SPRS797C November   2012  – October 2018 TMS320F28050 , TMS320F28051 , TMS320F28052 , TMS320F28053 , TMS320F28054 , TMS320F28055

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
      1. Table 5-1 TMS320F2805x Current Consumption at 60-MHz SYSCLKOUT
      2. 5.4.1     Reducing Current Consumption
      3. 5.4.2     Current Consumption Graphs (VREG Enabled)
    5. 5.5  Electrical Characteristics
    6. 5.6  Thermal Resistance Characteristics for PN Package
    7. 5.7  Thermal Design Considerations
    8. 5.8  Emulator Connection Without Signal Buffering for the MCU
    9. 5.9  Parameter Information
      1. 5.9.1 Timing Parameter Symbology
      2. 5.9.2 General Notes on Timing Parameters
    10. 5.10 Test Load Circuit
    11. 5.11 Power Sequencing
      1. Table 5-3 Reset (XRS) Timing Requirements
      2. Table 5-4 Reset (XRS) Switching Characteristics
    12. 5.12 Clock Specifications
      1. 5.12.1 Device Clock Table
        1. Table 5-5 2805x Clock Table and Nomenclature (60-MHz Devices)
        2. Table 5-6 Device Clocking Requirements/Characteristics
        3. Table 5-7 Internal Zero-Pin Oscillator (INTOSC1, INTOSC2) Characteristics
      2. 5.12.2 Clock Requirements and Characteristics
        1. Table 5-8  XCLKIN Timing Requirements - PLL Enabled
        2. Table 5-9  XCLKIN Timing Requirements - PLL Disabled
        3. Table 5-10 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
    13. 5.13 Flash Timing
      1. Table 5-11 Flash/OTP Endurance for T Temperature Material
      2. Table 5-12 Flash/OTP Endurance for S Temperature Material
      3. Table 5-13 Flash/OTP Endurance for Q Temperature Material
      4. Table 5-14 Flash Parameters at 60-MHz SYSCLKOUT
      5. Table 5-15 Flash/OTP Access Timing
      6. Table 5-16 Flash Data Retention Duration
  6. 6Detailed Description
    1. 6.1 Overview
      1. 6.1.1  CPU
      2. 6.1.2  Control Law Accelerator
      3. 6.1.3  Memory Bus (Harvard Bus Architecture)
      4. 6.1.4  Peripheral Bus
      5. 6.1.5  Real-Time JTAG and Analysis
      6. 6.1.6  Flash
      7. 6.1.7  M0, M1 SARAMs
      8. 6.1.8  L0 SARAM, and L1, L2, and L3 DPSARAMs
      9. 6.1.9  Boot ROM
        1. 6.1.9.1 Emulation Boot
        2. 6.1.9.2 GetMode
        3. 6.1.9.3 Peripheral Pins Used by the Bootloader
      10. 6.1.10 Security
      11. 6.1.11 Peripheral Interrupt Expansion Block
      12. 6.1.12 External Interrupts (XINT1 to XINT3)
      13. 6.1.13 Internal Zero-Pin Oscillators, Oscillator, and PLL
      14. 6.1.14 Watchdog
      15. 6.1.15 Peripheral Clocking
      16. 6.1.16 Low-power Modes
      17. 6.1.17 Peripheral Frames 0, 1, 2, 3 (PFn)
      18. 6.1.18 General-Purpose Input/Output Multiplexer
      19. 6.1.19 32-Bit CPU-Timers (0, 1, 2)
      20. 6.1.20 Control Peripherals
      21. 6.1.21 Serial Port Peripherals
    2. 6.2 Memory Maps
    3. 6.3 Register Map
    4. 6.4 Device Emulation Registers
    5. 6.5 VREG, BOR, POR
      1. 6.5.1 On-chip VREG
        1. 6.5.1.1 Using the On-chip VREG
        2. 6.5.1.2 Disabling the On-chip VREG
      2. 6.5.2 On-chip Power-On Reset and Brownout Reset Circuit
    6. 6.6 System Control
      1. 6.6.1 Internal Zero-Pin Oscillators
      2. 6.6.2 Crystal Oscillator Option
      3. 6.6.3 PLL-Based Clock Module
      4. 6.6.4 Loss of Input Clock (NMI-watchdog Function)
      5. 6.6.5 CPU-watchdog Module
    7. 6.7 Low-power Modes Block
    8. 6.8 Interrupts
      1. 6.8.1 External Interrupts
        1. 6.8.1.1 External Interrupt Electrical Data/Timing
          1. Table 6-26 External Interrupt Timing Requirements
          2. Table 6-27 External Interrupt Switching Characteristics
    9. 6.9 Peripherals
      1. 6.9.1  Control Law Accelerator
        1. 6.9.1.1 CLA Device-Specific Information
        2. 6.9.1.2 CLA Register Descriptions
      2. 6.9.2  Analog Block
        1. 6.9.2.1 Analog-to-Digital Converter
          1. 6.9.2.1.1 ADC Device-Specific Information
          2. 6.9.2.1.2 ADC Electrical Data/Timing
            1. Table 6-32  ADC Electrical Characteristics
            2. Table 6-34  ADC Power Modes
            3. 6.9.2.1.2.1 External ADC Start-of-Conversion Electrical Data/Timing
              1. Table 6-35 External ADC Start-of-Conversion Switching Characteristics
            4. 6.9.2.1.2.2 Internal Temperature Sensor
              1. Table 6-36 Temperature Sensor Coefficient
