SPRSP61C October   2021  – December 2023 TMS320F280034 , TMS320F280034-Q1 , TMS320F280036-Q1 , TMS320F280036C-Q1 , TMS320F280037 , TMS320F280037C , TMS320F280037C-Q1 , TMS320F280038C-Q1 , TMS320F280039-Q1 , TMS320F280039C , TMS320F280039C-Q1

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Pin Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes
    3. 5.3 Signal Descriptions
      1. 5.3.1 Analog Signals
      2. 5.3.2 Digital Signals
      3. 5.3.3 Power and Ground
      4. 5.3.4 Test, JTAG, and Reset
    4. 5.4 Pin Multiplexing
      1. 5.4.1 GPIO Muxed Pins
        1. 5.4.1.1 GPIO Muxed Pins
      2. 5.4.2 Digital Inputs on ADC Pins (AIOs)
      3. 5.4.3 Digital Inputs and Outputs on ADC Pins (AGPIOs)
      4. 5.4.4 GPIO Input X-BAR
      5. 5.4.5 GPIO Output X-BAR, CLB X-BAR, CLB Output X-BAR, and ePWM X-BAR
    5. 5.5 Pins With Internal Pullup and Pulldown
    6. 5.6 Connections for Unused Pins
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings – Commercial
    3. 6.3  ESD Ratings – Automotive
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Power Consumption Summary
      1. 6.5.1 System Current Consumption
      2. 6.5.2 System Current Consumption - VREG Disable - External Supply
      3. 6.5.3 Operating Mode Test Description
      4. 6.5.4 Current Consumption Graphs
      5. 6.5.5 Reducing Current Consumption
        1. 6.5.5.1 Typical Current Reduction per Disabled Peripheral
    6. 6.6  Electrical Characteristics
    7. 6.7  Thermal Resistance Characteristics for PZ Package
    8. 6.8  Thermal Resistance Characteristics for PN Package
    9. 6.9  Thermal Resistance Characteristics for PM Package
    10. 6.10 Thermal Resistance Characteristics for PT Package
    11. 6.11 Thermal Design Considerations
    12. 6.12 System
      1. 6.12.1 Power Management Module (PMM)
        1. 6.12.1.1 Introduction
        2. 6.12.1.2 Overview
          1. 6.12.1.2.1 Power Rail Monitors
            1. 6.12.1.2.1.1 I/O POR (Power-On Reset) Monitor
            2. 6.12.1.2.1.2 I/O BOR (Brown-Out Reset) Monitor
            3. 6.12.1.2.1.3 VDD POR (Power-On Reset) Monitor
          2. 6.12.1.2.2 External Supervisor Usage
          3. 6.12.1.2.3 Delay Blocks
          4. 6.12.1.2.4 Internal 1.2-V LDO Voltage Regulator (VREG)
          5. 6.12.1.2.5 VREGENZ
        3. 6.12.1.3 External Components
          1. 6.12.1.3.1 Decoupling Capacitors
            1. 6.12.1.3.1.1 VDDIO Decoupling
            2. 6.12.1.3.1.2 VDD Decoupling
        4. 6.12.1.4 Power Sequencing
          1. 6.12.1.4.1 Supply Pins Ganging
          2. 6.12.1.4.2 Signal Pins Power Sequence
          3. 6.12.1.4.3 Supply Pins Power Sequence
            1. 6.12.1.4.3.1 External VREG/VDD Mode Sequence
            2. 6.12.1.4.3.2 Internal VREG/VDD Mode Sequence
            3. 6.12.1.4.3.3 Supply Sequencing Summary and Effects of Violations
            4. 6.12.1.4.3.4 Supply Slew Rate
        5. 6.12.1.5 Power Management Module Electrical Data and Timing
          1. 6.12.1.5.1 Power Management Module Operating Conditions
          2. 6.12.1.5.2 Power Management Module Characteristics
          3.        Supply Voltages
      2. 6.12.2 Reset Timing
