SPRS698G November   2010  – May 2018 TMS320F28062 , TMS320F28063 , TMS320F28064 , TMS320F28065 , TMS320F28066 , TMS320F28067 , TMS320F28069

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
    5. 1.5 System Device Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings – Commercial
    3. 5.3  ESD Ratings – Automotive
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Power Consumption Summary
      1. Table 5-1 TMS320F2806x Current Consumption at 90-MHz SYSCLKOUT
      2. 5.5.1      Reducing Current Consumption
      3. 5.5.2      Current Consumption Graphs (VREG Enabled)
    6. 5.6  Electrical Characteristics
    7. 5.7  Thermal Resistance Characteristics
      1. 5.7.1 PFP PowerPAD Package
      2. 5.7.2 PZP PowerPAD Package
      3. 5.7.3 PN Package
      4. 5.7.4 PZ Package
    8. 5.8  Thermal Design Considerations
    9. 5.9  Emulator Connection Without Signal Buffering for the MCU
    10. 5.10 Parameter Information
      1. 5.10.1 Timing Parameter Symbology
      2. 5.10.2 General Notes on Timing Parameters
    11. 5.11 Test Load Circuit
    12. 5.12 Power Sequencing
      1. Table 5-3 Reset (XRS) Timing Requirements
      2. Table 5-4 Reset (XRS) Switching Characteristics
    13. 5.13 Clock Specifications
      1. 5.13.1 Device Clock Table
        1. Table 5-5 2806x Clock Table and Nomenclature (90-MHz Devices)
        2. Table 5-6 Device Clocking Requirements/Characteristics
        3. Table 5-7 Internal Zero-Pin Oscillator (INTOSC1/INTOSC2) Characteristics
      2. 5.13.2 Clock Requirements and Characteristics
        1. Table 5-8   XCLKIN Timing Requirements – PLL Enabled
        2. Table 5-9   XCLKIN Timing Requirements – PLL Disabled
        3. Table 5-10 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
    14. 5.14 Flash Timing
      1. Table 5-11 Flash/OTP Endurance for T Temperature Material
      2. Table 5-12 Flash/OTP Endurance for S Temperature Material
      3. Table 5-13 Flash/OTP Endurance for Q Temperature Material
      4. Table 5-14 Flash Parameters at 90-MHz SYSCLKOUT
      5. Table 5-15 Flash/OTP Access Timing
      6. Table 5-16 Flash Data Retention Duration
  6. 6Detailed Description
    1. 6.1 Overview
      1. 6.1.1  CPU
      2. 6.1.2  Control Law Accelerator (CLA)
      3. 6.1.3  Viterbi, Complex Math, CRC Unit (VCU)
      4. 6.1.4  Memory Bus (Harvard Bus Architecture)
      5. 6.1.5  Peripheral Bus
      6. 6.1.6  Real-Time JTAG and Analysis
      7. 6.1.7  Flash
      8. 6.1.8  M0, M1 SARAMs
      9. 6.1.9  L4 SARAM, and L0, L1, L2, L3, L5, L6, L7, and L8 DPSARAMs
      10. 6.1.10 Boot ROM
        1. 6.1.10.1 Emulation Boot
        2. 6.1.10.2 GetMode
        3. 6.1.10.3 Peripheral Pins Used by the Bootloader
      11. 6.1.11 Security
      12. 6.1.12 Peripheral Interrupt Expansion (PIE) Block
      13. 6.1.13 External Interrupts (XINT1 to XINT3)
      14. 6.1.14 Internal Zero Pin Oscillators, Oscillator, and PLL
      15. 6.1.15 Watchdog
      16. 6.1.16 Peripheral Clocking
      17. 6.1.17 Low-power Modes
      18. 6.1.18 Peripheral Frames 0, 1, 2, 3 (PFn)
      19. 6.1.19 General-Purpose Input/Output (GPIO) Multiplexer
      20. 6.1.20 32-Bit CPU-Timers (0, 1, 2)
      21. 6.1.21 Control Peripherals
