SCDS445B May   2022  – March 2023 TMUX4051 , TMUX4052 , TMUX4053

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Thermal Information: TMUX405x
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Electrical Characteristics
    6. 7.6 AC Performance Characteristics
    7. 7.7 Timing Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1  On-Resistance
    2. 8.2  Off-Leakage Current
    3. 8.3  On-Leakage Current
    4. 8.4  Transition Time
    5. 8.5  Break-Before-Make
    6. 8.6  tON(EN) and tOFF(EN)
    7. 8.7  Propagation Delay
    8. 8.8  Charge Injection
    9. 8.9  Off Isolation
    10. 8.10 Crosstalk
    11. 8.11 Bandwidth
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Bidirectional Operation
      2. 9.3.2 Rail-to-Rail Operation
      3. 9.3.3 1.8 V Logic Compatible Inputs
      4. 9.3.4 Device Functional Modes
      5. 9.3.5 Truth Tables
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
    3. 10.3 Design Requirements
    4. 10.4 Detailed Design Procedure
    5. 10.5 Application Curves
    6. 10.6 Power Supply Recommendations
    7. 10.7 Layout
      1. 10.7.1 Layout Guidelines
      2. 10.7.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5 Electrical Characteristics

Over operating free-air temperature range,
Typical at TA = 25℃ (unless otherwise noted)
PARAMETER TEST CONDITIONS VDD VSS TA MIN TYP MAX UNIT
POWER SUPPLY
Supply current
IDD		 Address inputs = 0 V, 5 V, or VDD
EN = 0 V		 5 V 0 V –55°C 60 µA
25°C 17 60
85°C 80
125°C 80
Address inputs = 0 V, 5 V, or VDD
EN = 0 V		 10 V 0 V –55°C 60
25°C 18 60
85°C 80
125°C 80
Address inputs = 0 V, 5 V, or VDD
EN = 0 V		 24 V 0 V –55°C 60
25°C 21 60
85°C 80
125°C 80
Address inputs = 0 V, 5 V, or VDD
EN = 0 V		 5 V –5 V –55°C 60
25°C 18 60
85°C 80
125°C 80
Address inputs = 0 V, 5 V, or VDD
EN = 0 V		 12 V –12 V –55°C 60
25°C 20 60
85°C 80
125°C 80
Negative supply current
ISS		 Address inputs = 0 V, 5 V, or VDD
EN = 0 V		 5 V –5 V –55°C 20 µA
25°C 6 20
85°C 25
125°C 25
Address inputs = 0 V, 5 V, or VDD
EN = 0 V		 12 V –12 V –55°C 22
25°C 7 22
85°C 26
125°C 26
IDD disable EN = 5 V or VDD All 25°C 8 µA
–55°C to 125°C 20
ANALOG SWITCH
RON
Source to Drain ON-Resistance		 VS = VSS to VDD
ID = –1 mA		 5 V 0 V –55°C 800 Ω
25°C 75 1050
85°C 1200
125°C 1300
VS = VSS to VDD
ID = –1 mA		 10 V 0 V –55°C 310
25°C 60 400
85°C 520
125°C 550
VS = VSS to VDD
ID = –1 mA		 24 V 0 V –55°C 200
25°C 60 240
85°C 300
125°C 300
VS = VSS to VDD
ID = –1 mA		 5 V –5 V –55°C 310
25°C 60 400
85°C 520
125°C 550
VS = VSS to VDD
ID = –1 mA		 12 V –12 V –55°C 200
25°C 60 240
85°C 300
125°C 300
ΔRON VS = VSS to VDD
ID = –1 mA		 All 25°C 2 Ω
RON FLAT VS = VSS to VDD
ID = –1 mA
 All 25°C 60 Ω
–55°C to 85°C 150
–55°C to 125°C 150
IS(OFF)
ID(OFF)		 Switch State is off
VS = VSS / VDD
VD = VDD / VSS		 24 V 0 V 25°C ±0.3 ±100 nA
–55°C to 85°C ±800
–55°C to 125°C ±1000
ION Switch State is on
VS = VD = VSS or VDD		 24 V 0 V 25°C ±0.3 ±100 nA
–55°C to 85°C ±800
–55°C to 125°C ±1000
LOGIC INPUTS (ADDRESS / ENABLE pins)
VIH Input High Voltage All –55°C to 125°C 1.35 VDD V
VIL Input Low Voltage All –55°C to 125°C 0 0.8 V
IIH
IIL
Logic Input Current		 VLOGIC = 0 V, 5 V, or VDD All 25°C ±0.6 µA
–55°C to 125°C –1 1
CIN All 25°C 2 pF