        1. 6.12.2.1 Reset Sources
        2. 6.12.2.2 Reset Electrical Data and Timing
          1. 6.12.2.2.1 Reset - XRSn - Timing Requirements
          2. 6.12.2.2.2 Reset - XRSn - Switching Characteristics
          3. 6.12.2.2.3 Reset Timing Diagrams
      3. 6.12.3 Clock Specifications
        1. 6.12.3.1 Clock Sources
        2. 6.12.3.2 Clock Frequencies, Requirements, and Characteristics
          1. 6.12.3.2.1 Input Clock Frequency and Timing Requirements, PLL Lock Times
            1. 6.12.3.2.1.1 Input Clock Frequency
            2. 6.12.3.2.1.2 XTAL Oscillator Characteristics
            3. 6.12.3.2.1.3 X1 Input Level Characteristics When Using an External Clock Source - Not a Crystal
            4. 6.12.3.2.1.4 X1 Timing Requirements
            5. 6.12.3.2.1.5 AUXCLKIN Timing Requirements
            6. 6.12.3.2.1.6 APLL Characteristics
            7. 6.12.3.2.1.7 XCLKOUT Switching Characteristics - PLL Bypassed or Enabled
            8. 6.12.3.2.1.8 Internal Clock Frequencies
        3. 6.12.3.3 Input Clocks and PLLs
        4. 6.12.3.4 XTAL Oscillator
          1. 6.12.3.4.1 Introduction
          2. 6.12.3.4.2 Overview
            1. 6.12.3.4.2.1 Electrical Oscillator
              1. 6.12.3.4.2.1.1 Modes of Operation
                1. 6.12.3.4.2.1.1.1 Crystal Mode of Operation
                2. 6.12.3.4.2.1.1.2 Single-Ended Mode of Operation
              2. 6.12.3.4.2.1.2 XTAL Output on XCLKOUT
            2. 6.12.3.4.2.2 Quartz Crystal
            3. 6.12.3.4.2.3 GPIO Modes of Operation
          3. 6.12.3.4.3 Functional Operation
            1. 6.12.3.4.3.1 ESR – Effective Series Resistance
            2. 6.12.3.4.3.2 Rneg – Negative Resistance
            3. 6.12.3.4.3.3 Start-up Time
              1. 6.12.3.4.3.3.1 X1/X2 Precondition
            4. 6.12.3.4.3.4 DL – Drive Level
          4. 6.12.3.4.4 How to Choose a Crystal
          5. 6.12.3.4.5 Testing
          6. 6.12.3.4.6 Common Problems and Debug Tips
          7. 6.12.3.4.7 Crystal Oscillator Specifications
            1. 6.12.3.4.7.1 Crystal Oscillator Parameters
            2. 6.12.3.4.7.2 Crystal Equivalent Series Resistance (ESR) Requirements
            3. 6.12.3.4.7.3 Crystal Oscillator Electrical Characteristics
        5. 6.12.3.5 Internal Oscillators
          1. 6.12.3.5.1 INTOSC Characteristics
      4. 6.12.4 Flash Parameters
        1. 6.12.4.1 Flash Parameters 
      5. 6.12.5 RAM and ROM Parameters
      6. 6.12.6 Emulation/JTAG
        1. 6.12.6.1 JTAG Electrical Data and Timing
          1. 6.12.6.1.1 JTAG Timing Requirements
          2. 6.12.6.1.2 JTAG Switching Characteristics
          3. 6.12.6.1.3 JTAG Timing Diagram
        2. 6.12.6.2 cJTAG Electrical Data and Timing
          1. 6.12.6.2.1 cJTAG Timing Requirements
          2. 6.12.6.2.2 cJTAG Switching Characteristics
          3. 6.12.6.2.3 cJTAG Timing Diagram
      7. 6.12.7 GPIO Electrical Data and Timing
        1. 6.12.7.1 GPIO – Output Timing
          1. 6.12.7.1.1 General-Purpose Output Switching Characteristics
          2. 6.12.7.1.2 General-Purpose Output Timing Diagram
        2. 6.12.7.2 GPIO – Input Timing
          1. 6.12.7.2.1 General-Purpose Input Timing Requirements
