SCDS423 October   2020 TMUX1575

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dynamic Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  Off-Leakage Current
    3. 7.3  On-Leakage Current
    4. 7.4  IPOFF Leakage Current
    5. 7.5  Transition Time
    6. 7.6  tON (EN) and tOFF (EN) Time
    7. 7.7  Break-Before-Make Delay
    8. 7.8  Charge Injection
    9. 7.9  Off Isolation
    10. 7.10 Channel-to-Channel Crosstalk
    11. 7.11 Bandwidth
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Beyond Supply Operation
      3. 8.3.3 1.2 V Logic Compatible Inputs
      4. 8.3.4 Powered-off Protection
      5. 8.3.5 Fail-Safe Logic
      6. 8.3.6 Integrated Pull-Down Resistors
    4. 8.4 Device Functional Modes
      1. 8.4.1 Truth Tables
  9. 9 Application and Implementation
    1. 9.1 Typical Application
      1. 9.1.1 Design Requirements
      2. 9.1.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.8 Typical Characteristics

At TA = 25°C, VDD = 3.3 V (unless otherwise noted).

GUID-20200901-CA0I-NH12-R651-KKBRN5BDHLRF-low.gif
VDD = 3.3 V
Figure 6-1 On-Resistance vs Temperature
GUID-20200901-CA0I-ZJCN-1DQD-V2RVQK3LC1K8-low.gif
TA = 25°C
Figure 6-3 On-Resistance vs Source or Drain Voltage
GUID-20200901-CA0I-R4GQ-BNNZ-D6S2ZTHCQDJX-low.gif
TA = 25°C
Figure 6-5 Supply Current vs Logic Voltage
GUID-20200901-CA0I-HG8V-SWMG-W3DL3PLWSW6C-low.gif
TA = 25°C
Figure 6-7 TON (EN) vs Supply Voltage
GUID-20200901-CA0I-8W1L-SXDB-4QSX8GJKQGTL-low.gif
TA = 25°C
Figure 6-9 Skew and Propagation Delay vs Supply Voltage
GUID-20200901-CA0I-ZW9B-GLHL-WCHF9DCR16L8-low.gif
TA = 25°C
Figure 6-11 On-Response vs Frequency
GUID-20200901-CA0I-PB11-0NDP-WJVPGRK87DBM-low.gif
VDD = 1.8 V
Figure 6-2 On-Resistance vs Temperature
GUID-20200924-CA0I-WHQZ-FXH1-LBZ4XX66K5MF-low.gif
VDD = 3.3 V
Figure 6-4 On-Leakage vs Source or Drain Voltage
GUID-20200901-CA0I-ZDLH-SRDZ-VNMWSPPR0BQ6-low.gif
TA = 25°C
Figure 6-6 TTRANSITION vs Supply Voltage
GUID-20200901-CA0I-58VP-V7H0-MWCBZVS2MSKW-low.gif
TA = 25°C
Figure 6-8 TOFF (EN) vs Supply Voltage
GUID-20200901-CA0I-D1MK-JMM0-GJ711C74M6CC-low.gif
TA = 25°C
Figure 6-10 Off Isolation and Crosstalk vs Frequency