SPRS698G November   2010  – May 2018 TMS320F28062 , TMS320F28063 , TMS320F28064 , TMS320F28065 , TMS320F28066 , TMS320F28067 , TMS320F28069

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
    5. 1.5 System Device Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings – Commercial
    3. 5.3  ESD Ratings – Automotive
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Power Consumption Summary
      1. Table 5-1 TMS320F2806x Current Consumption at 90-MHz SYSCLKOUT
      2. 5.5.1      Reducing Current Consumption
      3. 5.5.2      Current Consumption Graphs (VREG Enabled)
    6. 5.6  Electrical Characteristics
    7. 5.7  Thermal Resistance Characteristics
      1. 5.7.1 PFP PowerPAD Package
      2. 5.7.2 PZP PowerPAD Package
      3. 5.7.3 PN Package
      4. 5.7.4 PZ Package
    8. 5.8  Thermal Design Considerations
    9. 5.9  Emulator Connection Without Signal Buffering for the MCU
    10. 5.10 Parameter Information
      1. 5.10.1 Timing Parameter Symbology
      2. 5.10.2 General Notes on Timing Parameters
    11. 5.11 Test Load Circuit
    12. 5.12 Power Sequencing
      1. Table 5-3 Reset (XRS) Timing Requirements
      2. Table 5-4 Reset (XRS) Switching Characteristics
    13. 5.13 Clock Specifications
      1. 5.13.1 Device Clock Table
        1. Table 5-5 2806x Clock Table and Nomenclature (90-MHz Devices)
        2. Table 5-6 Device Clocking Requirements/Characteristics
        3. Table 5-7 Internal Zero-Pin Oscillator (INTOSC1/INTOSC2) Characteristics
      2. 5.13.2 Clock Requirements and Characteristics
        1. Table 5-8   XCLKIN Timing Requirements – PLL Enabled
        2. Table 5-9   XCLKIN Timing Requirements – PLL Disabled
        3. Table 5-10 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
    14. 5.14 Flash Timing
      1. Table 5-11 Flash/OTP Endurance for T Temperature Material
      2. Table 5-12 Flash/OTP Endurance for S Temperature Material
      3. Table 5-13 Flash/OTP Endurance for Q Temperature Material
      4. Table 5-14 Flash Parameters at 90-MHz SYSCLKOUT
      5. Table 5-15 Flash/OTP Access Timing
      6. Table 5-16 Flash Data Retention Duration
  6. 6Detailed Description
    1. 6.1 Overview
      1. 6.1.1  CPU
      2. 6.1.2  Control Law Accelerator (CLA)
      3. 6.1.3  Viterbi, Complex Math, CRC Unit (VCU)
      4. 6.1.4  Memory Bus (Harvard Bus Architecture)
      5. 6.1.5  Peripheral Bus
      6. 6.1.6  Real-Time JTAG and Analysis
      7. 6.1.7  Flash
      8. 6.1.8  M0, M1 SARAMs
      9. 6.1.9  L4 SARAM, and L0, L1, L2, L3, L5, L6, L7, and L8 DPSARAMs
      10. 6.1.10 Boot ROM
        1. 6.1.10.1 Emulation Boot
        2. 6.1.10.2 GetMode
        3. 6.1.10.3 Peripheral Pins Used by the Bootloader
      11. 6.1.11 Security
      12. 6.1.12 Peripheral Interrupt Expansion (PIE) Block
      13. 6.1.13 External Interrupts (XINT1 to XINT3)
      14. 6.1.14 Internal Zero Pin Oscillators, Oscillator, and PLL
      15. 6.1.15 Watchdog
      16. 6.1.16 Peripheral Clocking
      17. 6.1.17 Low-power Modes
      18. 6.1.18 Peripheral Frames 0, 1, 2, 3 (PFn)
      19. 6.1.19 General-Purpose Input/Output (GPIO) Multiplexer
      20. 6.1.20 32-Bit CPU-Timers (0, 1, 2)
      21. 6.1.21 Control Peripherals
      22. 6.1.22 Serial Port Peripherals
    2. 6.2 Memory Maps
    3. 6.3 Register Maps
    4. 6.4 Device Emulation Registers
    5. 6.5 VREG, BOR, POR
      1. 6.5.1 On-chip VREG
        1. 6.5.1.1 Using the On-chip VREG
        2. 6.5.1.2 Disabling the On-chip VREG
      2. 6.5.2 On-chip Power-On Reset (POR) and Brownout Reset (BOR) Circuit
    6. 6.6 System Control
      1. 6.6.1 Internal Zero Pin Oscillators
      2. 6.6.2 Crystal Oscillator Option
      3. 6.6.3 PLL-Based Clock Module
      4. 6.6.4 USB and HRCAP PLL Module (PLL2)
      5. 6.6.5 Loss of Input Clock (NMI Watchdog Function)
      6. 6.6.6 CPU-Watchdog Module
    7. 6.7 Low-power Modes Block
    8. 6.8 Interrupts
