SPRS439O June   2007  – April 2019 TMS320F28232 , TMS320F28234 , TMS320F28235 , TMS320F28332 , TMS320F28333 , TMS320F28334 , TMS320F28335

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings – Automotive
    3. 5.3  ESD Ratings – Commercial
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Power Consumption Summary
      1. Table 5-1 TMS320F28335/F28235 Current Consumption by Power-Supply Pins at 150-MHz SYSCLKOUT
      2. Table 5-2 TMS320F28334/F28234 Current Consumption by Power-Supply Pins at 150-MHz SYSCLKOUT
      3. 5.5.1     Reducing Current Consumption
      4. 5.5.2     Current Consumption Graphs
    6. 5.6  Electrical Characteristics
    7. 5.7  Thermal Resistance Characteristics
      1. 5.7.1 PGF Package
      2. 5.7.2 PTP Package
      3. 5.7.3 ZHH Package
      4. 5.7.4 ZJZ Package
    8. 5.8  Thermal Design Considerations
    9. 5.9  Timing and Switching Characteristics
      1. 5.9.1 Timing Parameter Symbology
        1. 5.9.1.1 General Notes on Timing Parameters
        2. 5.9.1.2 Test Load Circuit
        3. 5.9.1.3 Device Clock Table
          1. Table 5-4 Clocking and Nomenclature (150-MHz Devices)
          2. Table 5-5 Clocking and Nomenclature (100-MHz Devices)
      2. 5.9.2 Power Sequencing
        1. 5.9.2.1   Power Management and Supervisory Circuit Solutions
        2. Table 5-6 Reset (XRS) Timing Requirements
      3. 5.9.3 Clock Requirements and Characteristics
        1. Table 5-7  Input Clock Frequency
        2. Table 5-8  XCLKIN Timing Requirements – PLL Enabled
        3. Table 5-9  XCLKIN Timing Requirements – PLL Disabled
        4. Table 5-10 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
      4. 5.9.4 Peripherals
        1. 5.9.4.1 General-Purpose Input/Output (GPIO)
          1. 5.9.4.1.1 GPIO - Output Timing
            1. Table 5-11 General-Purpose Output Switching Characteristics
          2. 5.9.4.1.2 GPIO - Input Timing
            1. Table 5-12 General-Purpose Input Timing Requirements
          3. 5.9.4.1.3 Sampling Window Width for Input Signals
          4. 5.9.4.1.4 Low-Power Mode Wakeup Timing
            1. Table 5-13 IDLE Mode Timing Requirements
            2. Table 5-14 IDLE Mode Switching Characteristics
            3. Table 5-15 STANDBY Mode Timing Requirements
            4. Table 5-16 STANDBY Mode Switching Characteristics
            5. Table 5-17 HALT Mode Timing Requirements
            6. Table 5-18 HALT Mode Switching Characteristics
        2. 5.9.4.2 Enhanced Control Peripherals
          1. 5.9.4.2.1 Enhanced Pulse Width Modulator (ePWM) Timing
            1. Table 5-19 ePWM Timing Requirements
            2. Table 5-20 ePWM Switching Characteristics
          2. 5.9.4.2.2 Trip-Zone Input Timing
            1. Table 5-21 Trip-Zone Input Timing Requirements
          3. 5.9.4.2.3 High-Resolution PWM Timing
            1. Table 5-22 High-Resolution PWM Characteristics at SYSCLKOUT = (60–150 MHz)
          4. 5.9.4.2.4 Enhanced Capture (eCAP) Timing
            1. Table 5-23 Enhanced Capture (eCAP) Timing Requirements
            2. Table 5-24 eCAP Switching Characteristics
          5. 5.9.4.2.5 Enhanced Quadrature Encoder Pulse (eQEP) Timing
            1. Table 5-25 Enhanced Quadrature Encoder Pulse (eQEP) Timing Requirements
            2. Table 5-26 eQEP Switching Characteristics
          6. 5.9.4.2.6 ADC Start-of-Conversion Timing
            1. Table 5-27 External ADC Start-of-Conversion Switching Characteristics
        3. 5.9.4.3 External Interrupt Timing
          1. Table 5-28 External Interrupt Timing Requirements
          2. Table 5-29 External Interrupt Switching Characteristics
        4. 5.9.4.4 I2C Electrical Specification and Timing
          1. Table 5-30 I2C Timing
        5. 5.9.4.5 Serial Peripheral Interface (SPI) Timing
          1. 5.9.4.5.1 Master Mode Timing
            1. Table 5-31 SPI Master Mode External Timing (Clock Phase = 0)
            2. Table 5-32 SPI Master Mode External Timing (Clock Phase = 1)
          2. 5.9.4.5.2 Slave Mode Timing