          2. 6.12.7.2.2 Sampling Mode
        3. 6.12.7.3 Sampling Window Width for Input Signals
      8. 6.12.8 Interrupts
        1. 6.12.8.1 External Interrupt (XINT) Electrical Data and Timing
          1. 6.12.8.1.1 External Interrupt Timing Requirements
          2. 6.12.8.1.2 External Interrupt Switching Characteristics
          3. 6.12.8.1.3 External Interrupt Timing
      9. 6.12.9 Low-Power Modes
        1. 6.12.9.1 Clock-Gating Low-Power Modes
        2. 6.12.9.2 Low-Power Mode Wake-up Timing
          1. 6.12.9.2.1 IDLE Mode Timing Requirements
          2. 6.12.9.2.2 IDLE Mode Switching Characteristics
          3. 6.12.9.2.3 IDLE Entry and Exit Timing Diagram
          4. 6.12.9.2.4 STANDBY Mode Timing Requirements
          5. 6.12.9.2.5 STANDBY Mode Switching Characteristics
          6. 6.12.9.2.6 STANDBY Entry and Exit Timing Diagram
          7. 6.12.9.2.7 HALT Mode Timing Requirements
          8. 6.12.9.2.8 HALT Mode Switching Characteristics
          9. 6.12.9.2.9 HALT Entry and Exit Timing Diagram
    13. 6.13 Analog Peripherals
      1. 6.13.1 Analog Pins and Internal Connections
      2. 6.13.2 Analog Signal Descriptions
      3. 6.13.3 Analog-to-Digital Converter (ADC)
        1. 6.13.3.1 ADC Configurability
          1. 6.13.3.1.1 Signal Mode
        2. 6.13.3.2 ADC Electrical Data and Timing
          1. 6.13.3.2.1 ADC Operating Conditions
          2. 6.13.3.2.2 ADC Characteristics
          3. 6.13.3.2.3 ADC Input Model
          4. 6.13.3.2.4 ADC Timing Diagrams
      4. 6.13.4 Temperature Sensor
        1. 6.13.4.1 Temperature Sensor Electrical Data and Timing
          1. 6.13.4.1.1 Temperature Sensor Characteristics
      5. 6.13.5 Comparator Subsystem (CMPSS)
        1. 6.13.5.1 CMPSS Connectivity Diagram
        2. 6.13.5.2 Block Diagram
        3. 6.13.5.3 CMPSS Electrical Data and Timing
          1. 6.13.5.3.1 Comparator Electrical Characteristics
          2.        CMPSS Comparator Input Referred Offset and Hysteresis
          3. 6.13.5.3.2 CMPSS DAC Static Electrical Characteristics
          4. 6.13.5.3.3 CMPSS Illustrative Graphs
          5. 6.13.5.3.4 CMPSS DAC Dynamic Error
      6. 6.13.6 Buffered Digital-to-Analog Converter (DAC)
        1. 6.13.6.1 Buffered DAC Electrical Data and Timing
          1. 6.13.6.1.1 Buffered DAC Operating Conditions
          2. 6.13.6.1.2 Buffered DAC Electrical Characteristics
    14. 6.14 Control Peripherals
      1. 6.14.1 Enhanced Pulse Width Modulator (ePWM)
        1. 6.14.1.1 ePWM Electrical Data and Timing
          1. 6.14.1.1.1 ePWM Timing Requirements
          2. 6.14.1.1.2 ePWM Switching Characteristics
          3. 6.14.1.1.3 Trip-Zone Input Timing
            1. 6.14.1.1.3.1 Trip-Zone Input Timing Requirements
            2. 6.14.1.1.3.2 PWM Hi-Z Characteristics Timing Diagram
      2. 6.14.2 High-Resolution Pulse Width Modulator (HRPWM)
        1. 6.14.2.1 HRPWM Electrical Data and Timing
          1. 6.14.2.1.1 High-Resolution PWM Characteristics
      3. 6.14.3 External ADC Start-of-Conversion Electrical Data and Timing
        1. 6.14.3.1 External ADC Start-of-Conversion Switching Characteristics
        2. 6.14.3.2 ADCSOCAO or ADCSOCBO Timing Diagram
      4. 6.14.4 Enhanced Capture (eCAP)
        1. 6.14.4.1 eCAP and HRCAP Block Diagram
        2. 6.14.4.2 eCAP Synchronization
        3. 6.14.4.3 eCAP Electrical Data and Timing
          1. 6.14.4.3.1 eCAP Timing Requirements
          2. 6.14.4.3.2 eCAP Switching Characteristics
      5. 6.14.5 High-Resolution Capture (HRCAP)
        1. 6.14.5.1 eCAP and HRCAP Block Diagram
        2. 6.14.5.2 HRCAP Electrical Data and Timing
          1. 6.14.5.2.1 HRCAP Switching Characteristics
          2. 6.14.5.2.2 HRCAP Figure and Graph
      6. 6.14.6 Enhanced Quadrature Encoder Pulse (eQEP)
        1. 6.14.6.1 eQEP Electrical Data and Timing
          1. 6.14.6.1.1 eQEP Timing Requirements
          2. 6.14.6.1.2 eQEP Switching Characteristics
      7. 6.14.7 Sigma-Delta Filter Module (SDFM)
        1. 6.14.7.1 SDFM Electrical Data and Timing
          1. 6.14.7.1.1 SDFM Timing Requirements When Using Asynchronous GPIO - ASYNC - Option
    15. 6.15 Communications Peripherals
      1. 6.15.1 Controller Area Network (CAN)
      2. 6.15.2 Modular Controller Area Network (MCAN)
      3. 6.15.3 Inter-Integrated Circuit (I2C)
        1. 6.15.3.1 I2C Electrical Data and Timing
          1. 6.15.3.1.1 I2C Timing Requirements
          2. 6.15.3.1.2 I2C Switching Characteristics
          3. 6.15.3.1.3 I2C Timing Diagram
      4. 6.15.4 Power Management Bus (PMBus) Interface
        1. 6.15.4.1 PMBus Electrical Data and Timing
          1. 6.15.4.1.1 PMBus Electrical Characteristics
          2. 6.15.4.1.2 PMBus Fast Mode Switching Characteristics
          3. 6.15.4.1.3 PMBus Standard Mode Switching Characteristics
      5. 6.15.5 Serial Communications Interface (SCI)
      6. 6.15.6 Serial Peripheral Interface (SPI)
        1. 6.15.6.1 SPI Master Mode Timings
          1. 6.15.6.1.1 SPI Master Mode Timing Requirements
          2. 6.15.6.1.2 SPI Master Mode Switching Characteristics - Clock Phase  0
          3. 6.15.6.1.3 SPI Master Mode Switching Characteristics - Clock Phase  1
          4. 6.15.6.1.4 SPI Master Mode Timing Diagrams
        2. 6.15.6.2 SPI Slave Mode Timings
          1. 6.15.6.2.1 SPI Slave Mode Timing Requirements
          2. 6.15.6.2.2 SPI Slave Mode Switching Characteristics
          3. 6.15.6.2.3 SPI Slave Mode Timing Diagrams
      7. 6.15.7 Local Interconnect Network (LIN)
      8. 6.15.8 Fast Serial Interface (FSI)
        1. 6.15.8.1 FSI Transmitter
          1. 6.15.8.1.1 FSITX Electrical Data and Timing
            1. 6.15.8.1.1.1 FSITX Switching Characteristics
            2. 6.15.8.1.1.2 FSITX Timings
        2. 6.15.8.2 FSI Receiver
          1. 6.15.8.2.1 FSIRX Electrical Data and Timing
            1. 6.15.8.2.1.1 FSIRX Timing Requirements
            2. 6.15.8.2.1.2 FSIRX Switching Characteristics
            3. 6.15.8.2.1.3 FSIRX Timings
        3. 6.15.8.3 FSI SPI Compatibility Mode
          1. 6.15.8.3.1 FSITX SPI Signaling Mode Electrical Data and Timing
            1. 6.15.8.3.1.1 FSITX SPI Signaling Mode Switching Characteristics
            2. 6.15.8.3.1.2 FSITX SPI Signaling Mode Timings
