SPRS880L December   2013  – March 2020 TMS320F28374D , TMS320F28375D , TMS320F28376D , TMS320F28377D , TMS320F28378D , TMS320F28379D

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions
    3. 4.3 Pins With Internal Pullup and Pulldown
    4. 4.4 Pin Multiplexing
      1. 4.4.1 GPIO Muxed Pins
      2. 4.4.2 Input X-BAR
      3. 4.4.3 Output X-BAR and ePWM X-BAR
      4. 4.4.4 USB Pin Muxing
      5. 4.4.5 High-Speed SPI Pin Muxing
    5. 4.5 Connections for Unused Pins
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings – Commercial
    3. 5.3  ESD Ratings – Automotive
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Power Consumption Summary
      1. Table 5-1 Device Current Consumption at 200-MHz SYSCLK
      2. 5.5.1     Current Consumption Graphs
      3. 5.5.2     Reducing Current Consumption
    6. 5.6  Electrical Characteristics
    7. 5.7  Thermal Resistance Characteristics
      1. 5.7.1 ZWT Package
      2. 5.7.2 PTP Package
      3. 5.7.3 PZP Package
    8. 5.8  Thermal Design Considerations
    9. 5.9  System
      1. 5.9.1 Power Sequencing
        1. 5.9.1.1 Signal Pin Requirements
        2. 5.9.1.2 VDDIO, VDDA, VDD3VFL, and VDDOSC Requirements
        3. 5.9.1.3 VDD Requirements
        4. 5.9.1.4 Supply Ramp Rate
          1. Table 5-3 Supply Ramp Rate
        5. 5.9.1.5 Supply Supervision
      2. 5.9.2 Reset Timing
        1. 5.9.2.1 Reset Sources
        2. 5.9.2.2 Reset Electrical Data and Timing
          1. Table 5-4 Reset (XRS) Timing Requirements
          2. Table 5-5 Reset (XRS) Switching Characteristics
      3. 5.9.3 Clock Specifications
        1. 5.9.3.1 Clock Sources
        2. 5.9.3.2 Clock Frequencies, Requirements, and Characteristics
          1. 5.9.3.2.1 Input Clock Frequency and Timing Requirements, PLL Lock Times
            1. Table 5-7  Input Clock Frequency
            2. Table 5-8  X1 Input Level Characteristics When Using an External Clock Source (Not a Crystal)
            3. Table 5-9  X1 Timing Requirements
            4. Table 5-10 AUXCLKIN Timing Requirements
            5. Table 5-11 PLL Lock Times
          2. 5.9.3.2.2 Internal Clock Frequencies
            1. Table 5-12 Internal Clock Frequencies
          3. 5.9.3.2.3 Output Clock Frequency and Switching Characteristics
            1. Table 5-13 Output Clock Frequency
            2. Table 5-14 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
        3. 5.9.3.3 Input Clocks and PLLs
        4. 5.9.3.4 Crystal Oscillator
          1. Table 5-15 Crystal Oscillator Parameters
          2. Table 5-17 Crystal Oscillator Electrical Characteristics
        5. 5.9.3.5 Internal Oscillators
          1. Table 5-18 Internal Oscillator Electrical Characteristics
      4. 5.9.4 Flash Parameters
        1. Table 5-20 Flash Parameters
      5. 5.9.5 Emulation/JTAG
        1. 5.9.5.1 JTAG Electrical Data and Timing
          1. Table 5-21 JTAG Timing Requirements
          2. Table 5-22 JTAG Switching Characteristics
      6. 5.9.6 GPIO Electrical Data and Timing
        1. 5.9.6.1 GPIO - Output Timing
          1. Table 5-23 General-Purpose Output Switching Characteristics
        2. 5.9.6.2 GPIO - Input Timing
          1. Table 5-24 General-Purpose Input Timing Requirements
        3. 5.9.6.3 Sampling Window Width for Input Signals
      7. 5.9.7 Interrupts
        1. 5.9.7.1 External Interrupt (XINT) Electrical Data and Timing
          1. Table 5-25 External Interrupt Timing Requirements
          2. Table 5-26 External Interrupt Switching Characteristics
      8. 5.9.8 Low-Power Modes
        1. 5.9.8.1 Clock-Gating Low-Power Modes
        2. 5.9.8.2 Power-Gating Low-Power Modes
        3. 5.9.8.3 Low-Power Mode Wakeup Timing
          1. Table 5-29 IDLE Mode Timing Requirements
          2. Table 5-30 IDLE Mode Switching Characteristics
          3. Table 5-31 STANDBY Mode Timing Requirements