      22. 6.1.22 Serial Port Peripherals
    2. 6.2 Memory Maps
    3. 6.3 Register Maps
    4. 6.4 Device Emulation Registers
    5. 6.5 VREG, BOR, POR
      1. 6.5.1 On-chip VREG
        1. 6.5.1.1 Using the On-chip VREG
        2. 6.5.1.2 Disabling the On-chip VREG
      2. 6.5.2 On-chip Power-On Reset (POR) and Brownout Reset (BOR) Circuit
    6. 6.6 System Control
      1. 6.6.1 Internal Zero Pin Oscillators
      2. 6.6.2 Crystal Oscillator Option
      3. 6.6.3 PLL-Based Clock Module
      4. 6.6.4 USB and HRCAP PLL Module (PLL2)
      5. 6.6.5 Loss of Input Clock (NMI Watchdog Function)
      6. 6.6.6 CPU-Watchdog Module
    7. 6.7 Low-power Modes Block
    8. 6.8 Interrupts
      1. 6.8.1 External Interrupts
        1. 6.8.1.1 External Interrupt Electrical Data/Timing
          1. Table 6-20 External Interrupt Timing Requirements
          2. Table 6-21 External Interrupt Switching Characteristics
    9. 6.9 Peripherals
      1. 6.9.1  CLA Overview
      2. 6.9.2  Analog Block
        1. 6.9.2.1 Analog-to-Digital Converter (ADC)
          1. 6.9.2.1.1 Features
          2. 6.9.2.1.2 ADC Start-of-Conversion Electrical Data/Timing
            1. Table 6-26 External ADC Start-of-Conversion Switching Characteristics
          3. 6.9.2.1.3 On-Chip Analog-to-Digital Converter (ADC) Electrical Data/Timing
            1. Table 6-27 ADC Electrical Characteristics
            2. Table 6-28 ADC Power Modes
            3. 6.9.2.1.3.1 Internal Temperature Sensor
              1. Table 6-29 Temperature Sensor Coefficient
            4. 6.9.2.1.3.2 ADC Power-Up Control Bit Timing
              1. Table 6-30 ADC Power-Up Delays
            5. 6.9.2.1.3.3 ADC Sequential and Simultaneous Timings
        2. 6.9.2.2 ADC MUX
        3. 6.9.2.3 Comparator Block
          1. 6.9.2.3.1 On-Chip Comparator/DAC Electrical Data/Timing
            1. Table 6-32 Electrical Characteristics of the Comparator/DAC
      3. 6.9.3  Detailed Descriptions
      4. 6.9.4  Serial Peripheral Interface (SPI) Module
        1. 6.9.4.1 SPI Master Mode Electrical Data/Timing
          1. Table 6-35 SPI Master Mode External Timing (Clock Phase = 0)
          2. Table 6-36 SPI Master Mode External Timing (Clock Phase = 1)
        2. 6.9.4.2 SPI Slave Mode Electrical Data/Timing
          1. Table 6-37 SPI Slave Mode External Timing (Clock Phase = 0)
          2. Table 6-38 SPI Slave Mode External Timing (Clock Phase = 1)
      5. 6.9.5  Serial Communications Interface (SCI) Module
      6. 6.9.6  Multichannel Buffered Serial Port (McBSP) Module
        1. 6.9.6.1 McBSP Electrical Data/Timing
          1. 6.9.6.1.1 McBSP Transmit and Receive Timing
            1. Table 6-42 McBSP Timing Requirements
            2. Table 6-43 McBSP Switching Characteristics
          2. 6.9.6.1.2 McBSP as SPI Master or Slave Timing
            1. Table 6-44 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)
            2. Table 6-45 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0)
            3. Table 6-46 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)
            4. Table 6-47 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0)
            5. Table 6-48 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)
