SCDS384B September   2018  – August 2025 TMUX6119

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Thermal Information
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Electrical Characteristics (Dual Supplies: ±15V)
    6. 5.6 Switching Characteristics (Dual Supplies: ±15V)
    7. 5.7 Electrical Characteristics (Single Supply: 12V)
    8. 5.8 Switching Characteristics (Single Supply: 12V)
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Truth Tables
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1  On-Resistance
      2. 7.1.2  Off-Leakage Current
      3. 7.1.3  On-Leakage Current
      4. 7.1.4  Transition Time
      5. 7.1.5  Break-Before-Make Delay
      6. 7.1.6  Enable Turn-On and Enable Turn-Off Time
      7. 7.1.7  Charge Injection
      8. 7.1.8  Off Isolation
      9. 7.1.9  Channel-to-Channel Crosstalk
      10. 7.1.10 Bandwidth
      11. 7.1.11 THD + Noise
      12. 7.1.12 AC Power Supply Rejection Ratio (AC PSRR)
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Ultra-low Leakage Current
      2. 7.3.2 Ultra-low Charge Injection
      3. 7.3.3 Bidirectional and Rail-to-Rail Operation
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Trademarks
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.2 Ultra-low Charge Injection

The TMUX6119 is implemented with simple transmission gate topology, as shown in Figure 7-15. Any mismatch in the stray capacitance associated with the NMOS and PMOS causes an output level change whenever the switch is opened or closed.

TMUX6119 Transmission Gate TopologyFigure 7-15 Transmission Gate Topology

The TMUX6119 utilizes special charge-injection cancellation circuitry that reduces the source (SA or SB)-to-drain (D) charge injection to as low as 0.19pC at VS = 0V, as shown in Figure 7-16.

TMUX6119 Charge Injection vs Source VoltageFigure 7-16 Charge Injection vs Source Voltage

The drain (D)-to-source (SA or SB) charge injection becomes important when the device is used as a demultiplexer (demux), where D becomes the input and Sx becomes the output. Figure 7-17 shows the drain-to-source charge injection across the full signal range.

TMUX6119 Charge Injection vs Drain VoltageFigure 7-17 Charge Injection vs Drain Voltage