SLASFM5 November   2024 TMUXHS4512

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 High-Speed Performance Parameters
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application - DisplayPort
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
    5. 8.5 Systems Examples
      1. 8.5.1 DisplayPort 1:2 Mulitplexing
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.1 Layout Guidelines

To ensure reliability of the device, the following commonly used printed circuit board layout guidelines are recommended:

  • Use decoupling capacitors between power supply pin and ground pin to ensure low impedance to reduce noise. To achieve a low impedance over a wide frequency range use capacitors with a high self-resonance frequency.
  • Place ESD and EMI protection devices (if used) as close as possible to the connector.
  • Use short trace lengths to avoid excessive loading.
  • Keep traces at least two times the trace width apart to minimize the effects of crosstalk on adjacent traces.
  • Separate high-speed signals from low-speed signals and digital from analog signals
  • Avoid right-angle bends in a trace and try to route them at least with two 45° corners.
  • Route the high-speed differential signal traces parallel to each other as much as possible. The traces are recommended to be symmetrical.
  • Place a solid ground plane next to the high-speed signal layer. This also provides an excellent low-inductance path for the return current flow.