SCBS881E January   2010  – October 2018 TMS3705

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Characteristics
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Electrical Characteristics
    5. 5.5 Thermal Resistance Characteristics for D (SOIC) Package
    6. 5.6 Switching Characteristics
    7. 5.7 Timing Diagrams
  6. 6Detailed Description
    1. 6.1  Power Supply
    2. 6.2  Oscillator
    3. 6.3  Predrivers
    4. 6.4  Full Bridge
    5. 6.5  RF Amplifier
    6. 6.6  Band-Pass Filter and Limiter
    7. 6.7  Diagnosis
    8. 6.8  Power-on Reset
    9. 6.9  Frequency Divider
    10. 6.10 Digital Demodulator
    11. 6.11 Transponder Resonance-Frequency Measurement
    12. 6.12 SCI Encoder
    13. 6.13 Control Logic
    14. 6.14 Test Pins
  7. 7Applications, Implementation, and Layout
    1. 7.1 Application Diagram
  8. 8Device and Documentation Support
    1. 8.1 Getting Started and Next Steps
    2. 8.2 Device Nomenclature
    3. 8.3 Tools and Software
    4. 8.4 Documentation Support
    5. 8.5 Community Resources
    6. 8.6 Trademarks
    7. 8.7 Electrostatic Discharge Caution
    8. 8.8 Export Control Notice
    9. 8.9 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.8 Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from disclosing party under nondisclosure obligations (if any), or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws.