The PowerPAD™ should be soldered to the ground (GND) plane of the PCB because this will provide the best thermal conduction path. For this device, the PowerPAD is not electrically shorted to the internal die VSS; therefore, the PowerPAD does not provide an electrical connection to the PCB ground. To make optimum use of the thermal efficiencies designed into the PowerPAD package, the PCB must be designed with this technology in mind. A thermal land is required on the surface of the PCB directly underneath the body of the PowerPAD. The thermal land should be soldered to the exposed lead frame die pad of the PowerPad package; the thermal land should be as large as needed to dissipate the required heat. An array of thermal vias should be used to connect the thermal pad to the internal GND plane of the board. See PowerPAD™ Thermally Enhanced Package for more details on using the PowerPAD package.