SLASEP7 May   2020 TMUXHS4212

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Application Use Cases
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 High-Speed Performance Parameters
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Output Enable and Power Savings
      2. 8.3.2 Data Line Biasing
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 USB3.2 implementation for USB Type-C
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 PCIe Lane Muxing
        1. 9.2.2.1 Application Curves
    3. 9.3 Systems Examples
      1. 9.3.1 USB/eSATA
      2. 9.3.2 MIPI Camera Serial Interface
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics

over operating free-air temperature and supply voltage range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ICC Device active current OEn = 0; 0 V ≤ VCM ≤ 1.8; SEL = 0 or VCC 180 250 µA
ISTDN Device shutdown current OEn = VCC 2 5 µA
CON Output ON capacitance to GND OEn = 0 0.6 pF
RON Output ON resistance 0 V ≤ VCM ≤ 1.8 V; IO = –8 mA 5 8.4 Ω
ΔRON On-resistance match between pairs for the same channel at same VCM, VCC and TA 0.5 Ω
RFLAT_ON On-resistance flatness RON(MAX) – RON(MIN) over VCM range for the same channel at same VCC and TA 0.75 Ω
IIH,CTRL Input high current, control pins (SEL, OEn) VIN = VCC 2 µA
IIL,CTRL Input low current, control pins (SEL, OEn) VIN = 0 V 1 µA
RCM,HS Common mode resistance to ground on Ax pins Each pin to GND 1.0 1.6
IIH,HS,SEL Input high current, high-speed pins [Ax/Bx/Cx][p/n] VIN = 1.8 V for selected port - A and B with SEL = 0, and A and C with SEL = VCC 8 µA
IIH,HS,NSEL Input high current, high-speed pins [Ax/Bx/Cx][p/n] VIN = 1.8 V for non-selected port - C with SEL = 0, and B with SEL = VCC(1) 150 µA
IIL,HS Input low current, high-speed pins [Ax/Bx/Cx][p/n] VIN = 0 V 1 µA
IHIZ,HS Leakage current through turned off switch between Ax[p/n] to [B]x[p/n] and [C]x[p/n] OEn = VCC; Ax[p/n] = 1.8 V, [B and C]x[p/n] = 0 V and Ax[p/n] = 0 V, [B and C]x[p/n] = 1.8 V 5 µA
RA,p2n DC Impedance between p and n for Ax pins OEn = 0 and VCC 20
There is a 20-kΩ pull-down in non-selected port.