SLOS889C October   2014  – September 2018 TMP302-Q1


  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Trip Threshold Accuracy
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 HYSTSET
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Configuring the TMP302-Q1
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resource
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Application

Figure 10 shows the typical circuit configuration for the TMP302-Q1 family of devices. The TMP302-Q1 family of devices is configured for the default temperature threshold by connecting the TRIPSET0 and TRIPSET1 pins directly to ground. Connecting the HYSTSET pin to ground configures the device for 5°C of hysteresis. Place a 10-kΩ pullup resistor between the OUT and VS pins. Place a 0.1-µF bypass capacitor between the VS pin and ground, close to the TMP302-Q1 device.

TMP302-Q1 TMP302_TYP_APP_SCH_SLOS889.gifFigure 10. TMP302-Q1 Typical Application Schematic

Figure 11 shows the most generic implementation of the TMP302-Q1 family of devices. Switches are shown connecting the TMPSET0, TMPSET1 and HYSTSET pins to either VS or ground. The use of switches is not strictly required; the switches are shown only to illustrate the various pin connection combinations. In practice, connecting the TMPSET0, TMPSET1 and HYSTSET pins to ground or directly to the VS pin is sufficient and minimizes space and cost. If additional flexibility is desired, connections from the TMPSET0, TMPSET1 and HYSTSET pins can be made through 0-Ω resistors which can be either populated or not populated depending upon the desired connection.

TMP302-Q1 TMP302_TYP_APPLICATION_GENERIC_SLOS889.gifFigure 11. TMP302-Q1 Generic Application Schematic