SPRS698G November   2010  – May 2018 TMS320F28062 , TMS320F28063 , TMS320F28064 , TMS320F28065 , TMS320F28066 , TMS320F28067 , TMS320F28069

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
    5. 1.5 System Device Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings – Commercial
    3. 5.3  ESD Ratings – Automotive
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Power Consumption Summary
      1. Table 5-1 TMS320F2806x Current Consumption at 90-MHz SYSCLKOUT
      2. 5.5.1      Reducing Current Consumption
      3. 5.5.2      Current Consumption Graphs (VREG Enabled)
    6. 5.6  Electrical Characteristics
    7. 5.7  Thermal Resistance Characteristics
      1. 5.7.1 PFP PowerPAD Package
      2. 5.7.2 PZP PowerPAD Package
      3. 5.7.3 PN Package
      4. 5.7.4 PZ Package
    8. 5.8  Thermal Design Considerations
    9. 5.9  Emulator Connection Without Signal Buffering for the MCU
    10. 5.10 Parameter Information
      1. 5.10.1 Timing Parameter Symbology
      2. 5.10.2 General Notes on Timing Parameters
    11. 5.11 Test Load Circuit
    12. 5.12 Power Sequencing
      1. Table 5-3 Reset (XRS) Timing Requirements
      2. Table 5-4 Reset (XRS) Switching Characteristics
    13. 5.13 Clock Specifications
      1. 5.13.1 Device Clock Table
        1. Table 5-5 2806x Clock Table and Nomenclature (90-MHz Devices)
        2. Table 5-6 Device Clocking Requirements/Characteristics
        3. Table 5-7 Internal Zero-Pin Oscillator (INTOSC1/INTOSC2) Characteristics
      2. 5.13.2 Clock Requirements and Characteristics
        1. Table 5-8   XCLKIN Timing Requirements – PLL Enabled
        2. Table 5-9   XCLKIN Timing Requirements – PLL Disabled
        3. Table 5-10 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
    14. 5.14 Flash Timing
      1. Table 5-11 Flash/OTP Endurance for T Temperature Material
      2. Table 5-12 Flash/OTP Endurance for S Temperature Material
      3. Table 5-13 Flash/OTP Endurance for Q Temperature Material
      4. Table 5-14 Flash Parameters at 90-MHz SYSCLKOUT
      5. Table 5-15 Flash/OTP Access Timing
      6. Table 5-16 Flash Data Retention Duration
  6. 6Detailed Description
    1. 6.1 Overview
      1. 6.1.1  CPU
      2. 6.1.2  Control Law Accelerator (CLA)
      3. 6.1.3  Viterbi, Complex Math, CRC Unit (VCU)
      4. 6.1.4  Memory Bus (Harvard Bus Architecture)
      5. 6.1.5  Peripheral Bus
      6. 6.1.6  Real-Time JTAG and Analysis
      7. 6.1.7  Flash
      8. 6.1.8  M0, M1 SARAMs
      9. 6.1.9  L4 SARAM, and L0, L1, L2, L3, L5, L6, L7, and L8 DPSARAMs
      10. 6.1.10 Boot ROM
        1. 6.1.10.1 Emulation Boot
        2. 6.1.10.2 GetMode
        3. 6.1.10.3 Peripheral Pins Used by the Bootloader
      11. 6.1.11 Security
      12. 6.1.12 Peripheral Interrupt Expansion (PIE) Block
      13. 6.1.13 External Interrupts (XINT1 to XINT3)
      14. 6.1.14 Internal Zero Pin Oscillators, Oscillator, and PLL
      15. 6.1.15 Watchdog
      16. 6.1.16 Peripheral Clocking
      17. 6.1.17 Low-power Modes
      18. 6.1.18 Peripheral Frames 0, 1, 2, 3 (PFn)
      19. 6.1.19 General-Purpose Input/Output (GPIO) Multiplexer
      20. 6.1.20 32-Bit CPU-Timers (0, 1, 2)
      21. 6.1.21 Control Peripherals
      22. 6.1.22 Serial Port Peripherals
    2. 6.2 Memory Maps
    3. 6.3 Register Maps
    4. 6.4 Device Emulation Registers
    5. 6.5 VREG, BOR, POR
      1. 6.5.1 On-chip VREG
        1. 6.5.1.1 Using the On-chip VREG
        2. 6.5.1.2 Disabling the On-chip VREG
      2. 6.5.2 On-chip Power-On Reset (POR) and Brownout Reset (BOR) Circuit
    6. 6.6 System Control
      1. 6.6.1 Internal Zero Pin Oscillators
      2. 6.6.2 Crystal Oscillator Option
      3. 6.6.3 PLL-Based Clock Module
      4. 6.6.4 USB and HRCAP PLL Module (PLL2)
