SCDS400B march   2022  – july 2023 TMUX7348F , TMUX7349F

PRODMIX  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Device Comparison Table
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Thermal Information
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Electrical Characteristics (Global)
    6. 7.6  ±15 V Dual Supply: Electrical Characteristics
    7. 7.7  ±20 V Dual Supply: Electrical Characteristics
    8. 7.8  12 V Single Supply: Electrical Characteristics
    9. 7.9  36 V Single Supply: Electrical Characteristics
    10. 7.10 Typical Characteristics
  9. Parameter Measurement Information
    1. 8.1  On-Resistance
    2. 8.2  Off-Leakage Current
    3. 8.3  On-Leakage Current
    4. 8.4  Input and Output Leakage Current Under Overvoltage Fault
    5. 8.5  Break-Before-Make Delay
    6. 8.6  Enable Delay Time
    7. 8.7  Transition Time
    8. 8.8  Fault Response Time
    9. 8.9  Fault Recovery Time
    10. 8.10 Fault Flag Response Time
    11. 8.11 Fault Flag Recovery Time
    12. 8.12 Charge Injection
    13. 8.13 Off Isolation
    14. 8.14 Crosstalk
    15. 8.15 Bandwidth
    16. 8.16 THD + Noise
  10. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Flat ON- Resistance
      2. 9.3.2 Protection Features
        1. 9.3.2.1 Input Voltage Tolerance
        2. 9.3.2.2 Powered-Off Protection
        3. 9.3.2.3 Fail-Safe Logic
        4. 9.3.2.4 Overvoltage Protection and Detection
        5. 9.3.2.5 Adjacent Channel Operation During Fault
        6. 9.3.2.6 ESD Protection
        7. 9.3.2.7 Latch-Up Immunity
        8. 9.3.2.8 EMC Protection
      3. 9.3.3 Overvoltage Fault Flags
      4. 9.3.4 Bidirectional and Rail-to-Rail Operation
      5. 9.3.5 1.8 V Logic Compatible Inputs
      6. 9.3.6 Integrated Pull-Down Resistor on Logic Pins
    4. 9.4 Device Functional Modes
      1. 9.4.1 Normal Mode
      2. 9.4.2 Fault Mode
      3. 9.4.3 Truth Tables
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

GUID-EBE401C8-0784-472C-9C9B-E78F59C1912F-low.gifFigure 6-1 PW Package, 20-Pin TSSOP (Top View)
GUID-1FB6D900-3C82-4A49-A681-8766DA87AEB7-low.gifFigure 6-2 RTJ Package, 20-Pin WQFN (Top View)
Table 6-1 Pin Functions: TMUX7348F
PIN TYPE(1) DESCRIPTION
NAME TSSOP WQFN
A0 1 19 I Logic control input address 0 (A0). The pin has a 4-MΩ internal pull-down resistor. This pin can also be used together with the specific fault pin (SF) to indicate which input is under fault. For more details, see Section 9.4.3.
A1 20 18 I Logic control input address 1 (A1). The pin has a 4-MΩ internal pull-down resistor. This pin can also be used together with the specific fault pin (SF) to indicate which input is under fault. For more details, see Section 9.4.3.
A2 19 17 I Logic control input address 2 (A2). The pin has a 4-MΩ internal pull-down resistor. This pin can also be used together with the specific fault pin (SF) to indicate which input is under fault. For more details, see Section 9.4.3.
D 8 6 I/O Drain pin. Can be an input or output. The drain pin is not overvoltage protected and shall remain within the recommended operating range.
EN 2 20 I Active high logic enable (EN) pin. The pin has a 4-MΩ internal pull-down resistor. The device is disabled and all switches become high impedance when the pin is low. When the pin is high, the Ax logic inputs determine individual switch states. For more details, see Section 9.4.3.
FF 11 9 O General fault flag. This pin is an open drain output and is asserted low when overvoltage condition is detected on any of the source (Sx) input pins. Connect this pin to an external supply (1.8 V to 5.5 V) through a 1-kΩ pull-up resistor.
GND 18 16 P Ground (0 V) reference.
S1 4 2 I/O Overvoltage protected source pin 1. Can be an input or output.
S2 5 3 I/O Overvoltage protected source pin 2. Can be an input or output.
S3 6 4 I/O Overvoltage protected source pin 3. Can be an input or output.
S4 7 5 I/O Overvoltage protected source pin 4. Can be an input or output.
S5 16 14 I/O Overvoltage protected source pin 5. Can be an input or output.
S6 15 13 I/O Overvoltage protected source pin 6. Can be an input or output.
S7 14 12 I/O Overvoltage protected source pin 7. Can be an input or output.
