SBOS383D December   2006  – December 2016 TMP411

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
  8. Typical Characteristics
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Series Resistance Cancellation
      2. 9.3.2 Differential Input Capacitance
      3. 9.3.3 Temperature Measurement Data
      4. 9.3.4 THERM (Pin 4) and ALERTor THERM2 (Pin 6)
      5. 9.3.5 Sensor Fault
      6. 9.3.6 Undervoltage Lockout
      7. 9.3.7 Filtering
    4. 9.4 Device Functional Modes
      1. 9.4.1 Shutdown Mode (SD)
      2. 9.4.2 One-Shot Conversion
    5. 9.5 Programming
      1. 9.5.1  Serial Interface
      2. 9.5.2  Bus Overview
      3. 9.5.3  Timing Diagrams
      4. 9.5.4  Serial Bus Address
      5. 9.5.5  Read and Write Operations
      6. 9.5.6  Timeout Function
      7. 9.5.7  High-Speed Mode
      8. 9.5.8  General Call Reset
      9. 9.5.9  Software Reset
      10. 9.5.10 SMBus Alert Function
    6. 9.6 Register Map
      1. 9.6.1  Register Information
      2. 9.6.2  Pointer Register
      3. 9.6.3  Temperature Registers
      4. 9.6.4  Limit Registers
      5. 9.6.5  Status Register
      6. 9.6.6  Configuration Register
      7. 9.6.7  Resolution Register
      8. 9.6.8  Conversion Rate Register
      9. 9.6.9  N-Factor Correction Register
      10. 9.6.10 Minimum and Maximum Registers
      11. 9.6.11 Consecutive Alert Register
      12. 9.6.12 THERM Hysteresis Register
      13. 9.6.13 Remote Temperature Offset Register
      14. 9.6.14 Identification Registers
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from C Revision (May 2008) to D Revision

  • Added "Offset Registers for System Calibration" and "Pin and Registers Compatible With ADT7461 and ADM1032" to Features section Go
  • Kept VSSOP as a package option in Device Information table to match POA and eMSG informationGo
  • Changed "MSOP-8" to "VSSOP-8" throughout document Go
  • Added package designators to pinout images in Pin Configurations and Functions section Go
  • Added ESD Ratings information Go
  • Added Recommended Operating Conditions information Go
  • Added Thermal Information Go
  • Added package designator information to Thermal Information table header Go
  • Reformatted Thermal Information table note Go
  • Changed typical local temperature sensor value from ±0.0625°C to ±0.25°C in Electrical Characteristics tableGo
  • Deleted "vs supply" from TERROR_PS test conditions in Electrical Characteristics table Go
  • Deleted Vs = 3.3 V test condition in Temperature error power supply sensitivity vs supply (local and remote) parameter in Electrical Characteristics tableGo
  • Deleted Temperature Range subsection in Electrical Characteristics table Go
  • Changed typical power-on-reset threshold value from 16 V to 1.6 V in Electrical Characteristics table Go
  • Added Functional Block Diagram Go
  • Added Timing Diagrams section Go
  • Added Power Supply Recommendations information Go
  • Added Receiving Notification of Documentation Updates section Go