4 Revision
History
Changes from October 4, 2020 to December 31, 2020 (from Revision A (October 2020) to Revision B (December 2020))
-
Global: Added TMS320F280025-Q1, TMS320F280025C-Q1,
TMS320F280023-Q1, and TMS320F280021-Q1.Go
-
Table 5-1 (Device Comparison): Added TMS320F280025-Q1, TMS320F280025C-Q1,
TMS320F280023-Q1, and TMS320F280021-Q1. Updated table.Go
-
Table 6-1 (Pin Attributes): Updated muxed signal names of A7. Updated DESCRIPTION of
VDD: Changed recommended total capacitance from 22 µF to 10 µF.Go
- Removed Digital Signals by GPIO section (Section 6.3.2 in
SPRSP45A).Go
-
Section 6.3.2 (Digital Signals): Added section.Go
-
Table 6-4 (Power and Ground): Updated DESCRIPTION of VDD: Changed recommended total
capacitance from 22 µF to 10 µF.Go
-
Section 7.2 (ESD
Ratings – Commercial): Updated device numbers.Go
-
Section 7.3 (ESD
Ratings – Automotive): Updated device numbers. Added data for 64-pin PM
package.Go
-
Section 7.5.1 (System Current Consumption): Updated
table.Go
-
Section 7.11.1.1 (Internal
1.2-V LDO Voltage Regulator (VREG)): Updated Configuration 1.Go
-
Section 7.11.3.5.1 (INTOSC Characteristics): Updated table.Go
-
Table 7-5 (Flash Parameters): Changed "Nwec Write/Erase Cycles" to
"Nwec Write/Erase Cycles per sector". Added
"Nwec Write/Erase Cycles for entire Flash (combined all
sectors)".Go
-
Section 7.14.8 (Host Interface Controller (HIC)): Updated "The HIC module allows ..."
paragraph.Go
-
Figure 7-70 (HIC
Block Diagram): Removed "Bus Master Interface" label.Go
-
Figure 10-1
(Device Nomenclature): Updated figure.Go
-
Section 10.4 (Tools and Software): Added LAUNCHXL-F280025C to Development Tools
section.Go
Changes from March 17, 2020 to October 3, 2020 (from Revision * (March 2020) to Revision A (October 2020))
-
Global: Updated the numbering format for tables, figures, and
cross-references throughout the document.Go
-
Global: This document is now PRODUCTION
DATA.Go
-
Global: Removed TMS320F280024, TMS320F280024C, and
TMS320F280022.Go
-
Global: Removed 64 QFP-Q data.Go
-
Section 1
(Features): Updated Serial Communication Interface (SCI) feature. Updated Local
Interconnect Network (LIN) feature.Go
-
Table 5-1 (Device Comparison): Updated table.Go
-
Section 2
(Applications): Updated section.Go
-
Section 3
(Description): Updated section.Go
- Device Information: Updated table.Go
-
Figure 3-1 (Functional Block Diagram): Updated figure.Go
-
Table 6-1 (Pin Attributes): Updated table.Go
-
Figure 6-2 (64-Pin PM Low-Profile Quad Flatpack (Top View)): Updated
figure.Go
- Removed "64-Pin PM Low-Profile Quad Flatpack – Q-Temperature (Top
View)" figure.Go
- Removed Digital Signals section (Section 4.3.2 in
SPRSP45).Go
- Digital Signals by GPIO: Added section.Go
-
Table 6-4 (Power and Ground): Updated DESCRIPTION of VDD and VDDIO.Go
-
Section 6.4.1.1 (GPIO
Muxed Pins Table): Added Note about AIO pins.Go
-
Table 6-6 (GPIO Muxed
Pins): Updated table.Go
-
Section 6.4.4 (GPIO
Output X-BAR, CLB X-BAR, CLB Output X-BAR, and ePWM X-BAR): Changed section
title from "GPIO Output X-BAR and ePWM X-BAR" to "GPIO Output X-BAR, CLB X-BAR,
CLB Output X-BAR, and ePWM X-BAR". Updated section.Go
-
Figure 6-5 (Output
X-BAR, CLB X-BAR, CLB Output X-BAR, and ePWM X-BAR Sources): Replaced "Output
X-BAR and ePWM X-BAR Sources" figure with "Output X-BAR, CLB X-BAR, CLB Output
X-BAR, and ePWM X-BAR Sources" figure.Go
-
Table 6-9 (Connections for Unused Pins): Added "Analog input pins" in ANALOG
section.Go
-
Section 7
(Specifications): Updated section and tables.Go
-
Section 7.1 (Absolute Maximum Ratings): Updated table.Go
-
Section 7.4 (Recommended Operating Conditions): Updated SRSUPPLY values and
unit.Go
-
