The TMUX113x devices operate across a wide supply range of 1.08 V to 5.5 V single supply, or ±2.75 V for dual supply applications. For single supply voltage applications VSS must be connected to GND. Do not exceed the absolute maximum ratings because stresses beyond the listed ratings can cause permanent damage to the devices.
Power-supply bypassing improves noise margin and prevents switching noise propagation from the VDD and VSS supplies to other components. Good power-supply decoupling is important to achieve optimum performance. For improved supply noise immunity, use a supply decoupling capacitor ranging from 0.1 μF to 10 μF from VDD and VSS to ground. Place the bypass capacitors as close to the power supply pins of the device as possible using low-impedance connections. TI recommends using multi-layer ceramic chip capacitors (MLCCs) that offer low equivalent series resistance (ESR) and inductance (ESL) characteristics for power-supply decoupling purposes. For very sensitive systems, or for systems in harsh noise environments, avoiding the use of vias for connecting the capacitors to the device pins may offer superior noise immunity. The use of multiple vias in parallel lowers the overall inductance and is beneficial for connections to ground planes.