            6. Table 6-49 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1)
            7. Table 6-50 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)
            8. Table 6-51 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1)
      7. 6.9.7  Enhanced Controller Area Network (eCAN) Module
      8. 6.9.8  Inter-Integrated Circuit (I2C)
        1. 6.9.8.1 I2C Electrical Data/Timing
          1. Table 6-55 I2C Timing Requirements
          2. Table 6-56 I2C Switching Characteristics
      9. 6.9.9  Enhanced Pulse Width Modulator (ePWM) Modules (ePWM1 to ePWM8)
        1. 6.9.9.1 ePWM Electrical Data/Timing
          1. Table 6-59 ePWM Timing Requirements
          2. Table 6-60 ePWM Switching Characteristics
        2. 6.9.9.2 Trip-Zone Input Timing
          1. Table 6-61 Trip-Zone Input Timing Requirements
      10. 6.9.10 High-Resolution PWM (HRPWM)
        1. 6.9.10.1 HRPWM Electrical Data/Timing
          1. Table 6-62 High-Resolution PWM Characteristics
      11. 6.9.11 Enhanced Capture Module (eCAP1)
        1. 6.9.11.1 eCAP Electrical Data/Timing
          1. Table 6-64 Enhanced Capture (eCAP) Timing Requirement
          2. Table 6-65 eCAP Switching Characteristics
      12. 6.9.12 High-Resolution Capture Modules (HRCAP1 to HRCAP4)
        1. 6.9.12.1 HRCAP Electrical Data/Timing
          1. Table 6-67 High-Resolution Capture (HRCAP) Timing Requirements
      13. 6.9.13 Enhanced Quadrature Encoder Modules (eQEP1, eQEP2)
        1. 6.9.13.1 eQEP Electrical Data/Timing
          1. Table 6-69 Enhanced Quadrature Encoder Pulse (eQEP) Timing Requirements
          2. Table 6-70 eQEP Switching Characteristics
      14. 6.9.14 JTAG Port
      15. 6.9.15 General-Purpose Input/Output (GPIO) MUX
        1. 6.9.15.1 GPIO Electrical Data/Timing
          1. 6.9.15.1.1 GPIO Output Timing
            1. Table 6-76 General-Purpose Output Switching Characteristics
          2. 6.9.15.1.2 GPIO Input Timing
            1. Table 6-77 General-Purpose Input Timing Requirements
          3. 6.9.15.1.3 Sampling Window Width for Input Signals
          4. 6.9.15.1.4 Low-Power Mode Wakeup Timing
            1. Table 6-78 IDLE Mode Timing Requirements
            2. Table 6-79 IDLE Mode Switching Characteristics
            3. Table 6-80 STANDBY Mode Timing Requirements
            4. Table 6-81 STANDBY Mode Switching Characteristics
            5. Table 6-82 HALT Mode Timing Requirements
            6. Table 6-83 HALT Mode Switching Characteristics
      16. 6.9.16 Universal Serial Bus (USB)
        1. 6.9.16.1 USB Electrical Data/Timing
          1. Table 6-84 USB Input Ports DP and DM Timing Requirements
          2. Table 6-85 USB Output Ports DP and DM Switching Characteristics
  7. 7Applications, Implementation, and Layout
    1. 7.1 TI Design or Reference Design
  8. 8Device and Documentation Support
    1. 8.1 Getting Started
    2. 8.2 Device and Development Support Tool Nomenclature
    3. 8.3 Tools and Software
    4. 8.4 Documentation Support
    5. 8.5 Related Links
    6. 8.6 Community Resources
    7. 8.7 Trademarks
    8. 8.8 Electrostatic Discharge Caution
    9. 8.9 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Serial Peripheral Interface (SPI) Module

