SCDS404B March   2021  – November 2022 TMUX7411F , TMUX7412F , TMUX7413F

PRODMIX  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Thermal Information
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Electrical Characteristics: Global
    6. 7.6  ±15 V Dual Supply: Electrical Characteristics
    7. 7.7  ±20 V Dual Supply: Electrical Characteristics
    8. 7.8  12 V Single Supply: Electrical Characteristics
    9. 7.9  36 V Single Supply: Electrical Characteristics
    10. 7.10 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1  On-Resistance
    2. 8.2  Turn-On and Turn-Off Time
    3. 8.3  Off-Leakage Current
    4. 8.4  On-Leakage Current
    5. 8.5  Input and Output Leakage Current Under Overvoltage Fault
    6. 8.6  Fault Response Time
    7. 8.7  Fault Recovery Time
    8. 8.8  Fault Flag Response Time
    9. 8.9  Fault Flag Recovery Time
    10. 8.10 Charge Injection
    11. 8.11 Off Isolation
    12. 8.12 Inter-Channel Crosstalk
    13. 8.13 Bandwidth
    14. 8.14 THD + Noise
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Flat ON-Resistance
      2. 9.3.2 Protection Features
        1. 9.3.2.1 Input Voltage Tolerance
        2. 9.3.2.2 Powered-Off Protection
        3. 9.3.2.3 Fail-Safe Logic
        4. 9.3.2.4 Overvoltage Protection and Detection
        5. 9.3.2.5 ESD Protection
        6. 9.3.2.6 Latch-Up Immunity
        7. 9.3.2.7 EMC Protection
      3. 9.3.3 Overvoltage Fault Flags
      4. 9.3.4 Bidirectional Operation
    4. 9.4 Device Functional Modes
      1. 9.4.1 Normal Mode
      2. 9.4.2 Fault Mode
      3. 9.4.3 Truth Tables
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.2 Typical Application

The need to monitor remote sensors is common among factory automation control systems. For example, an analog input module or mixed module (AI, AO, DI, and DO) of a programmable logic controller (PLC) will interface to a field transmitter to monitor various process sensors at remote locations around the factory. A switch or multiplexer is often used to connect multiple inputs from the system and reduce the number of downstream channels.

There are a number of fault cases that may occur that can be damaging to many of the integrated circuits. Such fault conditions may include, but are not limited to, human error from wiring the connections incorrectly, component failure, wire shorts, electromagnetic interference (EMI), transient distrubances, and more.

Figure 10-1 Typical Application