SCBS881E January   2010  – October 2018 TMS3705

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Characteristics
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Electrical Characteristics
    5. 5.5 Thermal Resistance Characteristics for D (SOIC) Package
    6. 5.6 Switching Characteristics
    7. 5.7 Timing Diagrams
  6. 6Detailed Description
    1. 6.1  Power Supply
    2. 6.2  Oscillator
    3. 6.3  Predrivers
    4. 6.4  Full Bridge
    5. 6.5  RF Amplifier
    6. 6.6  Band-Pass Filter and Limiter
    7. 6.7  Diagnosis
    8. 6.8  Power-on Reset
    9. 6.9  Frequency Divider
    10. 6.10 Digital Demodulator
    11. 6.11 Transponder Resonance-Frequency Measurement
    12. 6.12 SCI Encoder
    13. 6.13 Control Logic
    14. 6.14 Test Pins
  7. 7Applications, Implementation, and Layout
    1. 7.1 Application Diagram
  8. 8Device and Documentation Support
    1. 8.1 Getting Started and Next Steps
    2. 8.2 Device Nomenclature
    3. 8.3 Tools and Software
    4. 8.4 Documentation Support
    5. 8.5 Community Resources
    6. 8.6 Trademarks
    7. 8.7 Electrostatic Discharge Caution
    8. 8.8 Export Control Notice
    9. 8.9 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.1 Pin Diagram

Figure 4-1 shows the pinout of the 16-pin D (SOIC) package.

TMS3705 pinout_d16_cbs881.gifFigure 4-1 16-Pin D Package (Top View)