      9. 6.15.9 Host Interface Controller (HIC)
        1. 6.15.9.1 HIC Electrical Data and Timing
          1. 6.15.9.1.1 HIC Timing Requirements
          2. 6.15.9.1.2 HIC Switching Characteristics
          3. 6.15.9.1.3 HIC Timing Diagrams
  8. 7 Detailed Description
    1. 7.1  Overview
    2. 7.2  Functional Block Diagram
    3. 7.3  Memory
      1. 7.3.1 Memory Map
        1. 7.3.1.1 Dedicated RAM (Mx RAM)
        2. 7.3.1.2 Local Shared RAM (LSx RAM)
        3. 7.3.1.3 Global Shared RAM (GSx RAM)
        4. 7.3.1.4 Message RAM
      2. 7.3.2 Control Law Accelerator (CLA) Memory Map
      3. 7.3.3 Flash Memory Map
        1. 7.3.3.1 Addresses of Flash Sectors
      4. 7.3.4 Peripheral Registers Memory Map
    4. 7.4  Identification
    5. 7.5  Bus Architecture – Peripheral Connectivity
    6. 7.6  C28x Processor
      1. 7.6.1 Floating-Point Unit (FPU)
      2. 7.6.2 Fast Integer Division Unit
      3. 7.6.3 Trigonometric Math Unit (TMU)
      4. 7.6.4 VCRC Unit
    7. 7.7  Control Law Accelerator (CLA)
    8. 7.8  Embedded Real-Time Analysis and Diagnostic (ERAD)
    9. 7.9  Background CRC-32 (BGCRC)
    10. 7.10 Direct Memory Access (DMA)
    11. 7.11 Device Boot Modes
      1. 7.11.1 Device Boot Configurations
        1. 7.11.1.1 Configuring Boot Mode Pins
        2. 7.11.1.2 Configuring Boot Mode Table Options
      2. 7.11.2 GPIO Assignments
    12. 7.12 Security
      1. 7.12.1 Securing the Boundary of the Chip
        1. 7.12.1.1 JTAGLOCK
        2. 7.12.1.2 Zero-pin Boot
      2. 7.12.2 Dual-Zone Security
      3. 7.12.3 Disclaimer
    13. 7.13 Watchdog
    14. 7.14 C28x Timers
    15. 7.15 Dual-Clock Comparator (DCC)
      1. 7.15.1 Features
      2. 7.15.2 Mapping of DCCx Clock Source Inputs
    16. 7.16 Configurable Logic Block (CLB)
    17. 7.17 Functional Safety
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Applications and Implementation
    2. 8.2 Key Device Features
    3. 8.3 Application Information
      1. 8.3.1 Typical Application
        1. 8.3.1.1 Automotive Pump
          1. 8.3.1.1.1 System Block Diagram
          2. 8.3.1.1.2 Automotive Pump Resources
        2. 8.3.1.2 Automotive HVAC Compressor
          1. 8.3.1.2.1 System Block Diagram
          2. 8.3.1.2.2 HVAC Resources
        3. 8.3.1.3 On-Board Charger (OBC)
          1. 8.3.1.3.1 System Block Diagram
          2. 8.3.1.3.2 OBC Resources
        4. 8.3.1.4 Servo Drive Control Module
          1. 8.3.1.4.1 System Block Diagram
          2. 8.3.1.4.2 Servo Drive Control Module Resources
        5. 8.3.1.5 Solar Micro Inverter
          1. 8.3.1.5.1 System Block Diagram
          2. 8.3.1.5.2 Solar Micro Inverter Resources
        6. 8.3.1.6 Merchant Telecom Rectifiers
          1. 8.3.1.6.1 System Block Diagram
          2. 8.3.1.6.2 Merchant Telecom Rectifiers Resources
  10. 9 Device and Documentation Support
    1. 9.1 Getting Started and Next Steps
    2. 9.2 Device Nomenclature
    3. 9.3 Markings
    4. 9.4 Tools and Software
    5. 9.5 Documentation Support
    6. 9.6 Support Resources
    7. 9.7 Trademarks
    8. 9.8 Electrostatic Discharge Caution
    9. 9.9 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.4 Tools and Software