            1. Table 5-33 SPI Slave Mode External Timing (Clock Phase = 0)
            2. Table 5-34 SPI Slave Mode External Timing (Clock Phase = 1)
        6. 5.9.4.6 Multichannel Buffered Serial Port (McBSP) Timing
          1. 5.9.4.6.1 McBSP Transmit and Receive Timing
            1. Table 5-35 McBSP Timing Requirements
            2. Table 5-36 McBSP Switching Characteristics
          2. 5.9.4.6.2 McBSP as SPI Master or Slave Timing
            1. Table 5-37 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)
            2. Table 5-38 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0)
            3. Table 5-39 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)
            4. Table 5-40 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0)
            5. Table 5-41 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)
            6. Table 5-42 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1)
            7. Table 5-43 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)
            8. Table 5-44 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1)
      5. 5.9.5 Emulator Connection Without Signal Buffering for the DSP
      6. 5.9.6 External Interface (XINTF) Timing
        1. 5.9.6.1 USEREADY = 0
        2. 5.9.6.2 Synchronous Mode (USEREADY = 1, READYMODE = 0)
        3. 5.9.6.3 Asynchronous Mode (USEREADY = 1, READYMODE = 1)
        4. 5.9.6.4 XINTF Signal Alignment to XCLKOUT
        5. 5.9.6.5 External Interface Read Timing
          1. Table 5-47 External Interface Read Timing Requirements
          2. Table 5-48 External Interface Read Switching Characteristics
        6. 5.9.6.6 External Interface Write Timing
          1. Table 5-49 External Interface Write Switching Characteristics
        7. 5.9.6.7 External Interface Ready-on-Read Timing With One External Wait State
          1. Table 5-50 External Interface Read Switching Characteristics (Ready-on-Read, One Wait State)
          2. Table 5-51 External Interface Read Timing Requirements (Ready-on-Read, One Wait State)
          3. Table 5-52 Synchronous XREADY Timing Requirements (Ready-on-Read, One Wait State)
          4. Table 5-53 Asynchronous XREADY Timing Requirements (Ready-on-Read, One Wait State)
        8. 5.9.6.8 External Interface Ready-on-Write Timing With One External Wait State
          1. Table 5-54 External Interface Write Switching Characteristics (Ready-on-Write, One Wait State)
          2. Table 5-55 Synchronous XREADY Timing Requirements (Ready-on-Write, One Wait State)
          3. Table 5-56 Asynchronous XREADY Timing Requirements (Ready-on-Write, One Wait State)
        9. 5.9.6.9 XHOLD and XHOLDA Timing
          1. Table 5-57 XHOLD/XHOLDA Timing Requirements (XCLKOUT = XTIMCLK)
          2. Table 5-58 XHOLD/XHOLDA Timing Requirements (XCLKOUT = 1/2 XTIMCLK)
      7. 5.9.7 Flash Timing
        1. Table 5-59 Flash Endurance for A and S Temperature Material
        2. Table 5-60 Flash Endurance for Q Temperature Material
        3. Table 5-61 Flash Parameters at 150-MHz SYSCLKOUT
        4. Table 5-62 Flash/OTP Access Timing
        5. Table 5-63 Flash Data Retention Duration
    10. 5.10 On-Chip Analog-to-Digital Converter
      1. Table 5-65 ADC Electrical Characteristics (over recommended operating conditions)
      2. 5.10.1     ADC Power-Up Control Bit Timing
        1. Table 5-66 ADC Power-Up Delays
        2. Table 5-67 Typical Current Consumption for Different ADC Configurations (at 25-MHz ADCCLK)
      3. 5.10.2     Definitions
      4. 5.10.3     Sequential Sampling Mode (Single-Channel) (SMODE = 0)
        1. Table 5-68 Sequential Sampling Mode Timing
      5. 5.10.4     Simultaneous Sampling Mode (Dual-Channel) (SMODE = 1)
        1. Table 5-69 Simultaneous Sampling Mode Timing
      6. 5.10.5     Detailed Descriptions
    11. 5.11 Migrating Between F2833x Devices and F2823x Devices
  6. 6Detailed Description
    1. 6.1 Brief Descriptions
      1. 6.1.1  C28x CPU
      2. 6.1.2  Memory Bus (Harvard Bus Architecture)