The device includes the 4-pin serial peripheral interface (SPI) module. Up to two SPI modules are available. The SPI is a high-speed, synchronous serial I/O port that allows a serial bit stream of programmed length (1 to 16 bits) to be shifted into and out of the device at a programmable bit-transfer rate. Normally, the SPI is used for communications between the MCU and external peripherals or another processor. Typical applications include external I/O or peripheral expansion through devices such as shift registers, display drivers, and ADCs. Multidevice communications are supported by the master/slave operation of the SPI.

The SPI module features include:

  • Four external pins:
    • SPISOMI: SPI slave-output/master-input pin
    • SPISIMO: SPI slave-input/master-output pin
    • SPISTE: SPI slave transmit-enable pin
    • SPICLK: SPI serial-clock pin

NOTE

All four pins can be used as GPIO if the SPI module is not used.

  • Two operational modes: master and slave
  • Baud rate: 125 different programmable rates.

    TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063 TMS320F28062 q_spibrr_des_prs698.gif
  • Data word length: 1 to 16 data bits
  • Four clocking schemes (controlled by clock polarity and clock phase bits) include:
    • Falling edge without phase delay: SPICLK active-high. SPI transmits data on the falling edge of the SPICLK signal and receives data on the rising edge of the SPICLK signal.
    • Falling edge with phase delay: SPICLK active-high. SPI transmits data one half-cycle ahead of the falling edge of the SPICLK signal and receives data on the falling edge of the SPICLK signal.
    • Rising edge without phase delay: SPICLK inactive-low. SPI transmits data on the rising edge of the SPICLK signal and receives data on the falling edge of the SPICLK signal.
    • Rising edge with phase delay: SPICLK inactive-low. SPI transmits data one half-cycle ahead of the rising edge of the SPICLK signal and receives data on the rising edge of the SPICLK signal.
  • Simultaneous receive and transmit operation (transmit function can be disabled in software)
  • Transmitter and receiver operations are accomplished through either interrupt-driven or polled algorithms.
  • Nine SPI module control registers: In control register frame beginning at address 7040h.
  • NOTE

    All registers in this module are 16-bit registers that are connected to Peripheral Frame 2. When a register is accessed, the register data is in the lower byte (7–0), and the upper byte (15–8) is read as zeros. Writing to the upper byte has no effect.

Enhanced feature:

  • 4-level transmit/receive FIFO
  • Delayed transmit control
  • Bidirectional 3 wire SPI mode support
  • Audio data receive support through SPISTE inversion

The SPI port operation is configured and controlled by the registers listed in Table 6-33 and Table 6-34.

Table 6-33 SPI-A Registers

NAME ADDRESS SIZE (×16) EALLOW PROTECTED DESCRIPTION(1)
SPICCR 0x7040 1 No SPI-A Configuration Control Register
SPICTL 0x7041 1 No SPI-A Operation Control Register
SPISTS 0x7042 1 No SPI-A Status Register
SPIBRR 0x7044 1 No SPI-A Baud Rate Register
SPIRXEMU 0x7046 1 No SPI-A Receive Emulation Buffer Register
SPIRXBUF 0x7047 1 No SPI-A Serial Input Buffer Register
SPITXBUF 0x7048 1 No SPI-A Serial Output Buffer Register
SPIDAT 0x7049 1 No SPI-A Serial Data Register
SPIFFTX 0x704A 1 No SPI-A FIFO Transmit Register
SPIFFRX 0x704B 1 No SPI-A FIFO Receive Register
SPIFFCT 0x704C 1 No SPI-A FIFO Control Register
SPIPRI 0x704F 1 No SPI-A Priority Control Register
Registers in this table are mapped to Peripheral Frame 2. This space only allows 16-bit accesses. 32-bit accesses produce undefined results.

Table 6-34 SPI-B Registers

NAME ADDRESS SIZE (×16) EALLOW PROTECTED DESCRIPTION(1)
SPICCR 0x7740 1 No SPI-B Configuration Control Register
SPICTL 0x7741 1 No SPI-B Operation Control Register
SPISTS 0x7742 1 No SPI-B Status Register
SPIBRR 0x7744 1 No SPI-B Baud Rate Register
SPIRXEMU 0x7746 1 No SPI-B Receive Emulation Buffer Register
SPIRXBUF 0x7747 1 No SPI-B Serial Input Buffer Register
SPITXBUF 0x7748 1 No SPI-B Serial Output Buffer Register
SPIDAT 0x7749 1 No SPI-B Serial Data Register
SPIFFTX 0x774A 1 No SPI-B FIFO Transmit Register
SPIFFRX 0x774B 1 No SPI-B FIFO Receive Register
SPIFFCT 0x774C 1 No SPI-B FIFO Control Register
SPIPRI 0x774F 1 No SPI-B Priority Control Register
Registers in this table are mapped to Peripheral Frame 2. This space only allows 16-bit accesses. 32-bit accesses produce undefined results.

Figure 6-32 is a block diagram of the SPI in slave mode.

TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063 TMS320F28062 fbd_spi_prs698.gif
SPISTE is driven low by the master for a slave device.
Figure 6-32 SPI Module Block Diagram (Slave Mode)