      1. 6.8.1 External Interrupts
        1. 6.8.1.1 External Interrupt Electrical Data/Timing
          1. Table 6-20 External Interrupt Timing Requirements
          2. Table 6-21 External Interrupt Switching Characteristics
    9. 6.9 Peripherals
      1. 6.9.1  CLA Overview
      2. 6.9.2  Analog Block
        1. 6.9.2.1 Analog-to-Digital Converter (ADC)
          1. 6.9.2.1.1 Features
          2. 6.9.2.1.2 ADC Start-of-Conversion Electrical Data/Timing
            1. Table 6-26 External ADC Start-of-Conversion Switching Characteristics
          3. 6.9.2.1.3 On-Chip Analog-to-Digital Converter (ADC) Electrical Data/Timing
            1. Table 6-27 ADC Electrical Characteristics
            2. Table 6-28 ADC Power Modes
            3. 6.9.2.1.3.1 Internal Temperature Sensor
              1. Table 6-29 Temperature Sensor Coefficient
            4. 6.9.2.1.3.2 ADC Power-Up Control Bit Timing
              1. Table 6-30 ADC Power-Up Delays
            5. 6.9.2.1.3.3 ADC Sequential and Simultaneous Timings
        2. 6.9.2.2 ADC MUX
        3. 6.9.2.3 Comparator Block
          1. 6.9.2.3.1 On-Chip Comparator/DAC Electrical Data/Timing
            1. Table 6-32 Electrical Characteristics of the Comparator/DAC
      3. 6.9.3  Detailed Descriptions
      4. 6.9.4  Serial Peripheral Interface (SPI) Module
        1. 6.9.4.1 SPI Master Mode Electrical Data/Timing
          1. Table 6-35 SPI Master Mode External Timing (Clock Phase = 0)
          2. Table 6-36 SPI Master Mode External Timing (Clock Phase = 1)
        2. 6.9.4.2 SPI Slave Mode Electrical Data/Timing
          1. Table 6-37 SPI Slave Mode External Timing (Clock Phase = 0)
          2. Table 6-38 SPI Slave Mode External Timing (Clock Phase = 1)
      5. 6.9.5  Serial Communications Interface (SCI) Module
      6. 6.9.6  Multichannel Buffered Serial Port (McBSP) Module
        1. 6.9.6.1 McBSP Electrical Data/Timing
          1. 6.9.6.1.1 McBSP Transmit and Receive Timing
            1. Table 6-42 McBSP Timing Requirements
            2. Table 6-43 McBSP Switching Characteristics
          2. 6.9.6.1.2 McBSP as SPI Master or Slave Timing
            1. Table 6-44 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)
            2. Table 6-45 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0)
            3. Table 6-46 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)
            4. Table 6-47 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0)
            5. Table 6-48 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)
            6. Table 6-49 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1)
            7. Table 6-50 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)
            8. Table 6-51 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1)
      7. 6.9.7  Enhanced Controller Area Network (eCAN) Module
      8. 6.9.8  Inter-Integrated Circuit (I2C)
        1. 6.9.8.1 I2C Electrical Data/Timing
          1. Table 6-55 I2C Timing Requirements
          2. Table 6-56 I2C Switching Characteristics
      9. 6.9.9  Enhanced Pulse Width Modulator (ePWM) Modules (ePWM1 to ePWM8)
        1. 6.9.9.1 ePWM Electrical Data/Timing
          1. Table 6-59 ePWM Timing Requirements
          2. Table 6-60 ePWM Switching Characteristics
        2. 6.9.9.2 Trip-Zone Input Timing
          1. Table 6-61 Trip-Zone Input Timing Requirements
      10. 6.9.10 High-Resolution PWM (HRPWM)
        1. 6.9.10.1 HRPWM Electrical Data/Timing
          1. Table 6-62 High-Resolution PWM Characteristics
      11. 6.9.11 Enhanced Capture Module (eCAP1)
        1. 6.9.11.1 eCAP Electrical Data/Timing
          1. Table 6-64 Enhanced Capture (eCAP) Timing Requirement
          2. Table 6-65 eCAP Switching Characteristics
      12. 6.9.12 High-Resolution Capture Modules (HRCAP1 to HRCAP4)
        1. 6.9.12.1 HRCAP Electrical Data/Timing
          1. Table 6-67 High-Resolution Capture (HRCAP) Timing Requirements
