.4 Using a DAC to Set the Trip Point
      5. 7.2.5 Hysteresis
  8. 8Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision E (December 2018) to Revision F (January 2023)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed Device Information table to Package Information Go
  • Added parameter to the Absolute Maximum Ratings table: input current into any pinGo

Changes from Revision D (January 2016) to Revision E (December 2018)

  • Added Pin Configuration and Functions section Go

Changes from Revision C (January 2011) to Revision D (January 2016)

  • Added Device Information table, ESD Ratings table, Feature Description section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Changed Temperature Range Features bullet Go
  • Added package names to pinout Go
  • Deleted Ordering Information table Go
  • Changed Temperature Range, TA, Functional Range parameter name in Electrical Characteristics tableGo
  • Added footnote 4 to Electrical Characteristics table Go

Changes from Revision B (November 2008) to Revision C (January 2011)

  • Deleted second sentence from Description sectionGo
  • Added TMP300B grade device specifications to Electrical Characteristics tableGo