SBOSA22A December   2021  – August 2022 TMP9R00-SP

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Two-Wire Timing Requirements
      1. 6.6.1 Timing Diagrams
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Temperature Measurement Data
      2. 7.3.2 Series Resistance Cancellation
      3. 7.3.3 Differential Input Capacitance
      4. 7.3.4 Sensor Fault
      5. 7.3.5 THERM Functions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 Bus Overview
        2. 7.5.1.2 Bus Definitions
        3. 7.5.1.3 Serial Bus Address
        4. 7.5.1.4 Read and Write Operations
          1. 7.5.1.4.1 Single Register Reads
          2. 7.5.1.4.2 Block Register Reads
        5. 7.5.1.5 Timeout Function
        6. 7.5.1.6 High-Speed Mode
      2. 7.5.2 TMP9R00-SP Register Reset
      3. 7.5.3 Lock Register
    6. 7.6 Register Maps
      1. 7.6.1 Register Information
        1. 7.6.1.1  Pointer Register
        2. 7.6.1.2  Local and Remote Temperature Value Registers
        3. 7.6.1.3  Software Reset Register
        4. 7.6.1.4  THERM Status Register
        5. 7.6.1.5  THERM2 Status Register
        6. 7.6.1.6  Remote Channel Open Status Register
        7. 7.6.1.7  Configuration Register
        8. 7.6.1.8  η-Factor Correction Register
        9. 7.6.1.9  Remote Temperature Offset Register
        10. 7.6.1.10 THERM Hysteresis Register
        11. 7.6.1.11 Local and Remote THERM and THERM2 Limit Registers
        12. 7.6.1.12 Block Read - Auto Increment Pointer
        13. 7.6.1.13 Lock Register
        14. 7.6.1.14 Manufacturer and Device Identification Plus Revision Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The TMP9R00-SP device is a radiation-hardened, multi-zone, high-accuracy, low-power temperature sensor using a two-wire, SMBus or I2C compatible interface. Up to eight remote and one local temperature zones can be monitored simultaneously, aggregating the temperature measurements in a system reducing design complexity. Typical use cases are monitoring temperature of different high power devices, such as MCUs, GPUs, ADCs, DACs and FPGAs. Advanced features such as series resistance cancellation, programmable ideality factor, temperature offset correction, and temperature limits are included to provide a robust thermal monitoring solution.

Each remote channel and the local channel have two independently programmable thresholds that trigger when the corresponding temperature exceeds the limit. A programmable hysteresis setting is available to avoid toggling around the threshold.

The TMP9R00-SP device provides high accuracy (±1.5°C) and high resolution (0.0625°C) measurement capabilities. The device supports low voltage rails (1.7 V to 2.0 V), common two-wire interfaces (1.7 V to 3.6 V), and an operating temperature range from –55°C to 125°C and a remote junction temperature range from –55°C to 150°C.

Package Information(1)
PART NUMBERGRADEPACKAGEBODY SIZE (NOM)
5962R2021401VXCQMLV RHACFP (16)10.16 mm × 7.10 mm
TMP9R00HKT/EMEngineering Samples(2)CFP (16)10.16 mm × 7.10 mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.
(2) These units are intended for engineering evaluation only. They are processed to a noncompliant flow. These units are not suitable for qualification, production, radiation testing or flight use. Parts are not warrantied for performance over the full MIL specified temperature range of –55°C to 125°C or operating life.