SBOS288M January   2004  – December 2020 TMP175 , TMP75

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Serial Interface
        1. 7.3.2.1 Bus Overview
        2. 7.3.2.2 Serial Bus Address
        3. 7.3.2.3 Writing and Reading to the TMP175 and TMP75
        4. 7.3.2.4 Slave Mode Operations
          1. 7.3.2.4.1 Slave Receiver Mode
          2. 7.3.2.4.2 Slave Transmitter Mode
        5. 7.3.2.5 SMBus Alert Function
        6. 7.3.2.6 General Call
        7. 7.3.2.7 High-Speed Mode
        8. 7.3.2.8 Time-out Function
      3. 7.3.3 Timing Diagrams
      4. 7.3.4 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
      2. 7.4.2 One-shot (OS)
      3. 7.4.3 Thermostat Mode (TM)
      4. 7.4.4 Comparator Mode (TM = 0)
      5. 7.4.5 Interrupt Mode (TM = 1)
    5. 7.5 Programming
      1. 7.5.1 Pointer Register
        1. 7.5.1.1 Pointer Register Byte (pointer = N/A) [reset = 00h]
        2. 7.5.1.2 Pointer Addresses of the TMP175
      2. 7.5.2 Temperature Register
      3. 7.5.3 Configuration Register
        1. 7.5.3.1 Shutdown Mode (SD)
        2. 7.5.3.2 Thermostat Mode (TM)
        3. 7.5.3.3 Polarity (POL)
        4. 7.5.3.4 Fault Queue (F1/F0)
        5. 7.5.3.5 Converter Resolution (R1/R0)
        6. 7.5.3.6 One-Shot (OS)
      4. 7.5.4 High and Low Limit Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision L (December 2015) to Revision M (October 2020)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed Absolute maximum  Supply voltage of TMP75 from 7 V to 6.5 VGo
  • Added applicable pins to Input voltage specificationGo
  • Changed Absolute maximum  Input Voltage of TMP75 on SCL, SDA, A0, and A1 pins from 7 V to 6.5 VGo
  • Changed Absolute maximum  of TMP75 A2 pin voltage from 7 V to (V+)+0.3Go
  • Removed ESD Machine Model specification from TMP75Go
  • Updated TMP75 D and DGK package Thermal InformationGo
  • Updated TMP175 D package Thermal InformationGo
  • Added register settings to Conversion time specification for clarityGo
  • Changed minimum Data setup specification time from 10 ns to 20 nsGo
  • Moved Timeout specification to I2C Interface Timing tableGo
  • Changed TMP75 Timeout specification  minimum from 25 to 20Go
  • Changed TMP75 Timeout specification maximum from 74 to 30Go
  • Removed BYTE column from the Configuration Register tableGo
  • Changed TMP75 consecutive fault setting F[1:0] = 11 from 6 to 4 and F[1:0] = 10 from 4 to 3. Go
  • Added behavior clarification when changing thermostat modes on TMP75Go
  • Changed bypass capacitor recommendation from 0.1 μF to 0.01 μFGo
  • Updated recommened pull-up resistor size to standard 4.7 kΩ Go
  • Removed Related Links sectionGo
  • Added Receiving Notification of Documentation Updates sectionGo

Changes from Revision K (April 2015) to Revision L (December 2015)

  • Changed second Features bullet: added NIST Traceable to TMP75 device Go
  • Added last paragraph to Description section Go
  • Deleted Simplified Schematic figure from page 1 Go
  • Changed Figure 7-1 Go

Changes from Revision J (December 2007) to Revision K (April 2015)

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go