          4. Table 5-32 STANDBY Mode Switching Characteristics
          5. Table 5-33 HALT Mode Timing Requirements
          6. Table 5-34 HALT Mode Switching Characteristics
          7. Table 5-35 HIBERNATE Mode Timing Requirements
          8. Table 5-36 HIBERNATE Mode Switching Characteristics
      9. 5.9.9 External Memory Interface (EMIF)
        1. 5.9.9.1 Asynchronous Memory Support
        2. 5.9.9.2 Synchronous DRAM Support
        3. 5.9.9.3 EMIF Electrical Data and Timing
          1. 5.9.9.3.1 Asynchronous RAM
            1. Table 5-37 EMIF Asynchronous Memory Timing Requirements
            2. Table 5-38 EMIF Asynchronous Memory Switching Characteristics
          2. 5.9.9.3.2 Synchronous RAM
            1. Table 5-39 EMIF Synchronous Memory Timing Requirements
            2. Table 5-40 EMIF Synchronous Memory Switching Characteristics
    10. 5.10 Analog Peripherals
      1. 5.10.1 Analog-to-Digital Converter (ADC)
        1. 5.10.1.1 ADC Configurability
          1. 5.10.1.1.1 Signal Mode
        2. 5.10.1.2 ADC Electrical Data and Timing
          1. Table 5-42 ADC Operating Conditions (16-Bit Differential Mode)
          2. Table 5-43 ADC Characteristics (16-Bit Differential Mode)
          3. Table 5-44 ADC Operating Conditions (12-Bit Single-Ended Mode)
          4. Table 5-45 ADC Characteristics (12-Bit Single-Ended Mode)
          5. Table 5-46 ADCEXTSOC Timing Requirements
          6. 5.10.1.2.1 ADC Input Models
            1. Table 5-47 Differential Input Model Parameters
            2. Table 5-48 Single-Ended Input Model Parameters
          7. 5.10.1.2.2 ADC Timing Diagrams
            1. Table 5-51 ADC Timings in 12-Bit Mode (SYSCLK Cycles)
            2. Table 5-52 ADC Timings in 16-Bit Mode
        3. 5.10.1.3 Temperature Sensor Electrical Data and Timing
          1. Table 5-53 Temperature Sensor Electrical Characteristics
      2. 5.10.2 Comparator Subsystem (CMPSS)
        1. 5.10.2.1 CMPSS Electrical Data and Timing
          1. Table 5-54 Comparator Electrical Characteristics
          2. Table 5-55 CMPSS DAC Static Electrical Characteristics
      3. 5.10.3 Buffered Digital-to-Analog Converter (DAC)
        1. 5.10.3.1 Buffered DAC Electrical Data and Timing
          1. Table 5-56 Buffered DAC Electrical Characteristics
    11. 5.11 Control Peripherals
      1. 5.11.1 Enhanced Capture (eCAP)
        1. 5.11.1.1 eCAP Electrical Data and Timing
          1. Table 5-57 eCAP Timing Requirement
          2. Table 5-58 eCAP Switching Characteristics
      2. 5.11.2 Enhanced Pulse Width Modulator (ePWM)
        1. 5.11.2.1 Control Peripherals Synchronization
        2. 5.11.2.2 ePWM Electrical Data and Timing
          1. Table 5-59 ePWM Timing Requirements
          2. Table 5-60 ePWM Switching Characteristics
          3. 5.11.2.2.1 Trip-Zone Input Timing
            1. Table 5-61 Trip-Zone Input Timing Requirements
        3. 5.11.2.3 External ADC Start-of-Conversion Electrical Data and Timing
          1. Table 5-62 External ADC Start-of-Conversion Switching Characteristics
      3. 5.11.3 Enhanced Quadrature Encoder Pulse (eQEP)
        1. 5.11.3.1 eQEP Electrical Data and Timing
          1. Table 5-63 eQEP Timing Requirements
          2. Table 5-64 eQEP Switching Characteristics
      4. 5.11.4 High-Resolution Pulse Width Modulator (HRPWM)
        1. 5.11.4.1 HRPWM Electrical Data and Timing
          1. Table 5-65 High-Resolution PWM Timing Requirements
          2. Table 5-66 High-Resolution PWM Characteristics
      5. 5.11.5 Sigma-Delta Filter Module (SDFM)
        1. 5.11.5.1 SDFM Electrical Data and Timing (Using ASYNC)
          1. Table 5-67 SDFM Timing Requirements When Using Asynchronous GPIO (ASYNC) Option
        2. 5.11.5.2 SDFM Electrical Data and Timing (Using 3-Sample GPIO Input Qualification)