      5. 6.6.5 Loss of Input Clock (NMI Watchdog Function)
      6. 6.6.6 CPU-Watchdog Module
    7. 6.7 Low-power Modes Block
    8. 6.8 Interrupts
      1. 6.8.1 External Interrupts
        1. 6.8.1.1 External Interrupt Electrical Data/Timing
          1. Table 6-20 External Interrupt Timing Requirements
          2. Table 6-21 External Interrupt Switching Characteristics
    9. 6.9 Peripherals
      1. 6.9.1  CLA Overview
      2. 6.9.2  Analog Block
        1. 6.9.2.1 Analog-to-Digital Converter (ADC)
          1. 6.9.2.1.1 Features
          2. 6.9.2.1.2 ADC Start-of-Conversion Electrical Data/Timing
            1. Table 6-26 External ADC Start-of-Conversion Switching Characteristics
          3. 6.9.2.1.3 On-Chip Analog-to-Digital Converter (ADC) Electrical Data/Timing
            1. Table 6-27 ADC Electrical Characteristics
            2. Table 6-28 ADC Power Modes
            3. 6.9.2.1.3.1 Internal Temperature Sensor
              1. Table 6-29 Temperature Sensor Coefficient
            4. 6.9.2.1.3.2 ADC Power-Up Control Bit Timing
              1. Table 6-30 ADC Power-Up Delays
            5. 6.9.2.1.3.3 ADC Sequential and Simultaneous Timings
        2. 6.9.2.2 ADC MUX
        3. 6.9.2.3 Comparator Block
          1. 6.9.2.3.1 On-Chip Comparator/DAC Electrical Data/Timing
            1. Table 6-32 Electrical Characteristics of the Comparator/DAC
      3. 6.9.3  Detailed Descriptions
      4. 6.9.4  Serial Peripheral Interface (SPI) Module
        1. 6.9.4.1 SPI Master Mode Electrical Data/Timing
          1. Table 6-35 SPI Master Mode External Timing (Clock Phase = 0)
          2. Table 6-36 SPI Master Mode External Timing (Clock Phase = 1)
        2. 6.9.4.2 SPI Slave Mode Electrical Data/Timing
          1. Table 6-37 SPI Slave Mode External Timing (Clock Phase = 0)
          2. Table 6-38 SPI Slave Mode External Timing (Clock Phase = 1)
      5. 6.9.5  Serial Communications Interface (SCI) Module
      6. 6.9.6  Multichannel Buffered Serial Port (McBSP) Module
        1. 6.9.6.1 McBSP Electrical Data/Timing
          1. 6.9.6.1.1 McBSP Transmit and Receive Timing
            1. Table 6-42 McBSP Timing Requirements
            2. Table 6-43 McBSP Switching Characteristics
          2. 6.9.6.1.2 McBSP as SPI Master or Slave Timing
            1. Table 6-44 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)
            2. Table 6-45 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0)
            3. Table 6-46 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)
            4. Table 6-47 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0)
            5. Table 6-48 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)
            6. Table 6-49 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1)
            7. Table 6-50 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)
            8. Table 6-51 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1)
      7. 6.9.7  Enhanced Controller Area Network (eCAN) Module
      8. 6.9.8  Inter-Integrated Circuit (I2C)
        1. 6.9.8.1 I2C Electrical Data/Timing
          1. Table 6-55 I2C Timing Requirements
          2. Table 6-56 I2C Switching Characteristics
      9. 6.9.9  Enhanced Pulse Width Modulator (ePWM) Modules (ePWM1 to ePWM8)
        1. 6.9.9.1 ePWM Electrical Data/Timing
          1. Table 6-59 ePWM Timing Requirements
          2. Table 6-60 ePWM Switching Characteristics
        2. 6.9.9.2 Trip-Zone Input Timing
          1. Table 6-61 Trip-Zone Input Timing Requirements
      10. 6.9.10 High-Resolution PWM (HRPWM)
        1. 6.9.10.1 HRPWM Electrical Data/Timing
          1. Table 6-62 High-Resolution PWM Characteristics
      11. 6.9.11 Enhanced Capture Module (eCAP1)
        1. 6.9.11.1 eCAP Electrical Data/Timing
