SCDS388A November   2018  – November 2018 TMUX1108

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Application Example
      2.      Block Diagram
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics (VDD = 5 V ±10 %)
    6. 7.6  Electrical Characteristics (VDD = 3.3 V ±10 %)
    7. 7.7  Electrical Characteristics (VDD = 2.5 V ±10 %), (VSS = –2.5 V ±10 %)
    8. 7.8  Electrical Characteristics (VDD = 1.8 V ±10 %)
    9. 7.9  Electrical Characteristics (VDD = 1.2 V ±10 %)
    10. 7.10 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
      1. 8.1.1  On-Resistance
      2. 8.1.2  Off-Leakage Current
      3. 8.1.3  On-Leakage Current
      4. 8.1.4  Transition Time
      5. 8.1.5  Break-Before-Make Delay
      6. 8.1.6  Turn-On and Turn-Off Time
      7. 8.1.7  Charge Injection
      8. 8.1.8  Off Isolation
      9. 8.1.9  Crosstalk
      10. 8.1.10 Bandwidth
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Rail to Rail Operation
      3. 8.3.3 1.8 V Logic Compatible Inputs
      4. 8.3.4 Fail-Safe Logic
      5. 8.3.5 Ultra-low Leakage Current
      6. 8.3.6 Ultra-low Charge Injection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Truth Tables
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
    3. 9.3 Design Requirements
    4. 9.4 Detailed Design Procedure
    5. 9.5 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Layout Information
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics (VDD = 2.5 V ±10 %), (VSS = –2.5 V ±10 %)

at TA = 25°C, VDD = +2.5 V, VSS = –2.5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT
ANALOG SWITCH
RON On-resistance VS = VSS to VDD
ISD = 10 mA
25°C 2.5 4 Ω
–40°C to +85°C   4.5 Ω
–40°C to +125°C   4.9 Ω
ΔRON On-resistance matching between channels VS = VSS to VDD
ISD = 10 mA
25°C 0.13 Ω
–40°C to +85°C 0.4 Ω
–40°C to +125°C 0.5 Ω
RON FLAT On-resistance flatness VS = VSS to VDD
ISD = 10 mA
25°C 0.85 Ω
–40°C to +85°C 1.6 Ω
–40°C to +125°C 1.6 Ω
IS(OFF) Source off leakage current(1) VDD = +2.5 V, VSS = –2.5 V
Switch Off
VD = +2 V / –1 V
VS = –1 V / +2 V
25°C –0.08 ±0.005 0.08 nA
–40°C to +85°C –0.3 0.3 nA
–40°C to +125°C –0.9 0.9 nA
ID(OFF) Drain off leakage current(1) VDD = +2.5 V, VSS = –2.5 V
Switch Off
VD = +2 V / –1 V
VS = –1 V / +2 V
25°C –0.1 ±0.01 0.1 nA
–40°C to +85°C –1 1 nA
–40°C to +125°C –5.5 5.5 nA
ID(ON)
IS(ON)
Channel on leakage current VDD = +2.5 V, VSS = –2.5 V
Switch On
VD = VS = +2 V / –1 V
25°C –0.1 ±0.01 0.1 nA
–40°C to +85°C –0.75 0.75 nA
–40°C to +125°C –4 4 nA
LOGIC INPUTS (EN, A0, A1, A2)
VIH Input logic high –40°C to +125°C 1.2 2.75 V
VIL Input logic low –40°C to +125°C 0 0.73 V
IIH
IIL
Input leakage current 25°C   ±0.005   µA
IIH
IIL
Input leakage current –40°C to +125°C     ±0.05 µA
CIN Logic input capacitance 25°C   1 pF
CIN Logic input capacitance –40°C to +125°C   2 pF
POWER SUPPLY
IDD VDD supply current Logic inputs = 0 V or 2.75 V 25°C 0.008   µA
–40°C to +125°C   1 µA
ISS VSS supply current Logic inputs = 0 V or 2.75 V 25°C 0.008   µA
–40°C to +125°C   1 µA
DYNAMIC CHARACTERISTICS
tTRAN Transition time between channels VS = 1.5 V
RL = 200 Ω, CL = 15 pF
25°C   14   ns
–40°C to +85°C     21 ns
–40°C to +125°C     21 ns
tOPEN (BBM) Break before make time VS = 1.5 V
RL = 200 Ω, CL = 15 pF
25°C   8   ns
–40°C to +85°C 1     ns
–40°C to +125°C 1     ns
tON(EN) Enable turn-on time VS = 1.5 V
RL = 200 Ω, CL = 15 pF
25°C   13 ns
–40°C to +85°C     21 ns
–40°C to +125°C     21 ns
tOFF(EN) Enable turn-off time VS = 1.5 V
RL = 200 Ω, CL = 15 pF
25°C   8   ns
–40°C to +85°C   11 ns
–40°C to +125°C   12 ns
QC Charge Injection VS = –1 V
RS = 0 Ω, CL = 1 nF
25°C –2.5 pC
OISO Off Isolation RL = 50 Ω, CL = 5 pF
f = 1 MHz
25°C   –65   dB
RL = 50 Ω, CL = 5 pF
f = 10 MHz
25°C   –45   dB
XTALK Crosstalk RL = 50 Ω, CL = 5 pF
f = 1 MHz
25°C   –65   dB
RL = 50 Ω, CL = 5 pF
f = 10 MHz
25°C   –45   dB
BW Bandwidth RL = 50 Ω, CL = 5 pF 25°C   85   MHz
CSOFF Source off capacitance f = 1 MHz 25°C   7   pF
CDOFF Drain off capacitance f = 1 MHz 25°C   60   pF
CSON
CDON
On capacitance f = 1 MHz 25°C   65   pF
When VS is positive, VD is negative, and vice versa.