          1. Table 5-68 SDFM Timing Requirements When Using GPIO Input Qualification (3-Sample Window) Option
    12. 5.12 Communications Peripherals
      1. 5.12.1 Controller Area Network (CAN)
      2. 5.12.2 Inter-Integrated Circuit (I2C)
        1. 5.12.2.1 I2C Electrical Data and Timing
          1. Table 5-69 I2C Timing Requirements
          2. Table 5-70 I2C Switching Characteristics
      3. 5.12.3 Multichannel Buffered Serial Port (McBSP)
        1. 5.12.3.1 McBSP Electrical Data and Timing
          1. 5.12.3.1.1 McBSP Transmit and Receive Timing
            1. Table 5-71 McBSP Timing Requirements
            2. Table 5-72 McBSP Switching Characteristics
          2. 5.12.3.1.2 McBSP as SPI Master or Slave Timing
            1. Table 5-73 McBSP as SPI Master Timing Requirements
            2. Table 5-74 McBSP as SPI Master Switching Characteristics
            3. Table 5-75 McBSP as SPI Slave Timing Requirements
            4. Table 5-76 McBSP as SPI Slave Switching Characteristics
      4. 5.12.4 Serial Communications Interface (SCI)
      5. 5.12.5 Serial Peripheral Interface (SPI)
        1. 5.12.5.1 SPI Electrical Data and Timing
          1. 5.12.5.1.1 SPI Master Mode Timings
            1. Table 5-77 SPI Master Mode Timing Requirements
            2. Table 5-78 SPI Master Mode Switching Characteristics (Clock Phase = 0)
            3. Table 5-79 SPI Master Mode Switching Characteristics (Clock Phase = 1)
          2. 5.12.5.1.2 SPI Slave Mode Timings
            1. Table 5-80 SPI Slave Mode Timing Requirements
            2. Table 5-81 SPI Slave Mode Switching Characteristics
      6. 5.12.6 Universal Serial Bus (USB) Controller
        1. 5.12.6.1 USB Electrical Data and Timing
          1. Table 5-82 USB Input Ports DP and DM Timing Requirements
          2. Table 5-83 USB Output Ports DP and DM Switching Characteristics
      7. 5.12.7 Universal Parallel Port (uPP) Interface
        1. 5.12.7.1 uPP Electrical Data and Timing
          1. Table 5-84 uPP Timing Requirements
          2. Table 5-85 uPP Switching Characteristics
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Memory
      1. 6.3.1 C28x Memory Map
      2. 6.3.2 Flash Memory Map
      3. 6.3.3 EMIF Chip Select Memory Map
      4. 6.3.4 Peripheral Registers Memory Map
      5. 6.3.5 Memory Types
        1. 6.3.5.1 Dedicated RAM (Mx and Dx RAM)
        2. 6.3.5.2 Local Shared RAM (LSx RAM)
        3. 6.3.5.3 Global Shared RAM (GSx RAM)
        4. 6.3.5.4 CPU Message RAM (CPU MSGRAM)
        5. 6.3.5.5 CLA Message RAM (CLA MSGRAM)
    4. 6.4  Identification
    5. 6.5  Bus Architecture – Peripheral Connectivity
    6. 6.6  C28x Processor
      1. 6.6.1 Floating-Point Unit
      2. 6.6.2 Trigonometric Math Unit
      3. 6.6.3 Viterbi, Complex Math, and CRC Unit II (VCU-II)
    7. 6.7  Control Law Accelerator
    8. 6.8  Direct Memory Access
    9. 6.9  Interprocessor Communication Module
    10. 6.10 Boot ROM and Peripheral Booting
      1. 6.10.1 EMU Boot or Emulation Boot
      2. 6.10.2 WAIT Boot Mode
      3. 6.10.3 Get Mode
      4. 6.10.4 Peripheral Pins Used by Bootloaders
    11. 6.11 Dual Code Security Module
    12. 6.12 Timers
    13. 6.13 Nonmaskable Interrupt With Watchdog Timer (NMIWD)
    14. 6.14 Watchdog
    15. 6.15 Configurable Logic Block (CLB)
    16. 6.16 Functional Safety
  7. 7Applications, Implementation, and Layout
    1. 7.1 TI Reference Design
  8. 8Device and Documentation Support
    1. 8.1 Device and Development Support Tool Nomenclature
    2. 8.2 Markings
    3. 8.3 Tools and Software
    4. 8.4 Documentation Support
    5. 8.5 Related Links
    6. 8.6 Support Resources
    7. 8.7 Trademarks
    8. 8.8 Electrostatic Discharge Caution
    9. 8.9 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZWT|337
  • PTP|176
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Flash Memory Map

