SCDS412A June   2019  – August 2019 TMUX1133 , TMUX1134

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      TMUX113x Block Diagrams
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions TMUX1133
    2.     Pin Functions TMUX1134
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics (VDD = 5 V ±10 %)
    6. 7.6  Electrical Characteristics (VDD = 3.3 V ±10 %)
    7. 7.7  Electrical Characteristics (VDD = 2.5 V ±10 %), (VSS = –2.5 V ±10 %)
    8. 7.8  Electrical Characteristics (VDD = 1.8 V ±10 %)
    9. 7.9  Electrical Characteristics (VDD = 1.2 V ±10 %)
    10. 7.10 Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1  On-Resistance
    2. 8.2  Off-Leakage Current
    3. 8.3  On-Leakage Current
    4. 8.4  Transition Time
    5. 8.5  Break-Before-Make
    6. 8.6  tON(EN) and tOFF(EN)
    7. 8.7  Charge Injection
    8. 8.8  Off Isolation
    9. 8.9  Crosstalk
    10. 8.10 Bandwidth
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Bidirectional Operation
      2. 9.3.2 Rail to Rail Operation
      3. 9.3.3 1.8 V Logic Compatible Inputs
      4. 9.3.4 Fail-Safe Logic
      5. 9.3.5 Ultra-low Leakage Current
      6. 9.3.6 Ultra-low Charge Injection
    4. 9.4 Device Functional Modes
    5. 9.5 Truth Tables
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
    3. 10.3 Design Requirements
    4. 10.4 Detailed Design Procedure
    5. 10.5 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Layout Information
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Device Functional Modes

The select (SELx) pins are logic pins that control the connection between the source (SxA, SxB) and drain (Dx) pins of the TMUX113x devices. When a source pin is not selected that pin is in an open state (HI-Z). When a source pin is selected the switch conducts to drain. The logic control pins can be as high as 5.5 V.

When the EN pin of the TMUX1133 is pulled low the SELx logic control inputs determine which source input is selected. When the EN pin is pulled high, all of the switches are in an open state regardless of the state of the SELx logic control inputs. The TMUX1134 SELx logic control inputs determine which source pin is connected to the drain pin for each channel.

The TMUX113x devices can be operated without any external components except for the supply decoupling capacitors. Unused logic control pins must be tied to GND or VDD in order to ensure the device does not consume additional current as highlighted in Implications of Slow or Floating CMOS Inputs. Unused signal path inputs (SxA, SxB or Dx) should be connected to GND.