SCDS412A June   2019  – August 2019 TMUX1133 , TMUX1134

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      TMUX113x Block Diagrams
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions TMUX1133
    2.     Pin Functions TMUX1134
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics (VDD = 5 V ±10 %)
    6. 7.6  Electrical Characteristics (VDD = 3.3 V ±10 %)
    7. 7.7  Electrical Characteristics (VDD = 2.5 V ±10 %), (VSS = –2.5 V ±10 %)
    8. 7.8  Electrical Characteristics (VDD = 1.8 V ±10 %)
    9. 7.9  Electrical Characteristics (VDD = 1.2 V ±10 %)
    10. 7.10 Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1  On-Resistance
    2. 8.2  Off-Leakage Current
    3. 8.3  On-Leakage Current
    4. 8.4  Transition Time
    5. 8.5  Break-Before-Make
    6. 8.6  tON(EN) and tOFF(EN)
    7. 8.7  Charge Injection
    8. 8.8  Off Isolation
    9. 8.9  Crosstalk
    10. 8.10 Bandwidth
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Bidirectional Operation
      2. 9.3.2 Rail to Rail Operation
      3. 9.3.3 1.8 V Logic Compatible Inputs
      4. 9.3.4 Fail-Safe Logic
      5. 9.3.5 Ultra-low Leakage Current
      6. 9.3.6 Ultra-low Charge Injection
    4. 9.4 Device Functional Modes
    5. 9.5 Truth Tables
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
    3. 10.3 Design Requirements
    4. 10.4 Detailed Design Procedure
    5. 10.5 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Layout Information
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

The TMUX113x devices are precision complementary metal-oxide semiconductor (CMOS) switches with multiple channels. The TMUX1133 is a 2:1, single-pole double-throw (SPDT), configuration with three independently controlled channels and an EN pin to enable or disable all three switches. The TMUX1134 contains four independently controlled SPDT switches. Wide operating supply of 1.08 V to 5.5 V, or ±2.75 V dual supply, allows for use in a broad array of applications from medical equipment to industrial systems. The device supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from VSS to VDD. For single supply applications VSS must be connected to GND.

All logic inputs have 1.8 V logic compatible thresholds, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.

The TMUX113x devices are part of the precision switches and multiplexers family. These devices have very low on and off leakage currents and low charge injection, allowing them to be used in high precision measurement applications. A low supply current of
8 nA enables use in portable applications.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TMUX1133 TSSOP (16) (PW) 5.00 mm × 4.40 mm
TMUX1134 TSSOP (20) (PW) 6.50 mm × 4.40 mm
  1. For all available packages, see the package option addendum at the end of the data sheet.