SCDS398 December   2018 TMUX6121 , TMUX6122 , TMUX6123

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Electrical Characteristics (Dual Supplies: ±15 V)
    6. 6.6 Switching Characteristics (Dual Supplies: ±15 V)
    7. 6.7 Electrical Characteristics (Single Supply: 12 V)
    8. 6.8 Switching Characteristics (Single Supply: 12 V)
    9. 6.9 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 Truth Tables
  8. Detailed Description
    1. 8.1 Overview
      1. 8.1.1  On-Resistance
      2. 8.1.2  Off-Leakage Current
      3. 8.1.3  On-Leakage Current
      4. 8.1.4  Turn-On and Turn-Off Time
      5. 8.1.5  Break-Before-Make Delay
      6. 8.1.6  Charge Injection
      7. 8.1.7  Off Isolation
      8. 8.1.8  Channel-to-Channel Crosstalk
      9. 8.1.9  Bandwidth
      10. 8.1.10 THD + Noise
      11. 8.1.11 AC Power Supply Rejection Ratio (AC PSRR)
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Ultralow Leakage Current
      2. 8.3.2 Ultralow Charge Injection
      3. 8.3.3 Bidirectional and Rail-to-Rail Operation
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VDD to VSS Supply voltage 36 V
VDD to GND –0.3 18 V
VSS to GND –18 0.3 V
VDIG Digital input pin (SEL1, SEL2) voltage GND –0.3 VDD+0.3 V
IDIG Digital input pin (SEL1, SEL2) current –30 30 mA
VANA_IN Analog input pin (Sx) voltage VSS–0.3 VDD+0.3 V
IANA_IN Analog input pin (Sx) current –30 30 mA
VANA_OUT Analog output pin (Dx) voltage VSS–0.3 VDD+0.3 V
IANA_OUT Analog output pin (Dx) current –30 30 mA
TA Ambient temperature –55 140 °C
TJ Junction temperature 150 °C
Tstg Storage temperature –65 150 °C
Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.