S8 13 11 I/O Overvoltage protected source pin 8. Can be an input or output.
SF 10 8 O Specific fault flag. Table 9-1 shows how this pin is an open drain output and is asserted low when overvoltage condition is detected on a specific pin, depending on the state of A0, A1, and A2. Connect this pin to an external supply (1.8 V to 5.5 V) through a 1-kΩ pull-up resistor.
VDD 17 15 P Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VDD and GND.
VFN 9 7 P Negative fault voltage supply that determines the overvoltage protection triggering threshold on the negative side. Connect to VSS if the triggering threshold will be the same as the device's negative supply. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VFN and GND.
VFP 12 10 P Positive fault voltage supply that determines the overvoltage protection triggering threshold on the positive side. Connect to VDD if the triggering threshold will be the same as the device's positive supply. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VFP and GND.
VSS 3 1 P Negative power supply. This pin is the most negative power-supply potential. In single-supply applications, this pin can be connected to ground. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VSS and GND.
Thermal Pad Thermal pad. The thermal pad is not connected internally. It is recommended that the pad be tied to GND or VSS for best performance.
I = input, O = output, I/O = input and output, P = power
GUID-888BAD0E-3016-4F31-A486-FF35C59E296F-low.gifFigure 6-3 PW Package, 20-Pin TSSOP (Top View)
GUID-52F7380B-E67A-4250-A23F-D2E8EE49A572-low.gifFigure 6-4 RTJ Package, 20-Pin WQFN (Top View)
Table 6-2 Pin Functions: TMUX7349F
PIN TYPE(1) DESCRIPTION
NAME TSSOP WQFN
A0 1 19 I Logic control input address 0 (A0). The pin has a 4-MΩ internal pull-down resistor. This pin can also be used together with the specific fault pin (SF) to indicate which input is under fault. For more details, see Section 9.4.3.
A1 20 18 I Logic control input address 1 (A1). The pin has a 4-MΩ internal pull-down resistor. This pin can also be used together with the specific fault pin (SF) to indicate which input is under fault. For more details, see Section 9.4.3.
DA 8 6 I/O Drain terminal A. Can be an input or output. The drain pin is not overvoltage protected and shall remain within the recommended operating range.
DB 13 11 I/O Drain terminal B. Can be an input or output. The drain pin is not overvoltage protected and shall remain within the recommended operating range.
EN 2 20 I Active high logic enable (EN) pin. The pin has a 4-MΩ internal pull-down resistor. The device is disabled and all switches become high impedance when the pin is low. When the pin is high, the Ax logic inputs determine individual switch states. This pin can also be used together with the specific fault pin (SF) to indicate which input is under fault. For more details, see Section 9.4.3.
FF 11 9 O General fault flag. This pin is an open drain output and is asserted low when overvoltage condition is detected on any of the source (Sx) input pins. Connect this pin to an external supply (1.8 V to 5.5 V) through a 1-kΩ pull-up resistor.
GND 19 17 P Ground (0 V) reference
S1A 4 2 I/O Overvoltage protected source pin 1A. Can be an input or output.
S1B 17 15 I/O Overvoltage protected source pin 1B. Can be an input or output.
S2A 5 3 I/O Overvoltage protected source pin 2A. Can be an input or output.
S2B 16 14 I/O Overvoltage protected source pin 2B. Can be an input or output.
S3A 6 4 I/O Overvoltage protected source pin 3A. Can be an input or output.
S3B 15 13 I/O Overvoltage protected source pin 3B. Can be an input or output.
S4A 7 5 I/O Overvoltage protected source pin 4A. Can be an input or output.
S4B 14 12 I/O Overvoltage protected source pin 4B. Can be an input or output.
SF 10 8 O Specific fault flag. Table 9-2 provides how this pin is an open drain output and is asserted low when overvoltage condition is detected on a specific pin, depending on the state of A0, A1, and EN. Connect this pin to an external supply (1.8 V to 5.5 V) through a 1-kΩ pull-up resistor.
VDD 18 16 P Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VDD and GND.
VFN 9 7 P Negative fault voltage supply that determines the overvoltage protection triggering threshold on the negative side. Connect to VSS if the triggering threshold will be the same as the device's negative supply. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VFN and GND.
VFP 12 10 P Positive fault voltage supply that determines the overvoltage protection triggering threshold on the positive side. Connect to VDD if the triggering threshold will be the same as the device's positive supply. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VFP and GND.
VSS 3 1 P Negative power supply. This pin is the most negative power-supply potential. In single-supply applications, this pin can be connected to ground. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VSS and GND.
Thermal Pad Thermal pad. The thermal pad is not connected internally. It is recommended to tie the pad to GND or VSS for best performance.
I = input, O = output, I/O = input and output, P = power