SCDS435 September   2021 TMUX8108 , TMUX8109

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings: TMUX810x Devices
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information: TMUX810x
    4. 6.4  Recommended Operating Conditions: TMUX810x Devices
    5. 6.5  Electrical Characteristics (Global): TMUX810x Devices
    6. 6.6  Electrical Characteristics (±36-V Dual Supply)
    7. 6.7  Electrical Characteristics (72-V Single Supply)
    8. 6.8  Electrical Characteristics (100-V Single Supply)
    9. 6.9  Switching Characteristics: TMUX810x Devices
    10. 6.10 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1  Truth Tables
    2. 7.2  On-Resistance
    3. 7.3  Off-Leakage Current
    4. 7.4  On-Leakage Current
    5. 7.5  Break-Before-Make Delay
    6. 7.6  Enable Delay Time
      1. 7.6.1 Device Turn On Time
    7. 7.7  Transition Time
    8. 7.8  Charge Injection
    9. 7.9  Off Isolation
    10. 7.10 Crosstalk
    11. 7.11 Bandwidth
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Flat On - Resistance
      2. 8.3.2 Protection Features
        1. 8.3.2.1 Fail-Safe Logic
        2. 8.3.2.2 Latch-up Immunity
      3. 8.3.3 Bidirectional Operation
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Absolute Maximum Ratings: TMUX810x Devices

over operating free-air temperature range (unless otherwise noted)(1) (2) (3)
MIN MAX UNIT
VDD–VSS Supply voltage 110 V
VDD –0.5 110 V
VSS –110 0.5 V
VAx or VEN Logic control input pin voltage (Ax, EN) –0.5 50 V
IAx or IEN Logic control input pin current (Ax, EN) –30 30 mA
VS or VD Source or drain voltage (Sx, D) VSS–2 VDD+2 V
IS or ID (CONT) Source or drain continuous current (Sx, D) –30 30 mA
Tstg Storage temperature –65 150 °C
TJ Junction temperature 150 °C
Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
All voltages are with respect to ground, unless otherwise specified.