Refer to the PDF data sheet for device specific package drawings
The F28335/F28333/F28235 devices contain 256K × 16 of embedded flash memory, segregated into eight 32K × 16 sectors. The F28334/F28234 devices contain 128K × 16 of embedded flash memory, segregated into eight 16K × 16 sectors. The F28332/F28232 devices contain 64K × 16 of embedded flash, segregated into four 16K × 16 sectors. All the devices also contain a single 1K × 16 of OTP memory at address range 0x380400–0x3807FF. The user can individually erase, program, and validate a flash sector while leaving other sectors untouched. However, it is not possible to use one sector of the flash or the OTP to execute flash algorithms that erase/program other sectors. Special memory pipelining is provided to enable the flash module to achieve higher performance. The flash/OTP is mapped to both program and data space; therefore, it can be used to execute code or store data information. Note that addresses 0x33FFF0–0x33FFF5 are reserved for data variables and should not contain program code.
The Flash and OTP wait-states can be configured by the application. This allows applications running at slower frequencies to configure the flash to use fewer wait-states.
Flash effective performance can be improved by enabling the flash pipeline mode in the Flash options register. With this mode enabled, effective performance of linear code execution will be much faster than the raw performance indicated by the wait-state configuration alone. The exact performance gain when using the Flash pipeline mode is application-dependent.
For more information on the Flash options, Flash wait-state, and OTP wait-state registers, see the TMS320x2833x, 2823x system control and interrupts reference guide.