SCDS434 October   2021 TMUX8212

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings: TMUX821x Devices
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information
    4. 6.4  Recommended Operating Conditions: TMUX821x Devices
    5. 6.5  Electrical Characteristics (Global): TMUX821x Devices
    6. 6.6  Electrical Characteristics (±36-V Dual Supply)
    7. 6.7  Electrical Characteristics (72-V Single Supply)
    8. 6.8  Electrical Characteristics (100-V Single Supply)
    9. 6.9  Switching Characteristics: TMUX821x Devices
    10. 6.10 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 Truth Tables
    2. 7.2 On-Resistance
    3. 7.3 Off-Leakage Current
    4. 7.4 On-Leakage Current
    5. 7.5 Device Turn On Time
    6. 7.6 Charge Injection
    7. 7.7 Off Isolation
    8. 7.8 Crosstalk
    9. 7.9 Bandwidth
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Flat On - Resistance
      2. 8.3.2 Protection Features
        1. 8.3.2.1 Fail-Safe Logic
        2. 8.3.2.2 ESD Protection
        3. 8.3.2.3 Latch-Up Immunity
      3. 8.3.3 Bidirectional and Rail-to-Rail Operation
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Information

THERMAL METRIC(1) TMUX821x TMUX821x UNIT
PW (TSSOP) RUM (WQFN)
16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 96.0 TBD °C/W
RθJC(top) Junction-to-case (top) thermal resistance 26.8 TBD °C/W
RθJB Junction-to-board thermal resistance 42.7 TBD °C/W
ΨJT Junction-to-top characterization parameter 1.2 TBD °C/W
ΨJB Junction-to-board characterization parameter 42.0 TBD °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A TBD °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.