SNIS218A September   2019  – April 2020 TMP390-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 TMP390-Q1 Programming Tables
      2. 7.3.2 Trip Test
      3. 7.3.3 20°C Hysteresis
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Applications Information
    2. 8.2 Typical Applications
      1. 8.2.1 Simplified Application Schematic
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 TMP390-Q1 With 10°C Hysteresis
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
      3. 8.2.3 One Channel Operation for Hot Trip Point up to 124°C
        1. 8.2.3.1 Application Curve
      4. 8.2.4 One Channel Operation for Cold Trip Point
        1. 8.2.4.1 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics

Minimum and maximum specifications are over -55°C to 130°C and VDD = 1.62V - 5.5V (unless otherwise noted); typical specifications are at TA = 25°C and VDD = 3.3 V.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TEMPERATURE TO DIGITAL CONVERTER
TEMPERATURE MEASUREMENT
Trip Point Accuracy (Channel A) 30°C to 70°C VDD = 2.5V to 5.5V –1.5 ±0.5 1.5 °C
VDD = 1.62V to 2.5V –2.0 ±0.5 2.0
30°C to 130°C VDD = 2.5V to 5.5V –2.5 ±0.5 2.5
VDD = 1.62V to 2.5V –3.0 ±0.5 3.0
Trip Point Accuracy (Channel B) 0°C to 25°C VDD = 2.5V to 5.5V –1.75 ±0.5 1.75
VDD = 1.62V to 2.5V –2.0 ±0.5 2.0
–55°C to 25°C VDD = 2.5V to 5.5V –2.5 ±0.5 2.5
VDD = 1.62V to 2.5V –3.0 ±0.5 3.0
THYST Trip point hysteresis Table 2 selection column 2 5 °C
Table 2 selection column 3 10 °C
Channel A only when SETB connected to GND 20 °C
TRIP POINT RESISTOR PROGRAMMING
SETA resistor range 1.05 909 kΩ
SETB resistor range 10.5 909 kΩ
SETA & SETB resistor tolerance TA=25°C -1.0 1.0 %
SETA & SETB resistor temperature coefficient -100 100 ppm/°C
SETA & SETB resistor lifetime drift -0.2 0.2 %
DIGITAL INPUT/OUTPUT
CIN Input capacitance for SETA & SETB (includes PCB) 50 pF
RPD Internal Pull down resistance SETA & SETB 125
VOL Output logic low level IOL = -3 mA 0 0.4 V
ILKG Leakage current on output high level -0.1 0.1 µA
TCov Conversion duration 0.65 ms
TS Sampling period 0.5 s
POWER SUPPLY
IQ Average Quiescent current VDD = 1.62V to 3.3V 0.5 1 μA
IStandby Standby current 0.25
IConv Conversion current 135 μA
ISU Startup (Reset) peak current Reset Time interval only. 250 μA
VPOR Power-on-reset threshold voltage Supply going up 1.5 V
Brownout detect Supply going down 1.1 V
Power Reset Time Time required by device to reset after power up 10 ms