      13. 6.9.13 Enhanced Quadrature Encoder Modules (eQEP1, eQEP2)
        1. 6.9.13.1 eQEP Electrical Data/Timing
          1. Table 6-69 Enhanced Quadrature Encoder Pulse (eQEP) Timing Requirements
          2. Table 6-70 eQEP Switching Characteristics
      14. 6.9.14 JTAG Port
      15. 6.9.15 General-Purpose Input/Output (GPIO) MUX
        1. 6.9.15.1 GPIO Electrical Data/Timing
          1. 6.9.15.1.1 GPIO Output Timing
            1. Table 6-76 General-Purpose Output Switching Characteristics
          2. 6.9.15.1.2 GPIO Input Timing
            1. Table 6-77 General-Purpose Input Timing Requirements
          3. 6.9.15.1.3 Sampling Window Width for Input Signals
          4. 6.9.15.1.4 Low-Power Mode Wakeup Timing
            1. Table 6-78 IDLE Mode Timing Requirements
            2. Table 6-79 IDLE Mode Switching Characteristics
            3. Table 6-80 STANDBY Mode Timing Requirements
            4. Table 6-81 STANDBY Mode Switching Characteristics
            5. Table 6-82 HALT Mode Timing Requirements
            6. Table 6-83 HALT Mode Switching Characteristics
      16. 6.9.16 Universal Serial Bus (USB)
        1. 6.9.16.1 USB Electrical Data/Timing
          1. Table 6-84 USB Input Ports DP and DM Timing Requirements
          2. Table 6-85 USB Output Ports DP and DM Switching Characteristics
  7. 7Applications, Implementation, and Layout
    1. 7.1 TI Design or Reference Design
  8. 8Device and Documentation Support
    1. 8.1 Getting Started
    2. 8.2 Device and Development Support Tool Nomenclature
    3. 8.3 Tools and Software
    4. 8.4 Documentation Support
    5. 8.5 Related Links
    6. 8.6 Community Resources
    7. 8.7 Trademarks
    8. 8.8 Electrostatic Discharge Caution
    9. 8.9 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Device Emulation Registers

These registers are used to control the protection mode of the C28x CPU and to monitor some critical device signals. The registers are defined in Table 6-10.

Table 6-10 Device Emulation Registers

NAME ADDRESS RANGE SIZE (×16) DESCRIPTION EALLOW PROTECTED
DEVICECNF 0x0880–
0x0881
2 Device Configuration Register Yes
PARTID 0x3D 7E80 1 Part ID Register TMS320F28069PZP/PZ 0x009E No
TMS320F28069UPZP/PZ 0x009F
TMS320F28069MPZP/PZ 0x009E
TMS320F28069FPZP/PZ 0x009E
TMS320F28069PFP/PN 0x009C
TMS320F28069UPFP/PN 0x009D
TMS320F28069MPFP/PN 0x009C
TMS320F28069FPFP/PN 0x009C
TMS320F28068PZP/PZ 0x008E
TMS320F28068UPZP/PZ 0x008F
TMS320F28068MPZP/PZ 0x008E
TMS320F28068FPZP/PZ 0x008E
TMS320F28068PFP/PN 0x008C
TMS320F28068UPFP/PN 0x008D
TMS320F28068MPFP/PN 0x008C
TMS320F28068FPFP/PN 0x008C
TMS320F28067PZP/PZ 0x008A
TMS320F28067UPZP/PZ 0x008B
TMS320F28067PFP/PN 0x0088
TMS320F28067UPFP/PN 0x0089
TMS320F28066PZP/PZ 0x0086
TMS320F28066UPZP/PZ 0x0087
TMS320F28066PFP/PN 0x0084
TMS320F28066UPFP/PN 0x0085
TMS320F28065PZP/PZ 0x007E
TMS320F28065UPZP/PZ 0x007F
TMS320F28065PFP/PN 0x007C
TMS320F28065UPFP/PN 0x007D
TMS320F28064PZP/PZ 0x006E
TMS320F28064UPZP/PZ 0x006F
TMS320F28064PFP/PN 0x006C
TMS320F28064UPFP/PN 0x006D
TMS320F28063PZP/PZ 0x006A
TMS320F28063UPZP/PZ 0x006B
TMS320F28063PFP/PN 0x0068
TMS320F28063UPFP/PN 0x0069
TMS320F28062PZP/PZ 0x0066
TMS320F28062UPZP/PZ 0x0067
TMS320F28062FPZP/PZ 0x0066
TMS320F28062PFP/PN 0x0064
TMS320F28062UPFP/PN 0x0065
TMS320F28062FPFP/PN 0x0064
CLASSID 0x0882 1 Class ID Register TMS320F28069 0x009F No
TMS320F28069U 0x009F
TMS320F28069M 0x009F
TMS320F28069F 0x009F
TMS320F28068 0x008F
TMS320F28068U 0x008F
TMS320F28068M 0x008F
TMS320F28068F 0x008F
TMS320F28067 0x008F
TMS320F28067U 0x008F
TMS320F28066 0x008F
TMS320F28066U 0x008F
TMS320F28065 0x007F
TMS320F28065U 0x007F
TMS320F28064 0x006F
TMS320F28064U 0x006F
TMS320F28063 0x006F
TMS320F28063U 0x006F
TMS320F28062 0x006F
TMS320F28062U 0x006F
TMS320F28062F 0x006F
REVID 0x0883 1 Revision ID Register 0x0000 - Silicon Rev. 0 - TMX No
0x0001 - Silicon Rev. A - TMS
0x0002 - Silicon Rev. B - TMS