On the F28379D, F28378D, F28377D, and F28375D devices, each CPU has its own flash bank [512KB (256KW)], the total flash for each device is 1MB (512KW). Only one bank can be programmed or erased at a time and the code to program the flash should be executed out of RAM. Table 6-2 shows the addresses of flash sectors on CPU1 and CPU2 for F28379D, F28378D, F28377D, and F28375D.

Table 6-2 Addresses of Flash Sectors on CPU1 and CPU2 for F28379D, F28378D, F28377D and F28375D

SECTOR SIZE START ADDRESS END ADDRESS
OTP Sectors
TI OTP 1K x 16 0x0007 0000 0x0007 03FF
User configurable DCSM OTP 1K x 16 0x0007 8000 0x0007 83FF
Sectors
Sector 0 8K x 16 0x0008 0000 0x0008 1FFF
Sector 1 8K x 16 0x0008 2000 0x0008 3FFF
Sector 2 8K x 16 0x0008 4000 0x0008 5FFF
Sector 3 8K x 16 0x0008 6000 0x0008 7FFF
Sector 4 32K x 16 0x0008 8000 0x0008 FFFF
Sector 5 32K x 16 0x0009 0000 0x0009 7FFF
Sector 6 32K x 16 0x0009 8000 0x0009 FFFF
Sector 7 32K x 16 0x000A 0000 0x000A 7FFF
Sector 8 32K x 16 0x000A 8000 0x000A FFFF
Sector 9 32K x 16 0x000B 0000 0x000B 7FFF
Sector 10 8K x 16 0x000B 8000 0x000B 9FFF
Sector 11 8K x 16 0x000B A000 0x000B BFFF
Sector 12 8K x 16 0x000B C000 0x000B DFFF
Sector 13 8K x 16 0x000B E000 0x000B FFFF
Flash ECC Locations
TI OTP ECC 128 x 16 0x0107 0000 0x0107 007F
User-configurable DCSM OTP ECC 128 x 16 0x0107 1000 0x0107 107F
Flash ECC (Sector 0) 1K x 16 0x0108 0000 0x0108 03FF
Flash ECC (Sector 1) 1K x 16 0x0108 0400 0x0108 07FF
Flash ECC (Sector 2) 1K x 16 0x0108 0800 0x0108 0BFF
Flash ECC (Sector 3) 1K x 16 0x0108 0C00 0x0108 0FFF
Flash ECC (Sector 4) 4K x 16 0x0108 1000 0x0108 1FFF
Flash ECC (Sector 5) 4K x 16 0x0108 2000 0x0108 2FFF
Flash ECC (Sector 6) 4K x 16 0x0108 3000 0x0108 3FFF
Flash ECC (Sector 7) 4K x 16 0x0108 4000 0x0108 4FFF
Flash ECC (Sector 8) 4K x 16 0x0108 5000 0x0108 5FFF
Flash ECC (Sector 9) 4K x 16 0x0108 6000 0x0108 6FFF
Flash ECC (Sector 10) 1K x 16 0x0108 7000 0x0108 73FF
Flash ECC (Sector 11) 1K x 16 0x0108 7400 0x0108 77FF
Flash ECC (Sector 12) 1K x 16 0x0108 7800 0x0108 7BFF
Flash ECC (Sector 13) 1K x 16 0x0108 7C00 0x0108 7FFF

On the F28376D and F28374D devices, each CPU has its own flash bank [256KB (128KW)], the total flash for each device is 512KB (256KW). Only one bank can be programmed or erased at a time and the code to program the flash should be executed out of RAM. Table 6-3 shows the addresses of flash sectors on CPU1 and CPU2 for F28376D and F28374D.

Table 6-3 Addresses of Flash Sectors on CPU1 and CPU2 for F28376D and F28374D

SECTOR SIZE START ADDRESS END ADDRESS
OTP Sectors
TI OTP 1K x 16 0x0007 0000 0x0007 03FF
User configurable DCSM OTP 1K x 16 0x0007 8000 0x0007 83FF
Sectors
Sector 0 8K x 16 0x0008 0000 0x0008 1FFF
Sector 1 8K x 16 0x0008 2000 0x0008 3FFF
Sector 2 8K x 16 0x0008 4000 0x0008 5FFF
Sector 3 8K x 16 0x0008 6000 0x0008 7FFF
Sector 4 32K x 16 0x0008 8000 0x0008 FFFF
Sector 5 32K x 16 0x0009 0000 0x0009 7FFF
Sector 6 32K x 16 0x0009 8000 0x0009 FFFF
Flash ECC Locations
TI OTP ECC 128 x 16 0x0107 0000 0x0107 007F
User-configurable DCSM OTP ECC 128 x 16 0x0107 1000 0x0107 107F
Flash ECC (Sector 0) 1K x 16 0x0108 0000 0x0108 03FF
Flash ECC (Sector 1) 1K x 16 0x0108 0400 0x0108 07FF
Flash ECC (Sector 2) 1K x 16 0x0108 0800 0x0108 0BFF
Flash ECC (Sector 3) 1K x 16 0x0108 0C00 0x0108 0FFF
Flash ECC (Sector 4) 4K x 16 0x0108 1000 0x0108 1FFF
Flash ECC (Sector 5) 4K x 16 0x0108 2000 0x0108 2FFF
Flash ECC (Sector 6) 4K x 16 0x0108 3000 0x0108 3FFF