      3. 6.1.3  Peripheral Bus
      4. 6.1.4  Real-Time JTAG and Analysis
      5. 6.1.5  External Interface (XINTF)
      6. 6.1.6  Flash
      7. 6.1.7  M0, M1 SARAMs
      8. 6.1.8  L0, L1, L2, L3, L4, L5, L6, L7 SARAMs
      9. 6.1.9  Boot ROM
        1. 6.1.9.1 Peripheral Pins Used by the Bootloader
      10. 6.1.10 Security
      11. 6.1.11 Peripheral Interrupt Expansion (PIE) Block
      12. 6.1.12 External Interrupts (XINT1–XINT7, XNMI)
      13. 6.1.13 Oscillator and PLL
      14. 6.1.14 Watchdog
      15. 6.1.15 Peripheral Clocking
      16. 6.1.16 Low-Power Modes
      17. 6.1.17 Peripheral Frames 0, 1, 2, 3 (PFn)
      18. 6.1.18 General-Purpose Input/Output (GPIO) Multiplexer
      19. 6.1.19 32-Bit CPU-Timers (0, 1, 2)
      20. 6.1.20 Control Peripherals
      21. 6.1.21 Serial Port Peripherals
    2. 6.2 Peripherals
      1. 6.2.1  DMA Overview
      2. 6.2.2  32-Bit CPU-Timer 0, CPU-Timer 1, CPU-Timer 2
      3. 6.2.3  Enhanced PWM Modules
      4. 6.2.4  High-Resolution PWM (HRPWM)
      5. 6.2.5  Enhanced CAP Modules
      6. 6.2.6  Enhanced QEP Modules
      7. 6.2.7  Analog-to-Digital Converter (ADC) Module
        1. 6.2.7.1 ADC Connections if the ADC Is Not Used
        2. 6.2.7.2 ADC Registers
        3. 6.2.7.3 ADC Calibration
      8. 6.2.8  Multichannel Buffered Serial Port (McBSP) Module
      9. 6.2.9  Enhanced Controller Area Network (eCAN) Modules (eCAN-A and eCAN-B)
      10. 6.2.10 Serial Communications Interface (SCI) Modules (SCI-A, SCI-B, SCI-C)
      11. 6.2.11 Serial Peripheral Interface (SPI) Module (SPI-A)
      12. 6.2.12 Inter-Integrated Circuit (I2C)
      13. 6.2.13 GPIO MUX
      14. 6.2.14 External Interface (XINTF)
    3. 6.3 Memory Maps
    4. 6.4 Register Map
      1. 6.4.1 Device Emulation Registers
    5. 6.5 Interrupts
      1. 6.5.1 External Interrupts
    6. 6.6 System Control
      1. 6.6.1 OSC and PLL Block
        1. 6.6.1.1 External Reference Oscillator Clock Option
        2. 6.6.1.2 PLL-Based Clock Module
        3. 6.6.1.3 Loss of Input Clock
      2. 6.6.2 Watchdog Block
    7. 6.7 Low-Power Modes Block
  7. 7Applications, Implementation, and Layout
    1. 7.1 TI Design or Reference Design
  8. 8Device and Documentation Support
    1. 8.1 Getting Started
    2. 8.2 Device and Development Support Tool Nomenclature
    3. 8.3 Tools and Software
    4. 8.4 Documentation Support
    5. 8.5 Related Links
    6. 8.6 Community Resources
    7. 8.7 Trademarks
    8. 8.8 Electrostatic Discharge Caution
    9. 8.9 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PGF|176
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.9.2 Power Sequencing

No requirements are placed on the power-up and power-down sequences of the various power pins to ensure the correct reset state for all the modules. However, if the 3.3-V transistors in the level shifting output buffers of the I/O pins are powered prior to the 1.9-V/1.8-V transistors, it is possible for the output buffers to turn on, causing a glitch to occur on the pin during power up. To avoid this behavior, power the VDD pins prior to or simultaneously with the VDDIO pins, ensuring that the VDD pins have reached 0.7 V before the VDDIO pins reach 0.7 V.

There are some requirements on the XRS pin:

  1. During power up, the XRS pin must be held low for tw(RSL1) after the input clock is stable (see Table 5-6). This is to enable the entire device to start from a known condition.
  2. During power down, the XRS pin must be pulled low at least 8 μs prior to VDD reaching 1.5 V. Meeting this requirement is important to help prevent unintended flash program or erase.

No voltage larger than a diode drop (0.7 V) above VDDIO should be applied to any digital pin (for analog pins, this value is 0.7 V above VDDA) before powering up the device. Furthermore, VDDIO and VDDA should always be within 0.3 V of each other. Voltages applied to pins on an unpowered device can bias internal P-N junctions in unintended ways and produce unpredictable results.