            5. 6.9.2.1.2.3 ADC Power-Up Control Bit Timing
              1. Table 6-37 ADC Power-Up Delays
            6. 6.9.2.1.2.4 ADC Sequential and Simultaneous Timings
        2. 6.9.2.2 Analog Front End
          1. 6.9.2.2.1 AFE Device-Specific Information
          2. 6.9.2.2.2 AFE Register Descriptions
          3. 6.9.2.2.3 PGA Electrical Data/Timing
          4. 6.9.2.2.4 Comparator Block Electrical Data/Timing
            1. Table 6-45 Electrical Characteristics of the Comparator/DAC
          5. 6.9.2.2.5 VREFOUT Buffered DAC Electrical Data
            1. Table 6-46 Electrical Characteristics of VREFOUT Buffered DAC
      3. 6.9.3  Detailed Descriptions
      4. 6.9.4  Serial Peripheral Interface
        1. 6.9.4.1 SPI Device-Specific Information
        2. 6.9.4.2 SPI Register Descriptions
        3. 6.9.4.3 SPI Master Mode Electrical Data/Timing
          1. Table 6-48 SPI Master Mode External Timing (Clock Phase = 0)
          2. Table 6-49 SPI Master Mode External Timing (Clock Phase = 1)
        4. 6.9.4.4 SPI Slave Mode Electrical Data/Timing
          1. Table 6-50 SPI Slave Mode External Timing (Clock Phase = 0)
          2. Table 6-51 SPI Slave Mode External Timing (Clock Phase = 1)
      5. 6.9.5  Serial Communications Interface
        1. 6.9.5.1 SCI Device-Specific Information
        2. 6.9.5.2 SCI Register Descriptions
      6. 6.9.6  Enhanced Controller Area Network
        1. 6.9.6.1 eCAN Device-Specific Information
        2. 6.9.6.2 eCAN Register Descriptions
      7. 6.9.7  Inter-Integrated Circuit
        1. 6.9.7.1 I2C Device-Specific Information
        2. 6.9.7.2 I2C Register Descriptions
        3. 6.9.7.3 I2C Electrical Data/Timing
          1. Table 6-58 I2C Timing Requirements
          2. Table 6-59 I2C Switching Characteristics
      8. 6.9.8  Enhanced Pulse Width Modulator
        1. 6.9.8.1 ePWM Device-Specific Information
        2. 6.9.8.2 ePWM Register Descriptions
        3. 6.9.8.3 ePWM Electrical Data/Timing
          1. Table 6-62 ePWM Timing Requirements
          2. Table 6-63 ePWM Switching Characteristics
          3. 6.9.8.3.1  Trip-Zone Input Timing
            1. Table 6-64 Trip-Zone Input Timing Requirements
      9. 6.9.9  Enhanced Capture Module
        1. 6.9.9.1 eCAP Module Device-Specific Information
        2. 6.9.9.2 eCAP Module Register Descriptions
        3. 6.9.9.3 eCAP Module Electrical Data/Timing
          1. Table 6-66 eCAP Timing Requirement
          2. Table 6-67 eCAP Switching Characteristics
      10. 6.9.10 Enhanced Quadrature Encoder Pulse
        1. 6.9.10.1 eQEP Device-Specific Information
        2. 6.9.10.2 eQEP Register Descriptions
        3. 6.9.10.3 eQEP Electrical Data/Timing
          1. Table 6-69 eQEP Timing Requirements
          2. Table 6-70 eQEP Switching Characteristics
      11. 6.9.11 JTAG Port
        1. 6.9.11.1 JTAG Port Device-Specific Information
      12. 6.9.12 General-Purpose Input/Output
        1. 6.9.12.1 GPIO Device-Specific Information
        2. 6.9.12.2 GPIO Register Descriptions
        3. 6.9.12.3 GPIO Electrical Data/Timing
          1. 6.9.12.3.1 GPIO - Output Timing
            1. Table 6-74 General-Purpose Output Switching Characteristics
          2. 6.9.12.3.2 GPIO - Input Timing
            1. Table 6-75 General-Purpose Input Timing Requirements
          3. 6.9.12.3.3 Sampling Window Width for Input Signals
          4. 6.9.12.3.4 Low-Power Mode Wakeup Timing
            1. Table 6-76 IDLE Mode Timing Requirements
            2. Table 6-77 IDLE Mode Switching Characteristics
            3. Table 6-78 STANDBY Mode Timing Requirements
            4. Table 6-79 STANDBY Mode Switching Characteristics
            5. Table 6-80 HALT Mode Timing Requirements
            6. Table 6-81 HALT Mode Switching Characteristics
  7. 7Applications, Implementation, and Layout
    1. 7.1 TI Design or Reference Design
  8. 8Device and Documentation Support
    1. 8.1 Getting Started
    2. 8.2 Device and Development Support Tool Nomenclature
    3. 8.3 Tools and Software
    4. 8.4 Documentation Support
    5. 8.5 Related Links
    6. 8.6 Community Resources
    7. 8.7 Trademarks
    8. 8.8 Electrostatic Discharge Caution
    9. 8.9 Glossary
  9. 9Mechanical Packaging and Orderable Information
    1. 9.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Reducing Current Consumption

