SCDS417B March   2022  – December 2023 TMUX7236

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Thermal Information
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Source or Drain Continuous Current
    6. 5.6  ±15 V Dual Supply: Electrical Characteristics 
    7. 5.7  ±15 V Dual Supply: Switching Characteristics 
    8. 5.8  ±20 V Dual Supply: Electrical Characteristics
    9. 5.9  ±20 V Dual Supply: Switching Characteristics
    10. 5.10 44 V Single Supply: Electrical Characteristics 
    11. 5.11 44 V Single Supply: Switching Characteristics 
    12. 5.12 12 V Single Supply: Electrical Characteristics 
    13. 5.13 12 V Single Supply: Switching Characteristics 
    14. 5.14 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1  On-Resistance
    2. 6.2  Off-Leakage Current
    3. 6.3  On-Leakage Current
    4. 6.4  Transition Time
    5. 6.5  tON(EN) and tOFF(EN)
    6. 6.6  Break-Before-Make
    7. 6.7  tON (VDD) Time
    8. 6.8  Propagation Delay
    9. 6.9  Charge Injection
    10. 6.10 Off Isolation
    11. 6.11 Crosstalk
    12. 6.12 Bandwidth
    13. 6.13 THD + Noise
    14. 6.14 Power Supply Rejection Ratio (PSRR)
  8. 7 Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Feature Description
      1. 7.2.1 Bidirectional Operation
      2. 7.2.2 Rail to Rail Operation
      3. 7.2.3 1.8 V Logic Compatible Inputs
      4. 7.2.4 Integrated Pull-Down Resistor on Logic Pins
      5. 7.2.5 Fail-Safe Logic
      6. 7.2.6 Latch-Up Immune
      7. 7.2.7 Ultra-Low Charge Injection
    3. 7.3 Device Functional Modes
    4. 7.4 Truth Tables
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
        1. 8.2.3.1 On-Resistance Mismatch Between Channels
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Glossary
    6. 9.6 Electrostatic Discharge Caution
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
  • RUM|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.9 ±20 V Dual Supply: Switching Characteristics

VDD = +20 V ± 10%, VSS = –20 V ±10%, GND = 0 V (unless otherwise noted) 
Typical at VDD = +20 V, VSS = –20 V, TA = 25℃  (unless otherwise noted)
PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT
tTRAN Transition time from control input VS = 10 V
RL = 300 Ω, CL = 35 pF
Refer to Transition Time		 25°C 100 160 ns
–40°C to +85°C 170 ns
–40°C to +125°C 180 ns
tON Turn-on time from control input VS = 10 V
RL = 300 Ω, CL = 35 pF
Refer to Turn-on and Turn-off Time		 25°C 95 140 ns
–40°C to +85°C 160 ns
–40°C to +125°C 180 ns
tOFF Turn-off time from control input VS = 10 V
RL = 300 Ω, CL = 35 pF
Refer to Turn-on and Turn-off Time		 25°C 125 150 ns
–40°C to +85°C 165 ns
–40°C to +125°C 190 ns
tBBM Break-before-make time delay VS = 10 V,
RL = 300 Ω, CL = 35 pF 
Refer to Break-before-make Time		 25°C 28 ns
–40°C to +85°C 5 ns
–40°C to +125°C 5 ns
tON (VDD) Device turn on time
(VDD to output)		 VDD rise time = 1 µs
RL = 300 Ω, CL = 35 pF
Refer to Turn-on (VDD) Time		 25°C 0.17 ms
–40°C to +85°C 0.18 ms
–40°C to +125°C 0.18 ms
tPD Propagation delay RL = 50 Ω , CL = 5 pF
Refer to Propagation Delay		 25°C 740 ps
QINJ Charge injection VS = 0 V, CL = 100 pF 
Refer to Charge Injection		 25°C 45 pC
OISO Off-isolation RL = 50 Ω , CL = 5 pF
VS = 0 V, f = 100 kHz
Refer to Off Isolation		 25°C –70 dB
OISO Off-isolation RL = 50 Ω , CL = 5 pF
VS = 0 V, f = 1 MHz
Refer to Off Isolation		 25°C –50 dB
XTALK Crosstalk RL = 50 Ω , CL = 5 pF
VS = 0 V, f = 100 kHz
Refer to Crosstalk		 25°C –107 dB
XTALK Crosstalk RL = 50 Ω , CL = 5 pF
VS = 0 V, f = 1 MHz
Refer to Crosstalk		 25°C –93 dB
BW –3dB Bandwidth RL = 50 Ω , CL = 5 pF
VS = 0 V
Refer to Bandwidth		 25°C 35 MHz
IL Insertion loss RL = 50 Ω , CL = 5 pF
VS = 0 V, f = 1 MHz		 25°C –0.14 dB
ACPSRR AC Power Supply Rejection Ratio VPP = 0.62 V on VDD and VSS
RL = 50 Ω , CL = 5 pF,
f = 1 MHz
Refer to ACPSRR		 25°C –68 dB
THD+N Total Harmonic Distortion + Noise VPP = 20 V, VBIAS = 0 V
RL  =  10 kΩ , CL = 5 pF,
f = 20 Hz to 20 kHz
Refer to THD + Noise		 25°C 0.0006 %
CS(OFF) Source off capacitance VS = 0 V, f = 1 MHz 25°C 45 pF
CD(OFF) Drain off capacitance VS = 0 V, f = 1 MHz 25°C 55 pF
CS(ON),
CD(ON)		 On capacitance VS = 0 V, f = 1 MHz 25°C 165 pF