Section 7.6 (Electrical Characteristics): Updated ROH and ROL
values.Go
-
Section 7.3 (ESD Ratings – Automotive): Removed F280024, F280024C, and F280022
data.Go
-
Section 7.5.3 (Current Consumption Graphs): Added section.Go
-
Section 7.5.4 (Reducing
Current Consumption): Updated section.Go
-
Section 7.5.4.1 (Typical Current Reduction per Disabled Peripheral): Updated
table.Go
-
Section 7.7 (Thermal Resistance Characteristics for PN Package): Added
section.Go
-
Section 7.8 (Thermal
Resistance Characteristics for PM Package): Added section.Go
-
Section 7.9 (Thermal
Resistance Characteristics for PT Package): Added section.Go
-
Section 7.11.2.2.1 (Reset (XRSn) Timing Requirements): Updated
tw(RSL2).Go
-
Section 7.11.2.2.2 (Reset
(XRSn) Switching Characteristics): Added
tboot-flash.Go
-
Figure 7-8 (Power-on Reset): Updated figure.Go
-
Section 7.11.3.2.1.6 (Internal Clock Frequencies): Updated MAX
f(VCOCLK).Go
-
Section 7.11.3.5 (Internal Oscillators): Updated
section.Go
-
Section 7.11.3.5.1 (INTOSC Characteristics): Updated fINTOSC MIN values and MAX
values.Go
-
Section 7.11.4 (Flash
Parameters): Updated section.Go
-
Table 7-4 (Minimum Required Flash Wait States with Different Clock Sources and
Frequencies): Updated table and footnotes.Go
-
Table 7-5
(Flash Parameters): Added "The on-chip flash memory is in an erased state ..."
footnote.Go
-
Section 7.11.5
(Emulation/JTAG): Updated link of Hardware Breakpoints and
Watchpoints for C28x in CCS.Go
-
Figure 7-31 (Analog
Group Connections): Added figure.Go
-
Figure 7-35 (ADC
Timings): Updated tINT.Go
-
Section 7.14.2.1.1 (I2C Timing Requirements): Updated table.Go
-
Section 7.14.2.1.2 (I2C Switching Characteristics): Updated table.Go
-
Figure 7-54 (I2C Timing Diagram): Added figure.Go
-
Figure 7-56 (SCI Block Diagram): Updated figure.Go
-
Figure 7-59 (SPI Master Mode External Timing (Clock Phase = 1)):
Updated parameter 24.Go
-
Section 7.14.5.2.1 (SPI Slave Mode Timing Requirements): Updated MIN value of
tsu(STE)S.Go
-
Section 7.14.8 (Host
Interface Controller (HIC)): Updated list of features.Go
-
Figure 7-70 (HIC
Block Diagram): Updated figure.Go
-
Section 7.14.8.1.1 (HIC Timing Requirements): Updated table.Go
-
Section 7.14.8.1.2 (HIC Switching Characteristics): Updated table.Go
-
Figure 7-71
(Read/Write Operation With nOE and nWE Pins): Added figure.Go
-
Figure 7-72
(Read/Write Operation With RnW Pin): Added figure.Go
-
Figure 8-1 (Functional Block Diagram): Added "Secure Memories shown in Red" legend
box.Go
-
Table 8-2 (Addresses of Flash Sectors): Updated table.Go
-
Table 8-4 (Device Identification Registers): Removed PARTIDH for TMS320F280024,
TMS320F280024C, and TMS320F280022.Go
-
Table 8-4: Added REVID for Revision A silicon.Go
-
Table 8-4: Updated ADDRESS of UID_UNIQUE.Go
-
Section 8.10 (Device
Boot Modes): Updated section.Go
-
Section 8.10.1 (Device
Boot Configurations): Added Note about CAN boot mode turning on the
XTAL.Go
-
Figure 8-3 (Windowed Watchdog): Removed SCSR.WDOVERRIDE.Go
-
Section 9.1
(TI Reference Design): Updated section.Go
- Removed Related Links section (Section 10.5 in
SPRSP45).Go
-
Section 10.1 (Getting
Started and Next Steps): Added section.Go
-
Section 10.2 (Device
and Development Support Tool Nomenclature): Updated section.Go
-
Figure 10-1
(Device Nomenclature): Removed 280024, 280024C, and 280022 from
DEVICE.Go
-
Figure 10-2 (Package Symbolization for PM and PN Packages): Updated
figure.Go
-
Figure 10-3
(Package Symbolization for PT Package): Updated figure.Go
-
Table 10-1 (Revision Identification): Added data for Revision A
silicon.Go
-
Section 10.4 (Tools and Software): Updated section.Go
-
Section 10.5 (Documentation Support): Updated section.Go