The 2805x devices incorporate a method to reduce the device current consumption. Because each peripheral unit has an individual clock-enable bit, significant reduction in current consumption can be achieved by turning off the clock to any peripheral module that is not used in a given application. Furthermore, any one of the three low-power modes could be taken advantage of to reduce the current consumption even further. Table 5-2 indicates the typical reduction in current consumption achieved by turning off the clocks.

Table 5-2 Typical Current Consumption by Various Peripherals (at 60 MHz)(1)

PERIPHERAL
MODULE(3)
IDD CURRENT
REDUCTION (mA)
ADC 2(2)
I2C 3
ePWM 2
eCAP 2
eQEP 2
SCI 2
SPI 2
COMP/DAC 1
PGA 2
CPU-TIMER 1
Internal zero-pin oscillator 0.5
CAN 2.5
CLA 20
All peripheral clocks (except CPU Timer clock) are disabled upon reset. Writing to or reading from peripheral registers is possible only after the peripheral clocks are turned on.
This number represents the current drawn by the digital portion of the ADC module. Turning off the clock to the ADC module results in the elimination of the current drawn by the analog portion of the ADC (IDDA) as well.
For peripherals with multiple instances, the current quoted is per module. For example, the 2 mA value quoted for ePWM is for one ePWM module.

NOTE

IDDIO current consumption is reduced by 15 mA (typical) when XCLKOUT is turned off.

NOTE

The baseline IDD current (current when the core is executing a dummy loop with no peripherals enabled) is 40 mA, typical. To arrive at the IDD current for a given application, the current-drawn by the peripherals (enabled by that application) must be added to the baseline IDD current.

Following are other methods to reduce power consumption further:

  • The flash module may be powered down if code is run off SARAM. This method results in a current reduction of 18 mA (typical) in the VDD rail and 13 mA (typical) in the VDDIO rail.
  • Savings in IDDIO may be realized by disabling the pullups on pins that assume an output function.