TI offers an extensive line of development tools. Some of the tools and software to evaluate the performance of the device, generate code, and develop solutions follow. To view all available tools and software for C2000™ real-time control MCUs, visit the C2000 real-time control MCUs – Design & development page.

Development Tools

TMDSCNCD280039C Control Card
The F280039C controlCARD is an HSEC180 controlCARD based evaluation and development tool for the C2000™ F28003x series of microcontroller products. controlCARDs are ideal to use for initial evaluation and system prototyping. controlCARDs are complete board-level modules that utilize one of two standard form factors (100-pin DIMM or 180-pin HSEC ) to provide a low-profile single-board controller solution. For first evaluation controlCARDs are typically purchased bundled with a baseboard or bundled in an application kit.

HSEC180 controlCARD Baseboard Docking Station
TMDSHSECDOCK is a baseboard that provides header pin access to key signals on compatible HSEC180-based controlCARDs. A breadboard area is available for rapid prototyping. Board power can be provided by the provided USB cable or a 5-V barrel supply.

XDS110 JTAG Debug Probe
The Texas Instruments XDS110 is a new class of debug probe (emulator) for TI embedded processors. The XDS110 replaces the XDS100 family while supporting a wider variety of standards (IEEE1149.1, IEEE1149.7, SWD) in a single pod. Also, all XDS debug probes support Core and System Trace in all Arm® and DSP processors that feature an Embedded Trace Buffer (ETB). For Core Trace over pins the XDS560v2 PRO TRACE Receiver & Debug Probe is required.

XDS200 USB Debug Probe
The XDS200 is a debug probe (emulator) used for debugging TI embedded devices. The XDS200 features a balance of low cost with good performance as compared to the low cost XDS110 and the high performance XDS560v2. It supports a wide variety of standards (IEEE1149.1, IEEE1149.7, SWD) in a single pod. All XDS debug probes support Core and System Trace in all Arm® and DSP processors that feature an Embedded Trace Buffer (ETB). For Core Trace over pins the XDS560v2 PRO TRACE Receiver & Debug Probe is required.

XDS560v2 System Trace USB Debug Probe
The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

Software Tools

C2000™ Software Guide
C2000™ real-time controllers are a portfolio of high-performance microcontrollers that are purpose-built to control power electronics and provide advanced digital signal processing for industrial and automotive applications. Software components to program various modules in C2000 MCUs are released as part of C2000 software releases. This guide provides an overview of various software components and available functionality.

C2000Ware for C2000 MCUs
C2000Ware for C2000™ MCUs is a cohesive set of software and documentation created to minimize development time. It includes device-specific drivers, libraries, and peripheral examples.

