SCDS412A June   2019  – August 2019 TMUX1133 , TMUX1134

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      TMUX113x Block Diagrams
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions TMUX1133
    2.     Pin Functions TMUX1134
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics (VDD = 5 V ±10 %)
    6. 7.6  Electrical Characteristics (VDD = 3.3 V ±10 %)
    7. 7.7  Electrical Characteristics (VDD = 2.5 V ±10 %), (VSS = –2.5 V ±10 %)
    8. 7.8  Electrical Characteristics (VDD = 1.8 V ±10 %)
    9. 7.9  Electrical Characteristics (VDD = 1.2 V ±10 %)
    10. 7.10 Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1  On-Resistance
    2. 8.2  Off-Leakage Current
    3. 8.3  On-Leakage Current
    4. 8.4  Transition Time
    5. 8.5  Break-Before-Make
    6. 8.6  tON(EN) and tOFF(EN)
    7. 8.7  Charge Injection
    8. 8.8  Off Isolation
    9. 8.9  Crosstalk
    10. 8.10 Bandwidth
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Bidirectional Operation
      2. 9.3.2 Rail to Rail Operation
      3. 9.3.3 1.8 V Logic Compatible Inputs
      4. 9.3.4 Fail-Safe Logic
      5. 9.3.5 Ultra-low Leakage Current
      6. 9.3.6 Ultra-low Charge Injection
    4. 9.4 Device Functional Modes
    5. 9.5 Truth Tables
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
    3. 10.3 Design Requirements
    4. 10.4 Detailed Design Procedure
    5. 10.5 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Layout Information
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)(3)
MIN MAX UNIT
VDD–VSS Supply voltage –0.5 6 V
VDD –0.5 6 V
VSS –3.0 0.3 V
VSEL or VEN Logic control input pin voltage (EN, SELx) –0.5 6 V
ISEL or IEN Logic control input pin current (EN, SELx) –30 30 mA
VS or VD Source or drain voltage (SxA, SxB, Dx) –0.5 VDD + 0.5 V
IS or ID (CONT) Source or drain continuous current (SxA, SxB, Dx) –30 30 mA
Tstg Storage temperature –65 150 °C
TJ Junction temperature 150 °C
Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
All voltages are with respect to ground, unless otherwise specified.