          1. Table 6-64 Enhanced Capture (eCAP) Timing Requirement
          2. Table 6-65 eCAP Switching Characteristics
      12. 6.9.12 High-Resolution Capture Modules (HRCAP1 to HRCAP4)
        1. 6.9.12.1 HRCAP Electrical Data/Timing
          1. Table 6-67 High-Resolution Capture (HRCAP) Timing Requirements
      13. 6.9.13 Enhanced Quadrature Encoder Modules (eQEP1, eQEP2)
        1. 6.9.13.1 eQEP Electrical Data/Timing
          1. Table 6-69 Enhanced Quadrature Encoder Pulse (eQEP) Timing Requirements
          2. Table 6-70 eQEP Switching Characteristics
      14. 6.9.14 JTAG Port
      15. 6.9.15 General-Purpose Input/Output (GPIO) MUX
        1. 6.9.15.1 GPIO Electrical Data/Timing
          1. 6.9.15.1.1 GPIO Output Timing
            1. Table 6-76 General-Purpose Output Switching Characteristics
          2. 6.9.15.1.2 GPIO Input Timing
            1. Table 6-77 General-Purpose Input Timing Requirements
          3. 6.9.15.1.3 Sampling Window Width for Input Signals
          4. 6.9.15.1.4 Low-Power Mode Wakeup Timing
            1. Table 6-78 IDLE Mode Timing Requirements
            2. Table 6-79 IDLE Mode Switching Characteristics
            3. Table 6-80 STANDBY Mode Timing Requirements
            4. Table 6-81 STANDBY Mode Switching Characteristics
            5. Table 6-82 HALT Mode Timing Requirements
            6. Table 6-83 HALT Mode Switching Characteristics
      16. 6.9.16 Universal Serial Bus (USB)
        1. 6.9.16.1 USB Electrical Data/Timing
          1. Table 6-84 USB Input Ports DP and DM Timing Requirements
          2. Table 6-85 USB Output Ports DP and DM Switching Characteristics
  7. 7Applications, Implementation, and Layout
    1. 7.1 TI Design or Reference Design
  8. 8Device and Documentation Support
    1. 8.1 Getting Started
    2. 8.2 Device and Development Support Tool Nomenclature
    3. 8.3 Tools and Software
    4. 8.4 Documentation Support
    5. 8.5 Related Links
    6. 8.6 Community Resources
    7. 8.7 Trademarks
    8. 8.8 Electrostatic Discharge Caution
    9. 8.9 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Device and Development Support Tool Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all TMS320™ MCU devices and support tools. Each TMS320 MCU commercial family member has one of three prefixes: TMX, TMP, or TMS (for example, TMS320F28069). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (with TMX for devices and TMDX for tools) to fully qualified production devices/tools (with TMS for devices and TMDS for tools).

Device development evolutionary flow:

TMX Experimental device that is not necessarily representative of the final device's electrical specifications
TMP Final silicon die that conforms to the device's electrical specifications but has not completed quality and reliability verification
TMS Fully qualified production device

Support tool development evolutionary flow:

TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing
TMDS Fully qualified development-support product

TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."

TMS devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, PZP) and temperature range (for example, S). Figure 8-1 provides a legend for reading the complete device name for any family member.

For device part numbers and further ordering information, see the TI website (www.ti.com) or contact your TI sales representative.

For additional description of the device nomenclature markings on the die, see the TMS320F2806x Piccolo™ MCUs Silicon Errata.

TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063 TMS320F28062 nomen_prs698.gif
For more information on peripheral, temperature, and package availability for a specific device, see Table 3-1.
Figure 8-1 Device Nomenclature