SCDS390B September   2018  – March 2025 TMUX1511

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Dynamic Characteristics
    7. 5.7 Timing Requirements
    8. 5.8 Typical Characteristics
      1. 5.8.1 Eye Diagrams
  7. 6 Parameter Measurement Information
    1. 6.1  On-Resistance
    2. 6.2  Off-Leakage Current
    3. 6.3  On-Leakage Current
    4. 6.4  IPOFF Leakage Current
    5. 6.5  Transition Time
    6. 6.6  TON (VDD) and TOFF (VDD) Time
    7. 6.7  Propagation Delay
    8. 6.8  Skew
    9. 6.9  Charge Injection
    10. 6.10 Capacitance
    11. 6.11 Off Isolation
    12. 6.12 Channel-to-Channel Crosstalk
    13. 6.13 Bandwidth
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bidirectional Operation
      2. 7.3.2 Beyond Supply Operation
      3. 7.3.3 1.8V Logic Compatible Inputs
      4. 7.3.4 Powered-off Protection
      5. 7.3.5 Fail-Safe Logic
      6. 7.3.6 Low Capacitance
      7. 7.3.7 Integrated Pull-Down Resistors
    4. 7.4 Device Functional Modes
    5. 7.5 Truth Tables
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Protocol / Signal Isolation
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Transimpedance Amplifier Feedback Control
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 Dynamic Characteristics

VDD = 1.5V to 5.5V, GND = 0V, TA = –40°C to +125°C,
Typical values are at VDD = 3.3V, TA = 25°C, (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
COFFSource and drain off capacitanceVS = VDD / 2
VSEL= 0V
f = 1MHz
Refer to Capacitance Figure		Switch OFF2.54pF
CONSource and drain on capacitanceVS = VDD / 2
VSEL = VDD
f = 1MHz
Refer to Capacitance Figure		Switch ON3.36pF
QCCharge InjectionVS = VDD / 2
RS = 0Ω, CL = 100pF
Refer to Charge Injection Figure		Switch ON2pC
OISOOff isolationRL = 50Ω
f = 100kHz
Refer to Off Isolation Figure		Switch OFF–90dB
RL = 50Ω
f = 1MHz
Refer to Off Isolation Figure		Switch OFF–75dB
XTALKChannel to Channel crosstalkRL = 50Ω
f = 100kHz
Refer to Crosstalk Figure		Switch ON–90dB
BWBandwidthRL = 50Ω
Refer to Bandwidth Figure		Switch ON3GHz
ILOSSInsertion lossRL = 50Ω
f = 1MHz
Refer to Bandwidth Figure		Switch ON–0.12dB