Digital Power SDK
Digital Power SDK is a cohesive set of software infrastructure, tools, and documentation designed to minimize C2000 MCU-based digital power system development time targeted for various AC-DC, DC-DC and DC-AC power supply applications. The software includes firmware that runs on C2000 digital power evaluation modules (EVMs) and reference designs, which are targeted for solar, telecom, server, electric vehicle chargers and industrial power delivery applications. Digital Power SDK provides all the needed resources at every stage of development and evaluation in a digital power applications.

Motor Control SDK
Motor Control SDK is a cohesive set of software infrastructure, tools, and documentation designed to minimize C2000 MCU-based motor control system development time targeted for various three-phase motor control applications. The software includes firmware that runs on C2000 motor control evaluation modules (EVMs) and reference designs, which are targeted for industrial drive and other motor control, Motor Control SDK provides all the needed resources at every stage of development and evaluation for high-performance motor control applications.

Code Composer Studio™ (CCS) Integrated Development Environment (IDE) for C2000 microcontrollers
Code Composer Studio is an integrated development environment (IDE) that supports TI's Microcontroller and Embedded Processors portfolio. Code Composer Studio comprises a suite of tools used to develop and debug embedded applications. It includes an optimizing C/C++ compiler, source code editor, project build environment, debugger, profiler, and many other features. The intuitive IDE provides a single user interface taking the user through each step of the application development flow. Familiar tools and interfaces allow users to get started faster than ever before. Code Composer Studio combines the advantages of the Eclipse software framework with advanced embedded debug capabilities from TI resulting in a compelling feature-rich development environment for embedded developers.

TI Resource Explorer
To enhance your experience, be sure to check out the TI Resource Explorer to browse examples, libraries, and documentation for your applications.

SysConfig System configuration tool
SysConfig is a comprehensive collection of graphical utilities for configuring pins, peripherals, radios, subsystems, and other components. SysConfig helps you manage, expose and resolve conflicts visually so that you have more time to create differentiated applications. The tool's output includes C header and code files that can be used with software development kit (SDK) examples or used to configure custom software. The SysConfig tool automatically selects the pinmux settings that satisfy the entered requirements. The SysConfig tool is delivered integrated in CCS, as a standalone installer, or can be used via the dev.ti.com cloud tools portal. For more information about the SysConfig system configuration tool, visit the System configuration tool page.

C2000 Third-party search tool
TI has partnered with multiple companies to offer a wide range of solutions and services for TI C2000 devices. These companies can accelerate your path to production using C2000 devices. Download this search tool to quickly browse third-party details and find the right third-party to meet your needs.

UniFlash Standalone Flash Tool
UniFlash is a standalone tool used to program on-chip flash memory through a GUI, command line, or scripting interface.

C2000 code generation tools - compiler
The TI C2000 C/C++ Compiler and Assembly Language Tools support development of applications for TI C2000 Microcontroller platforms, including the Concerto (F28M3xx), Entry-Performance (280xx), Premium-Performance Floating-Point (283xx), and C2000 Fixed-Point (2823x/280x/281x) Microcontroller devices.

Models

Various models are available for download from the product Design & development pages. These models include I/O Buffer Information Specification (IBIS) Models and Boundary-Scan Description Language (BSDL) Models. To view all available models, visit the Design tools & simulation subsection of the Design & development section of each device product page.

Training

To help assist design engineers in taking full advantage of the C2000 microcontroller features and performance, TI has developed a variety of training resources. Utilizing the online training materials and downloadable hands-on workshops provides an easy means for gaining a complete working knowledge of the C2000 microcontroller family. These training resources have been designed to decrease the learning curve, while reducing development time, and accelerating product time to market. For more information on the various training resources, visit the C2000™ real-time control MCUs – Support & training site. Additionally, the C2000 Academy course provides new users with a way to ramp quickly with C2000 devices and their many features. This is a great entry point for users getting started with C2000, and is available at the C2000 Academy resource explorer page.